• Title/Summary/Keyword: substrate thickness

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Precise Determination of the Complex Refractive Index and Thickness of a Very Weakly Absorbing Thin Film on a Semi-transparent Substrate Using Reflection Ellipsometry and Transmittance Analysis (반사 타원법과 투과율 분석법을 사용한 반투명 기층 위 매우 약한 광흡수 박막의 두께와 복소굴절률 정밀 결정)

  • Sang Youl Kim
    • Korean Journal of Optics and Photonics
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    • v.35 no.1
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    • pp.1-8
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    • 2024
  • Explicit expressions for the transmission pseudo-ellipsometric constants and transmittance of a semi-transparent glass substrate coated with thin films are presented to determine the optical constants of a very weakly absorbing thin film coated on a glass substrate. The intensity of the multiply reflected light inside the semi-transparent substrate is superposed incoherently and the light absorption by the substrate is properly treated, so that modeling analysis of thin films coated on a semi-transparent substrate can be performed with increased accuracy. The extinction coefficient derived from transmittance analysis is compared to that from ellipsometric analysis in the weakly absorbing region, and the difference between the two extinction coefficients is discussed in relation to the sensitivities of the transmittance and ellipsometric constants. This transmittance analysis, together with ellipsometric analysis, is applied to a glass substrate coated with a SiN thin film, and it is shown that the thickness and complex refractive index of the SiN thin film can be determined accurately, even though the extinction coefficient is very small.

Dependance of thickness on the properties of B doped ZnO:Ga (GZOB) thin film on glass substrate at room temperature (유리기판에 저온 증착한 GZOB 박막의 두께에 따른 특성 변화)

  • Yu, Hyun-Kyu;Lee, Kyu-Il;Lee, Jong-Hwan;Kang, Hyun-Il;Lee, Tae-Yong;Kim, Eung-Kwon;Song, Joon-Tae
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.88-88
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    • 2008
  • In this study, effect of thickness on structural, electrical and optical properties of B doped ZnO:Ga (GZOB) films was investigated. GZOB films were deposited on glass substrates by DC magnetron sputtering. The thickness range of films were from 100 nm to 600 nm to identified as increasing thickness, stress between substrate and GZOB film. The average transmittance of the films was over 80 % until 500 nm. Then a resistivity of $9.16\times10^{-4}\Omega$-cm was obtained. We presented that a GZOB film of 400 nm was optimization to obtain a high transmittance and conductivity.

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Dependance of thickness on the properties of B doped ZnO:Al (AZOB) thin film on polycarbonate (PC) substrate at room temperature (PC 기판에 저온 증착한 AZOB 박막의 두께에 따른 특성 변화)

  • Yu, Hyun-Kyu;Lee, Kyu-Il;Lee, Jong-Hwan;Kang, Hyun-Il;Lee, Tae-Yong;Oh, Su-Young;Song, Joon-Tae
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.138-138
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    • 2008
  • In this study, effect of thickness on structural, electrical and optical properties of B doped ZnO:Al (AZOB) films was investigated. AZOB films were deposited on PC substrates by DC magnetron sputtering. The thickness range of films were from 300 nm to 800 nm to identified as increasing thickness, stress between substrate and AZOB film. The. average transmittance of the films was over 80 % until 500 nm. Then a resistivity of $1.58\times10^{-3}\Omega$-cm was obtained. We presented that a AZOB film of 500 nm was optimization to obtain a high transmittance and conductivity.

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Tuning the Interference Color with PECVD Prepared DLC Thickness (PECVD를 이용한 DLC 두께 제어에 따른 간섭색 구현)

  • Park, Saebom;Kim, Kwangbae;Kim, Hojun;Kim, Chihwan;Choi, Hyun Woo;Song, Ohsung
    • Korean Journal of Materials Research
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    • v.31 no.7
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    • pp.403-408
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    • 2021
  • Various surface colors are predicted and implemented using the interference color generated by controlling the thickness of nano-level diamond like carbon (DLC) thin film. Samples having thicknesses of up to 385 nm and various interference colors are prepared using a single crystal silicon (100) substrate with changing processing times at low temperature by plasma-enhanced chemical vapor deposition. The thickness, surface roughness, color, phases, and anti-scratch performance under each condition are analyzed using a scanning electron microscope, colorimeter, micro-Raman device, and scratch tester. Coating with the same uniformity as the surface roughness of the substrate is possible over the entire experimental thickness range, and more than five different colors are implemented at this time. The color matched with the color predicted by the model, assuming only the reflection mode of the thin film. All the DLC thin films show constant D/G peak fraction without significant change, and have anti-scratch values of about 19 N. The results indicate the possibility that nano-level DLC thin films with various interference colors can be applied to exterior materials of actual mobile devices.

Temperature Dependence Change of Electrical Resistivity on PdHx Films due to Film Thickness Change (PdHx 박막의 두께 변화에 의한 전기비저항의 온도 의존성 변화)

  • Cho, Young-sin
    • Transactions of the Korean hydrogen and new energy society
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    • v.6 no.1
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    • pp.17-22
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    • 1995
  • Thermally evaporated Pd films on substrate were hydrogenated upto 1 bar of hydrogen gas at room temperature. Temperature dependence hange of electrical resistivity on Pd films is examined in the thickness range between $60{\AA}$ and $990{\AA}$. Resistivity of Pd is fitted well with Bloch-$Gr{\ddot{u}}neisen$ formula. Debye temperatures of Pd films are about 254 K, which are 20 K lower than that of bulk Pd. Debye temperature is not sensitive to film thickness change. Temperature of substrate during evaporation changes temperature dependence of resistivity of films much. Optical phonon contribution increases with decreasing temperature of PdHx.

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Effect of Screen Printing and Sintering Conditions on Properties of Thick Film Resistor on AlN Substrate (인쇄 및 소결조건이 AlN 기판용 후막저항체의 특성에 미치는 영향)

  • Koo, Bon Keup
    • Journal of the Korean Ceramic Society
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    • v.51 no.4
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    • pp.344-349
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    • 2014
  • $RuO_2$-based high frequency thick-film resistor paste was printed at the speed of 10, 100, 300 mm/sec on the AlN substrate, and then sintered at between 750 and $900^{\circ}C$. The sintered thick films were characterized in terms of printing and sintering conditions. With increasing printing speed, the thickness and roughness of sintered film increased. The resistance of the thick film resistor was reduced by increasing the printing speed from 10 to 100 mm/sec, but did not significantly change at 300 mm/sec speed. With increasing sintering temperature, the surface roughness and thickness of sintered resistor film decreased. The reduction rate was large in case of fast printed resistor. The resistance of the resistor increased up to $800^{\circ}C$ with sintering temperature, but again decreased at the higher sintering temperature.

Alumina Templates on Silicon Wafers with Hexagonally or Tetragonally Ordered Nanopore Arrays via Soft Lithography

  • Park, Man-Shik;Yu, Gui-Duk;Shin, Kyu-Soon
    • Bulletin of the Korean Chemical Society
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    • v.33 no.1
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    • pp.83-89
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    • 2012
  • Due to the potential importance and usefulness, usage of highly ordered nanoporous anodized aluminum oxide can be broadened in industry, when highly ordered anodized aluminum oxide can be placed on a substrate with controlled thickness. Here we report a facile route to highly ordered nanoporous alumina with the thickness of hundreds-of-nanometer on a silicon wafer substrate. Hexagonally or tetragonally ordered nanoporous alumina could be prepared by way of thermal imprinting, dry etching, and anodization. Adoption of reusable polymer soft molds enabled the control of the thickness of the highly ordered porous alumina. It also increased reproducibility of imprinting process and reduced the expense for mold production and pattern generation. As nanoporous alumina templates are mechanically and thermally stable, we expect that the simple and costeffective fabrication through our method would be highly applicable in electronics industry.

Extraction of Exact Layer Thickness of Ultra-thin Gate Dielectrics in Nanoscaled CMOS under Strong Inversion

  • Dey, Munmun;Chattopadhyay, Sanatan
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.10 no.2
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    • pp.100-106
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    • 2010
  • The impact of surface quantization on device parameters of a Si metal oxide semiconductor (MOS) capacitor has been analyzed in the present work. Variation of conduction band bending, position of discrete energy states, variation of surface potential, and the variation of inversion carrier concentration at charge centroid have been analyzed for different gate voltages, substrate doping concentrations and oxide thicknesses. Oxide thickness calculated from the experimental C-V data of a MOS capacitor is different from the actual oxide thickness, since such data include the effect of surface quantization. A correction factor has been developed considering the effect of charge centroid in presence of surface quantization at strong inversion and it has been observed that the correction due to surface quantization is crucial for highly doped substrate with thinner gate oxide.

ITO Films Deposited by Sputter Method of Powder Target at Room Temperature. (상온에서 분말타겟의 스퍼터에 의해 증착된 ITO박막)

  • 김현후;이재형;신성호;신재혁;박광자
    • Journal of the Korean institute of surface engineering
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    • v.33 no.5
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    • pp.349-355
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    • 2000
  • Indium tin oxide (ITO) thin films have been deposited on PET (polyethylene terephthalate) and glass substrates by a do magnetron sputter method of powder target without heat treatments such as substrate heater and post heat treatment. During the sputtering deposition, sputtering parameters such as sputtering power, working pressure, oxygen gas mixture, film thickness and substrate-target distance are important factors for the high quality of ITO thin films. The structural, electrical and optical properties of as-deposited ITO oxide films are investigated by sputtering power, oxygen partial pressure and films thickness among the several sputtering conditions. XRD patterns of ITO films are affected by sputtering power and pressure. As the power and pressure are increased, (411) and (422) peaks of ITO films are grown strongly. Electrical resistivity is also increased, as the sputtering power and pressure are increased. Transmittance of ITO thin films in the visible light ranges is lowered with an increase of sputtering power and film thickness. Reflectance of ITO films in infra-red region is decreased, as the power and pressure is increased.

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