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http://dx.doi.org/10.5012/bkcs.2012.33.1.83

Alumina Templates on Silicon Wafers with Hexagonally or Tetragonally Ordered Nanopore Arrays via Soft Lithography  

Park, Man-Shik (Department of Chemical and Biological Engineering, Seoul National University)
Yu, Gui-Duk (Department of Chemical and Biological Engineering, Seoul National University)
Shin, Kyu-Soon (Department of Chemical and Biological Engineering, Seoul National University)
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Abstract
Due to the potential importance and usefulness, usage of highly ordered nanoporous anodized aluminum oxide can be broadened in industry, when highly ordered anodized aluminum oxide can be placed on a substrate with controlled thickness. Here we report a facile route to highly ordered nanoporous alumina with the thickness of hundreds-of-nanometer on a silicon wafer substrate. Hexagonally or tetragonally ordered nanoporous alumina could be prepared by way of thermal imprinting, dry etching, and anodization. Adoption of reusable polymer soft molds enabled the control of the thickness of the highly ordered porous alumina. It also increased reproducibility of imprinting process and reduced the expense for mold production and pattern generation. As nanoporous alumina templates are mechanically and thermally stable, we expect that the simple and costeffective fabrication through our method would be highly applicable in electronics industry.
Keywords
Imprint lithography; AAO; Self-assembly; Anodization; Electroplating;
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1 Tsou, P. H.; Sreenivasappa, H.; Hong, S.; Yasuike, M.; Miyamoto, H.; Nakano, K.; Misawa, T.; Kameoka, J. Biosens. Bioelectron. 2010, 26, 289.   DOI   ScienceOn
2 Byun, J.; Lee, J. I.; Kwon, S.; Jeon, G.; Kim, J. K. Adv. Mater. 2010, 22, 2028.   DOI   ScienceOn
3 Lee, K. J.; Min, S. H.; Jang, J. Small 2008, 4, 1945.   DOI   ScienceOn
4 Massuyeau, F.; Duvail, J.; Athalin, H.; Lorcy, J.; Lefrant, S.; Wery, J.; Faulques, E. Nanotechnology 2009, 20, 155701.   DOI   ScienceOn
5 Masuda, H.; Fukuda, K. Science 1995, 268, 1466.   DOI   ScienceOn
6 Masuda, H.; Asoh, H.; Watanabe, M.; Nishio, K.; Nakao, M.; Tamamura, T. Adv. Mater. 2001, 13, 189.   DOI   ScienceOn
7 Yanagishita, T.; Nishio, K.; Masuda, H. Adv. Mater. 2005, 17, 2241.   DOI   ScienceOn
8 Krausch, G.; Magerle, R. Adv. Mater. 2002, 14, 1579.   DOI   ScienceOn
9 Yang, S. M.; Jang, S. G.; Choi, D. G.; Kim, S.; Yu, H. K. Small 2006, 2, 458.   DOI   ScienceOn
10 Vieu, C.; Carcenac, F.; Pepin, A.; Chen, Y.; Mejias, M.; Lebib, A.; Manin-Ferlazzo, L.; Couraud, L.; Launois, H. Appl. Surf. Sci. 2000, 164, 111.   DOI   ScienceOn
11 Li, A.; Muller, F.; Birner, A.; Nielsch, K.; Gosele, U. J. Appl. Phys. 1998, 84, 6023.   DOI   ScienceOn
12 Losic, D.; Lillo, M.; Losic, D., Jr. Small 2009, 5, 1392.   DOI   ScienceOn
13 Jessensky, O.; Muller, F.; Gosele, U. Appl. Phys. Lett. 1998, 72, 1173.   DOI   ScienceOn
14 Masuda, H.; Satoh, M. Jpn. J. Appl. Phys., Part 2 1996, 35, L126.   DOI   ScienceOn
15 Lee, W.; Ji, R.; Ross, C. A.; Gosele, U.; Nielsch, K. Small 2006, 2, 978.   DOI   ScienceOn
16 Kang, Y.; Walish, J. J.; Gorishnyy, T.; Thomas, E. L. Nat. Mater. 2007, 6, 957.   DOI   ScienceOn
17 Maria Chong, A. S.; Tan, L. K.; Deng, J.; Gao, H. Adv. Funct. Mater. 2007, 17, 1629.   DOI   ScienceOn
18 Lipson, A.; Comstock, D.; Hersam, M. Small 2009, 5, 2807.   DOI   ScienceOn
19 Masuda, H.; Yamada, H.; Satoh, M.; Asoh, H.; Nakao, M.; Tamamura, T. Appl. Phys. Lett. 1997, 71, 2770.   DOI   ScienceOn
20 Matsui, Y.; Nishio, K.; Masuda, H. Small 2006, 2, 522.   DOI   ScienceOn
21 Nasir, M. E.; Allsopp, D. W. E.; Bowen, C. R.; Hubbard, G.; Parsons, K. P. Nanotechnology 2010, 21, 105303.   DOI   ScienceOn
22 Chou, S. Y.; Krauss, P. R.; Renstrom, P. J. Science 1996, 272, 85.   DOI   ScienceOn
23 Park, S. H.; Kim, S.; Lee, D. J.; Yun, S.; Khim, Z. G.; Kim, K. B. J. Electrochem. Soc. 2009, 156, K181.   DOI   ScienceOn
24 Felhosi, I.; Habazaki, H.; Shimizu, K.; Skeldon, P.; Thompson, G.; Wood, G.; Zhou, X. Corros. Sci. 1998, 40, 2125.   DOI   ScienceOn
25 Lee, M. J.; Lee, N. Y.; Lim, J. R.; Kim, J. B.; Kim, M.; Baik, H. K.; Kim, Y. S. Adv. Mater. 2006, 18, 3115.   DOI   ScienceOn
26 Choi, S. J.; Yoo, P. J.; Baek, S. J.; Kim, T. W.; Lee, H. H. J. Am. Chem. Soc. 2004, 126, 7744.   DOI   ScienceOn
27 Fujiwara, Y.; Enomoto, H. Surf. Coat. Tech. 1988, 35, 101.   DOI   ScienceOn
28 Xu, C.; Gao, W. Mater. Res. Innov. 2000, 3, 231.   DOI   ScienceOn
29 Foong, T. R. B.; Sellinger, A.; Hu, X. ACS nano 2008, 2, 2250.   DOI   ScienceOn
30 Mozalev, A.; Khatko, V.; Bittencourt, C.; Hassel, A. W.; Gorokh, G.; Llobet, E.; Correig, X. Chem. Mater. 2008, 20, 6482.   DOI   ScienceOn
31 Zhao, G. Y.; Xu, C. L.; Li, H. L. J. Power Sources 2007, 163, 1132.   DOI   ScienceOn
32 deHeer, W. A.; Bonard, J. M.; Fauth, K.; Chatelain, A.; Forro, L.; Ugarte, D. Adv. Mater. 1997, 9, 87.   DOI   ScienceOn
33 Masuda, H.; Yamada, M.; Matsumoto, F.; Yokoyama, S.; Mashiko, S.; Nakao, M.; Nishio, K. Adv. Mater. 2006, 18, 213.   DOI   ScienceOn
34 Thurn-Albrecht, T.; Schotter, J.; Kastle, C. A.; Emley, N.; Shibauchi, T.; Krusin-Elbaum, L.; Guarini, K.; Black, C. T.; Tuominen, M. T.; Russell, T. P. Science 2000, 290, 2126.   DOI   ScienceOn