• Journal of the Korean Society for Precision Engineering
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• v.16 no.4 s.97
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• pp.197-204
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• 1999

The boundary element method was used for studying singularities of an interface crack with contact zones. The iterative procedure is applied to estimate the contact zone size. Because the contact zone size was extremely small in a tension field, a large number of Gaussian points were used for numerical integration of the Kernels. Stress extrapolation method and J-integral were used ofr determining stress intensity factors. When the interface crack was assumed to have opened tips, oscillatory singularities appear near the tips of the interface crack. But the interface crack with contact zone which Comninou suggested had no oscillatory behavior. The contact zone size under shear loading was much larger than that under tensile. The stress intensity factors computed by stress extrapolation method were close to those of Comninou's solution. And the stress intensity factor evaluated by J-integral was similar to that by stress extrapolation method.

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.286-291
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• 2001

Applications of bonded dissimilar materials such as IC package, ceramic/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edges in bonded joints of dissimilar materials. In orer to understand the package crack emanating from the edge of Die pad and Resin, fracture mechanics of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method. Crack propagation angle and path by thermal stress were numerically simulated with boundary element method.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.11
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• pp.2277-2286
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• 2002

The application of bonded dissimilar materials to industries as automobiles, aircraft, rolling stocks, electronic devices and engineering structures is increasing gradually because these materials, compared to the homogeneous materials, have many advantages for material properties. In spite of such wide applications of bonded dissimilar materials, the evaluation method of quantitative strength considering the stress singularities for its bonded interface has not been established clearly. In this paper, the stress singularity for Bctors and the stress intensity factors were analyzed by boundary element method(BEM) for the scarf joints of Al/Epoxy with and without a crack, respectively. From static fracture experiments of the bonded scarf joints, a fracture criterion and a evaluation method of interface strength in bonded dissimilar materials were proposed and discussed.

• Honam Mathematical Journal
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• v.40 no.4
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• pp.785-794
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• 2018

In [8] they introduced a new finite element method for accurate numerical solutions of Poisson equations with corner singularities. They consider the Poisson equations with homogeneous Dirichlet boundary condition with one corner singularity at the origin, and compute the finite element solution using standard FEM and use the extraction formula to compute the stress intensity factor, then pose a PDE with a regular solution by imposing the nonhomogeneous boundary condition using the computed stress intensity factor, which converges with optimal speed. From the solution they could get an accurate solution just by adding the singular part. This approach uses the polar coordinate and the cut-off function to control the singularity and the boundary condition. In this paper we consider Poisson equations with multiple singular points, which involves different cut-off functions which might overlaps together and shows the way of cording in FreeFEM++ to control the singular functions and cut-off functions with numerical experiments.

• Transactions of the Korean Society of Mechanical Engineers
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• v.17 no.10
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• pp.2398-2406
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• 1993

Abdi's numerical method(ref.13) for representing a stress singularity by shifting the mid-side nodes of isoparametric elements is reviewed. A simple technique to obtain the optimal position of the mid-side nodes in quadratic isoparametric finite element is presented. From this technique we can directly obtain the position of the side-nodes adjacent to the crack tip. It is also observed that the present technique provides good accuracy for the expression of the opening displacement and the determination of the mid-side nodes for more wide range of material properties than that obtained by Abdicant the finite element method is applied to determine stress intensity factors for pressurized crack perpendicular to and terminating at the interface of two bonded dissimilar materials. A proper definition for stress intensity factors of a crack perpendicular to bimaterial interface is provided. It is based upon a near-tip displacement solutions on the crack surface for interface crack between two dissimilar materials. Numerical testing is carried out with the eight-node and six-node elements. The results obtained are compared with the previous solutions.

• Structural Engineering and Mechanics
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• v.14 no.5
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• pp.565-574
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• 2002

This paper presents a method for predicting premature separation of carbon fiber reinforced plastic (CFRP) plates from strengthened steel beams. The fracture criterion based on material-induced singularity is formulated in terms of a singular intensity factor. Static test on double strap joints was selected to provide the critical stress intensity factor in the criterion because good degree of accuracy and consistency of experimental data can be expected compared with the unsymmetrically loaded single lap joints. The debond/separation loads of steel beams with different CFRP lengths were measured and compared with those predicted from the criterion. Good agreement between the test results and the prediction was found.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.22 no.1
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• pp.206-214
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• 1998

When a crack meets bimaterial interface stress singularity depends on the elastic constants of the adjacent materials. In the present study we are going to describe the finite element formulation for problems with a crack to be embedded in the stiffer material$({\mu}_2/{\mu}_1)$. The cubic isoparametric singular element, represented by adequately shifting the mid-side nodes adjacent to the crack tip is constructed to enclose the crack tip. An alternative method to obtain the optimal position of the mid-side nodes of cubic isoparametric elements is presented. In addition, a proper definition for the stress intensity factors of a crack normal to bimaterial interface is provided. It is based upon near a tip displacement solutions. Models for numerical analysis are two dimensional elastic bodies with a through crack under plain strain. The results obtained are compared with the previous solutions.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2002.10a
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• pp.112-119
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• 2002

In this paper, an Extended Finite Element Method is proposed by adding discontinuity and singularity enrichment functions to the standard FEM approximation. In this method, the singularity and the discontinuity of the crack are efficiently modeled by using initial regular mesh without refining mesh near the crack tip, so that it enables express the asymptotic stress field near crack tip and crack surface successfully. The developed method was verified by evaluating crack tip stress profile and stress intensity factor of mode Ⅰ/mode Ⅱ fracture problems and the results showed the effectiveness and robustness for fracture problem.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.12a
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• pp.146-153
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• 2003

This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate subjected to the combined influence of temperature change and moisture absorption. A boundary element analysis is employed to investigate the behavior of interface stresses. The film is assumed to be thermorheologically simple. It is further assumed that moisture effects are analogous to thermal effects. Numerical results are presented for a given viscoelastic model, indicating the singular residual stresses induced during cooling down from the curing temperature, and how they can be altered by subsequent moisture absorption at room temperature.

• Journal of the Semiconductor & Display Technology
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• v.9 no.3
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• pp.35-39
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• 2010

Interfacial stress singularity induced in an analysis model consisting of the polymeric thin film and the elastic substrate has been investigated using the boundary element method. The interfacial singular stresses between the viscoelastic thin film and the elastic substrate subjected to a uniform moisture ingression are investigated for the case of a small interfacial edge crack. It is assumed that moisture effects are assumed to be analogous to thermal effects. Then, the overall stress intensity factor for the case of a small interfacial edge crack is computed. The numerical procedure does not permit calculation of the limiting case for which the edge crack length vanishes.