• Journal of The Korean Society of Integrative Medicine
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• v.9 no.1
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• pp.23-31
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• 2021

Purpose : To compare the immediate effects of air stacking maneuver using resuscitator bags and balloons. Methods : Twenty healthy young adults participated in this study. Forced vital capacity (FVC) and peak cough flow (PCF) tests were performed at pre-intervention, and then, the maximum insufflation capacity (MIC), forced expiratory volume in 1 s (FEV1), FEV1/FVC, peak expiratory flow (PEF), and peak cough flow (PCF) were measured using the air stacking maneuver via resuscitator bags and balloons. Interventions were randomly performed, and a 40-min break was provided between interventions. The evaluation process in this study was conducted in accordance with the guidelines of the American Thoracic Society (ATS) 2019. To compare the three outcomes measured at pre-and post-interventions, repeated measures analysis of variance was performed. Results : A significant difference was found in the MIC, FEV1, PEF, and PCF after the air stacking maneuver using resuscitator bags and balloons, whereas no significant difference was observed between resuscitator bags and balloons. Conclusion : No significant difference was found in the immediate effect of the air stacking maneuver using resuscitator bags and balloons in this study. Air stacking maneuver using balloons can increase the success rate of the techniques by providing visual feedback on the amount of air insufflation when performed with balloon blowing exercise. Balloons are cheaper and easier to buy compared to manual resuscitator bags; therefore, education on the air stacking maneuver using balloons will have a positive effect on pulmonary rehabilitation.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.10 no.5
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• pp.45-52
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• 2001

In order to increase the productivity of electrical parts, manufacturing processes using progressive dies have been widely used in the industry. Motor cores have been fabricated using progressive stacking die with the lamination procedure for better electro-magnetic property. For the proper design off process, a prediction of the process is required to obtain many design parameters. In this work, rigid-plastic finite element analysis is carried out in order to simulate the lamination process of the motor core. The effects of the embossing depth, the amount of deviation, and the number of stacked sheets are investigated and compared with experiments. The forming process can then be predicted successfully from the results of analyses, which enables an appropriate design to be made for the die and the process.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.15 no.2
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• pp.45-50
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• 2005

During oxidation process, several type of defects are formed on the surface of the silicon crystal which was damaged mechanically before oxidation. As the size of abrasive particle increases multiple dislocation loops are produced favorably over oxidation-induced stacking faults, which are dominantly produced when ground with finer abrasive particle. These defects are not related with the crystal growth process like Czochralski or directional solidification. During directional solidification process, twins and stacking faults are the two major defects observed in the bulk of the silicon crystal. On the other hand, slip dislocations produced by the thermal stress are not observed. Thus, not only in single crystalline silicon crystal but also in multi-crystalline silicon, extrinsic gettering process with programmed production of surface defects might be highly applicable to silicon wafers for purification.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.10
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• pp.865-871
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• 2014

Paradigm shift to 3-D chip stacking in electronic packaging has induced a lot of integration challenges due to the reduction in wafer thickness and pitch size. This study presents a hybrid bonding technology by self-alignment effect in order to improve the flip chip bonding accuracy with ultra-thin wafer. Optimization of Cu pillar bump formation and evaluation of various factors on self-alignment effect was performed. As a result, highly-improved bonding accuracy of thin wafer with a $50{\mu}m$ of thickness was achieved without solder bridging or bump misalignment by applying reflow process after thermo-compression bonding process. Reflow process caused the inherently-misaligned micro-bump to be aligned due to the interface tension between Si die and solder bump. Control of solder bump volume with respect to the chip dimension was the critical factor for self-alignment effect. This study indicated that bump design for 3D packaging could be tuned for the improvement of micro-bonding quality.

• Design & Manufacturing
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• v.12 no.3
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• pp.19-24
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• 2018

Fused deposition Modeling (FDM) is one of the most widely used for the prototype of parts at ease. The FDM 3D printing method is a lamination manufacturing method that the resin is melted at a high temperature and piled up one by one. Another term is also referred to as FFF (Fused Filament Fabrication). 3D printing technology is mainly used only in the area of prototype production, not in production of commercial products. Therefore, if FDM 3D printer is applied to the product process of commercial products when considered, the strength and dimensional accuracy of the manufactured product is expected to be important. In this study, the mechanical properties of parts made by 3D printing with FDM method were investigated. The aim of this work is to examine how the mechanical properties of the FDM parts, by changing of processing FDM printing direction and the height of stacking layer is affected. The effect of the lamination direction and the height of the stacking layer, which are set as variables in the lamination process, by using the tensile specimen and impact specimen after the FDM manufacturing process were investigated and analyzed. The PLA (Poly Lactic Acid) was used as the filament materials for the 3D printing.

• Journal of the Korea Institute of Military Science and Technology
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• v.23 no.6
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• pp.574-581
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• 2020

This paper describes the stacking effect for Ceramic Column Grid Array(CCGA) packages used for satellites. Reflow Soldering Process suitable for CCGA package with back structure was set as the process development goal to meet European Cooperation for Space Standardization(ECSS) standard. After analyzing the stacking effect according to the type of CCGA, it is verified by applying it to the CCGA Reflow Soldering Process. In order to confirm the validity of the staking effect analyzed in terms of vibration and thermal characteristics, it is verified through actual specimen production. It analyzes the cause of crack occurrence in the CCGA package and estimates the crack generation point using previously acquired inspection data.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.37-41
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• 2012

The wafer level stacking with Cu-to-Cu bonding becomes an important technology for high density DRAM stacking, high performance logic stacking, or heterogeneous chip stacking. Cu CMP becomes one of key processes to be developed for optimized Cu bonding process. For the ultra low-k dielectrics used in the advanced logic applications, Ti barrier has been preferred due to its good compatibility with porous ultra low-K dielectrics. But since Ti is electrochemically reactive to Cu CMP slurries, it leads to a new challenge to Cu CMP. In this study Ti barrier/Cu interconnection structure has been investigated for the wafer level 3D integration. Cu CMP wafers have been fabricated by a damascene process and two types of slurry were compared. The slurry selectivity to $SiO_2$ and Ti and removal rate were measured. The effect of metal line width and metal density were evaluated.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.98-100
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• 2008

A series of new channel materials using triisopropylsilylethynyl anthracene(TIPSAN) derivatives are synthesized by well known reaction. The TIPSAN derivatives exhibit an excellent field-effect mobility with hole mobility as high as 0.1 cm2V-1s-1 by solution-process and slip stack structure of core and end groups with short $\pi-\pi$ stacking distance of $3.525{\sim}3.485\;{\AA}$ by single crystal structures.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.4
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• pp.107-113
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• 2022

At present, it is possible to manufacture electrodes down to several micrometers (~ ㎛) using inkjet printing technology owing to the development of precision ejection heads. Inkjet printing technology is also used in the manufacturing of bio-sensors, electronic sensors, and flexible displays. To reduce the difference between the electrode design/simulation performance and actual printing pattern performance, it is necessary to analyze and optimize the processable area of the ink material, which is a fluid. In this study, process optimization was conducted to manufacture an IDE pattern and fabricate an impedance sensor. A total of 25 IDE patterns were produced, with five for each lamination process. Electrode line width and height changes were measured by stacking the designed IDE pattern with a nanoparticle-based conductive ink multilayer. Furthermore, the optimal process area for securing a performance close to the design result was analyzed through impedance and capacitance. It was observed that the increase in the height of stack layer 4 was the lowest at 4.106%, and the increase in capacitance was measured to be the highest at 44.08%. The proposed stacking process pattern, which is optimized in terms of uniformity, reproducibility, and performance, can be efficiently applied to bio-applications such as biomaterial sensing with an impedance sensor.

• Journal of the Korean Chemical Society
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• v.38 no.12
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• pp.857-863
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• 1994

The absorption and fluorescence spectroscopic studies on the interaction between thionine (TH) and sodium dodecyl sulfate (SDS) have been carried out. The absorption and fluorescence spectral changes of TH with the changes of concentration of SDS are interpreted in terms of i) the aggregation of TH-SDS complex, ii) the stacking process of dye molecules by the association of the TH-SDS complex, iii) breakdown of the stacking due to the formation of dye-rich induced micelles, iv) redistribution of dye molecules in the surface of SDS micelles.