• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.18 no.4
• /
• pp.100-108
• /
• 2019

In this paper, a new stacked element pressure sensor has proposed for heartbeat and respiration measurement. This device can be directly attached to an individual's chest; heartbeat and respiration are detected by the pulsatile vibration and deformation of the chest. A key feature of the device is the simultaneous measurement of heart rate and respiration. The structure of the sensor consists of two stacked elements, in which one element includes one polyvinylidene fluoride (PVDF) thin film bonded on polydimethylsiloxane (PDMS) substrate. In addition, for the measurement and signal processing, the electric circuit and the filter are simply constructed with an OP-amp, resistance, and a capacitor. One element (element1, PDMS) maximizes the respiration signal; the other (element2, PVDF) is used to measure heartbeat. Element1 and element2 had sensitivity of 0.163V/N and 0.209V/N, respectively, and element2 showed improved characteristics compared with element1 in response to force. Thus, element1 and element2 were optimized for measuring respiration heart rate, respectively. Through mechanical and vivo human tests, this sensor shows the great potential to optimize the signals of heartbeat and respiration compared with commercial devices. Moreover, the proposed sensor is flexible, light weight, and low cost. All of these characteristics illustrate an effective piezoelectric pressure sensor for heartbeat and respiration measurements.

• Journal of Sensor Science and Technology
• /
• v.6 no.1
• /
• pp.63-71
• /
• 1997

The thin-film eletroluminescent (TFEL) device having the stacked structure of ZnS:Mn/$ZnS:TbF_{3}$ has been fabricated. Insulate layers used (Pb,La)$TiO_{3}$ and $SiO_{2}$ thin films. The emission color was white. The TFEL device employing ZnS:Mn/$ZnS:TbF_{3}(8000{\AA})$ stacked phosphor layers showed the threshold voltage of $78V_{rms}$. And the brightness of the TFEL device was $400{\mu}W/cm^{2}$ at the applied voltage of $100V_{rms}$. The emission spectrum of TFEL device had a wavelength from 450nm to 620nm. The manufactured devices can be a practical use as a TFEL devices of red, green and blue by using the color filters.

• Journal of Sensor Science and Technology
• /
• v.3 no.1
• /
• pp.78-82
• /
• 1994

Single-phase $CuInS_{2}$ thin film were prepared by E-beam deposition and the effects of its annealing were investigated. The S/In/Cu was stacked from S, In and Cu by EBE method and then, In the nitrogen atmosphere, the stacked layer were annealed to convert chalcopyrite $CuInS_{2}$ thin films. and that result we obtained p-type Chalcopyrite $CuInS_{2}$ thin films, Its resistivity was $0.03{\sim}0.007{\Omega}cm$, Hall mobility was $0.07{\sim}0.1cm^{2}V^{-1}S^{-1}$ and Hall concentration was $10^{20-21}cm^{-3}$, respectively.

• Progress in Superconductivity and Cryogenics
• /
• v.14 no.1
• /
• pp.4-7
• /
• 2012

Coated conductors have been developed to increase piece length and critical current for electric power applications. Otherwise, Many efforts were carried out to reduce AC loss of coated conductor for AC applications. Twisting and cabling processes are effective to reduce AC loss but, these processes can not be applied for tape shaped coated conductor. It is inevitable to have thin rectangular shape because coated conductor is fabricated by thin film deposition process on metal substrate. In this study, round shape superconducting wire was first fabricated using coated conductors. First of all, Ag coated conductor was used. coated conductor was slitted to several wires with narrow width below 1mm. 12ea slitted wires were parallel stacked on top of another until making up the square cross-section. The bundle of coated conductors was heat treated to stick on each other by diffusion bonding and then copper plated to make round shape wire. Critical current of round wire was measured 185A at 77K, self field.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.21 no.9
• /
• pp.1-11
• /
• 2022

Recently, there has been continuous technological development in the semiconductor industry, and semiconductor manufacturing technologies are being advanced and highly integrated. For this reason, ceramic material having excellent heat resistance, wear resistance, and conductivity are used as components in semiconductor manufacturing. Among them, the probe card's space transformer is used as ceramic material to prevent electronic signal noise during the electrical die sorting of semiconductor function testing. However, implementing a bulk-type space transformer with a thickness of 5.6 mm or more is challenging, and thus it is produced in a structure with a stacked ceramic film. The stacked space transformer has low productivity because it is difficult to ensure hole clogging and a precise shape. In this research, an ultrasonic horn is designed to manufacture a bulk-type ceramic space transformer through ultrasonic drilling. Vibration characteristics were analyzed according to the ultrasonic horn, and the natural frequency was measured.

• Transactions on Electrical and Electronic Materials
• /
• v.11 no.2
• /
• pp.73-76
• /
• 2010

The copper indium disulfide ($CuInS_2$) thin film was manufactured using sputtering and thermal evaporation methods, and the annealing with sulfurization process was used in the vacuum chamber to the substrate temperature on the glass substrate, the annealing temperature and the composition ratio, and the characteristics thereof were investigated. The $CuInS_2$ thin film was manufactured by the sulfurization of a soda lime glass (SLG) Cu/In/S stacked [1] elemental layer deposited on a glass substrate by vacuum chamber annealing [2] with sulfurization for various times at a temperature of substrate temperature of $200^{\circ}C$. The structure and electrical properties of the film was measured in order to determine the optimum conditions for the growth of $CuInS_2$ ternary compound semiconductor $CuInS_2$ thin films with a non-stoichiometric composition. The physical properties of the thin film were investigated under various fabrication conditions [3,4], including the substrate temperature, annealing temperature and annealing time by X-ray diffraction (XRD), field Emission scanning electron microscope (FE-SEM), and Hall measurement systems. [5] The sputtering rate depending upon the DC/RF power was controlled so that the composition ratio of Cu versus In might be around 1:1, and the substrate temperature affecting the quality of the film was varied in the range of room temperature (RT) to $300^{\circ}C$ at intervals of $100^{\circ}C$, and the annealing temperature of the thin film was varied RT to $550^{\circ}C$ in intervals of $100^{\circ}C$.

• Journal of Powder Materials
• /
• v.23 no.5
• /
• pp.379-383
• /
• 2016

A thick film of $Li_7La_3Zr_2O_{12}$ (LLZO) solid-state electrolyte is fabricated using the tape casting process and is compared to a bulk specimen in terms of the density, microstructure, and ion conductivity. The final thickness of LLZO film after sintering is $240{\mu}m$ which is stacked up with four sheets of LLZO green films including polymeric binders. The relative density of the LLZO film is 83%, which is almost the same as that of the bulk specimen. The ion conductivity of a LLZO thick film is $2.81{\times}10^{-4}S/cm$, which is also similar to that of the bulk specimen, $2.54{\times}10^{-4}S/cm$. However, the microstructure shows a large difference in the grain size between the thick film and the bulk specimen. Although the grain boundary area is different between the thick film and the bulk specimen, the fact that both the ion conductivities are very similar means that no secondary phase exists at the grain boundary, which is thought to originate from nonstoichiometry or contamination.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.21 no.1
• /
• pp.8-13
• /
• 2020

Stress is the main cause of warpage failure of very thin substrates with thickness of several hundred ㎛, such as IC packages. Stress usually results from differences in crystal structures and corresponding thermal expansion coefficients when depositing different substances on a substrate. In this study, the behaviors of stress occurring in substrates were numerically analyzed by the thin-film pattern of the rectangles stacked on the substrates. First, the substrate displacement was obtained and the substrate strain and stress were obtained using it. When the tensile force is concentrated at the edge of the thin film pattern, normal and shear stresses are generated around the edge of the thin film pattern. Normal stress occurs near the edges of the thin film pattern and the vertexes. Shear stress also occurs around the edge of the thin film pattern, but unlike normal stress, it does not appear near the vertexes. It was also confirmed that the magnitude and direction of shear stress are changed around the edge. When edge forces of thin-film pattern are equal, the normal stress was about 10 times larger than the shear stress. This indicates that normal stress is the biggest cause of warpage failure.

• Journal of Sensor Science and Technology
• /
• v.1 no.2
• /
• pp.117-123
• /
• 1992

$Pt-SnO_{2-x}$ thin film sensing devices has been fabricated by thermal oxidation of stacked Pt-Sn thin film on the heater. The thickness of Sn thin film deposited by thermal evaporation was $4000{\AA}$ and the thickness of Pt deposited by D. C. sputtering on Sn thin film was $14{\sim}71{\AA}$ range. The XRD analysis show that the $Pt-SnO_{2-x}$ thin films are formed by grains with a diameter of about $200{\AA}$ randomly connected and the crystalline phase of the thin films are preferentally oriented in the (110) direction. $Pt-SnO_{2-x}$ thin film device (Pt thickness : $43{\AA}$) to 6000 ppm CO shows the sensitivity of 80% and high selectivity to CO. And the operating temperature and the thermal oxidation temperature of $Pt-SnO_{2-x}$ thin film device with high sensitivity to CO were $200^{\circ}C$ and $500^{\circ}C$, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2002.07a
• /
• pp.305-309
• /
• 2002

We have successfully fabricated a Metal-Ferroelectric-Insulator-Semiconductor (MFIS) structure using Bi$\sub$4-x/La$\sub$x/Ti$_3$O$\sub$12/ (BLT) ferroelectric thin film and SiO$_2$/Nitride/SiO$_2$ (ONO) stacked buffer layers for single transistor type ferroelectric nonvolatile memory applications. BLT films were deposited on 15 nm-thick ONO buffer layer by sol-gel spin-coating. The dielectric constant and the leakage current density of prepared ONO film were measured to be 5.6 and 1.0 x 10$\^$-8/ A/$\textrm{cm}^2$ at 2MV/cm, respectively, It was interesting to note that the crystallographic orientations of BLT thin films were strongly effected by pre-bake temperatures. X-ray diffraction patterns showed that (117) crystallites were mainly detected in the BLT film if pre-baked below 400$^{\circ}C$. Whereas, for the films pre-baked above 500$^{\circ}C$, the crystallites with preferred c-axis orientation were mainly detected. From the C-V measurement of the MFIS capacitor with c-axis oriented BLT films, the memory window of 0.6 V was obtained at a voltage sweep of ${\pm}$8 V, which evidently reflects the ferroelectric memory effect of a BLT/ONO/Si structure.