• 제목/요약/키워드: sintering process

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The Study of Degradation Mechanism as ZnO Varistor with The Ambient Sintering-Process (분위기 소결공정에 의한 ZnO 바리스터의 열화기구 연구)

  • 소순진;김영진;최운식;박춘배
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.11a
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    • pp.117-120
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    • 1999
  • The relationship between the DC degradation characteristics of the ZnO varistor and the ambient sintering-process is investigated in this study. ZnO varistors made of Matsuoka's composition were fabricated by standard ceramic techniques. The ambient sintering-process is performed at the extraordinary electrical-furnace which is equipped with the vacuum system. The Gas of sintering process was oxygen, nitrogen, argon, air respectively. The microstructure of ZnO varistors be made use of SEM equipment. The condition of DC degradation tests were conducted at $115\pm2^{\circ}C$ for periods up to 13 h. Current-voltage analysis is used to determine nonlinear coefficients($\alpha$). Resistance-frequency and capacitance-frequency analysis are accomplished to the understanding of electrical properties as DC degradation test. From above analysis, it is found that the ZnO varistor sintered in oxygen atmosphere showed superior properties at the DC degradation test.

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Alternative Sintering Technology of Printed Nanoparticles for Roll-to-Roll Process (롤투롤 인쇄공정 적용을 위한 차세대 나노입자 소결 기술)

  • Lee, Eun Kyung;Eun, Kyoungtae;Ahn, Young Seok;Kim, Yong Taek;Chon, Min-Woo;Choa, Sung-Hoon
    • Journal of the Microelectronics and Packaging Society
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    • v.21 no.4
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    • pp.15-24
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    • 2014
  • Recently, a variety of printing technologies, including ink jet, gravure, and roll-to-roll (R2R) printing, has generated intensive interest in the application of flexible and wearable electronic devices. However, the actual use of printing technique is much limited because the sintering process of the printed nanoparticle inks remains as a huge practical drawback. In the fabrication of the conductive metal film, a post-sintering process is required to achieve high conductivity of the printed film. The conventional thermal sintering takes considerable sintering times, and requires high temperatures. For application to flexible devices, the sintering temperature should be as low as possible to minimize the damage of polymer substrate. Several alternative sintering methods were suggested, such as laser, halogen lamp, infrared, plasma, ohmic, microwave, and etc. Eventually, the new sintering technique should be applicable to large area, R2R, and polymer substrate as well as low cost. This article reviews progress in recent technologies for several sintering methods. The advantages and disadvantages of each technology will be reviewed. Several issues for the application in R2R process are discussed.

Synthesis and Densification of $Ti_5Si_3$-base Intermetallic Compounds by Reactive Sintering and Electro-Pressure Sintering (반응소결법 및 통전가압소결법에 의한 $Ti_5Si_3$계 금속간화합물의 합성 및 치밀화)

  • 유호준
    • Journal of Powder Materials
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    • v.4 no.4
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    • pp.283-290
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    • 1997
  • $Ti_5Si_3$ intermetallics containing 0-6 wt% of Cu were made by reactive sintering (RS) under vacuum using elemental powder mixtures (Process 1), electro-pressure sintering (EPS) using RS'ed materials (Process2), and EPS using elemental powder mixtures (Process 3). Relatively low dense titanium silicides were gained by process 1, in which porosity decreased with increasing Cu content. For example, porosity changed from 42 to 19.4% with the increase in Cu content from 0 to 6 wt%, indicating that Cu is a useful sintering aid. The titanium silicides fabricated by Process 2 had a higher density than those by Process 1 at given composition, and porosity decreased with increasing Cu content. For example, porosity decreased from 38 to 6.8% with the change in Cu content from 0 to 6 wt%. A high dense titanium silicides were obtained by Process 3. In this Process, porosity decreased a little by Cu addition, and was almost insensitive to Cu content. Namely, about 9 or 7% of porosity was shown in 0 or 1-6 wt% Cu containing silicides, respectively. The hardeness increased by Cu addition, and was not changed markedly with Cu content for the silicides fabricated by Process 3. This tendency was considered to be resulted from porosity, hardening of grain interior by Cu addition, and softening of grain boundary by Cu-base segregates. All these results suggested that EPS using elemental powder mixtures (Process 3) is an effective processing method to achieve satisfactorily dense titanium silicides.

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Computer aided simulation of spark plasma sintering process (Part 1 : formulation) (스파크 플라즈마 소결공정의 전산모사(1부 : 수식화))

  • Keum Y.T.;Jean J.H.
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.16 no.1
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    • pp.38-42
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    • 2006
  • Spark plasma sintering processes have been rapidly introduced recently to improve the quality and productivity of ceramic products and to solve the problem of environmental pollutions. Sintering temperatures and pressing pressures in the spark plasma sintering process are known to be the important factors highly affecting the quality of the ceramics. In this research, in order to see the effects of sintering temperatures and pressing pressures on the grain growth during the spark plasma sintering process of $Al_2O_3$ the grain growth processes associated with sintering temperatures and pressing pressures are simulated by the Monte Carlo method (MCM) and the finite element method (FEM). In this Part 1, the formulations for the simulation, which is the theoretical background of Part 2, are introduced.

Thermal Characteristic Simulation and Property Evaluation of High Melting Point Materials by Pulsed Current Activated Sintering Process (PCAS공정에 의한 고융점 소결체 열전달 해석 및 특성분석)

  • Nam, Hyo-Eun;Jang, Jun-Ho;Park, Hyun-Kuk;Oh, Ik-Hyun
    • Journal of Sensor Science and Technology
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    • v.26 no.3
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    • pp.214-222
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    • 2017
  • In this study, the effects of internal heat treatment associated sintering temperatures were simulated by the Finite Element Method (FEM). The sintering mechanism of pulsed current activated sintering process (PCAS) is still unclear because of some unexplainable heat transfer phenomena in coupled multi-physical fields, as well as the difficulty in measuring the interior temperatures of metal powder. We have carried out simulation study to find out thermal distributions between graphite mold and Ruthenium powder prior to PCAS process. For PCAS process, heating rate was maintained at $100^{\circ}C/min$ the simulation indicates that the sintering temperature range was between $1000^{\circ}C$ to $1300^{\circ}C$ under 60 MPa. The heat transfer inside the Ruthenium sintered-body sample was modelled through the whole process in order to predict the minimum interior temperature. Thermal simulation shows that the interior temperature gradient decreased by graphite punch length and calculation results well agreed with the PCAS field test results.

Microstructure and Sintering Behavior of W-15 wt%Cu Nanocomposite Powder Prepared from W-CuO Mixture (W-CuO 혼합물을 이용하여 제조된 W-Cu나노복합분말의 미세구조와 소결거동에 관한 연구)

  • 김길수;김대건;김영도
    • Journal of Powder Materials
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    • v.10 no.4
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    • pp.270-274
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    • 2003
  • Recently, the fabrication process of W-Cu nanocomposite powders has been researched to improve the sinterability by mechanochemical process (MCP), which consists of ball milling and hydrogen-reduction with W- and Cu-oxide mixture. However, there are many control variables in this process because the W oxides are hydrogen-reduced via several reduction stages at high temperature over 80$0^{\circ}C$ with susceptive reduction conditions. In this experiment, the W-15 wt%Cu nanocomposite powder was fabricated with the ball-milling and hydrogen-reduction process using W and CuO powder. The microstructure of the fabricated W-Cu nanocomposite powder was homogeneously composed of the fine W particles embedded in the Cu matrix. In the sintering process, the solid state sintering was certainly observed around 85$0^{\circ}C$ at the heating rate of 1$0^{\circ}C$/min. It is considered that the solid state sintering at low temperature range should occur as a result of the sintering of Cu phase between aggregates. The specimen was fully densified over 98% for theoretical density at 120$0^{\circ}C$ for 1 h with the heating rate of 1$0^{\circ}C$/min.

Evaluation on Mechanical Properties of Tungsten by Sintering Additive Content (소결첨가재에 의한 텅스텐의 기계적 특성평가)

  • Lee, Sang-Pill;Lee, Jin-Kyung
    • Journal of the Korean Society of Industry Convergence
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    • v.25 no.4_2
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    • pp.621-626
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    • 2022
  • Tungsten is a high melting point metal unlike other steel materials, and it is difficult to manufacture because of its high melting temperature. In this study, pressure sintering process method was applied to manufacture the tungsten materials at low temperature. Therefore, it is necessary to densify the sintered material by using a sintering additive. Studies have been conducted on how the amount of titanium for sintering tungsten affects the mechanical properties of tungsten in this study. In order to secure the densification mechanism of tungsten powder during the sintering process, the characteristics of the sintered tungsten material according to the change of titanium content were evaluated. It was investigated the relationship between sintering parameters and mechanical properties for densification of microstructures. The sintered tungsten materials according to sintering additive content showed high sintered density (about 16.31g/cm3) and flexural strength (about 584 MPa) when the content of sintering additive was 3 wt%. However, as the content of the sintering additive increases, mechanical property of flexural strength is decreased, and the porosity is increased due to the heterogeneous sintering around titanium.

Electrical Property Evaluation of Printed Copper Nano-Ink Annealed with Infrared-Lamp Rapid Thermal Process (적외선 램프를 이용하여 소결한 구리 나노잉크의 전기적 특성 평가에 관한 연구)

  • Han, Hyun-Suk;Kim, Changkyu;Yang, Seung-Jin;Kim, Yoon-Hyun
    • Korean Journal of Materials Research
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    • v.26 no.4
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    • pp.216-221
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    • 2016
  • A sintering process for copper based films using a rapid thermal process with infrared lamps is proposed to improve the electrical properties. Compared with films produced by conventional thermal sintering, the microstructure of the copper based films contained fewer internal and interfacial pores and larger grains after the rapid thermal process. This high-density microstructure is due to the high heating rate, which causes the abrupt decomposition of the organic shell at higher temperatures than is the case for the low heating rate; the high heating rate also induces densification of the copper based films. In order to confirm the effect of the rapid thermal process on copper nanoink, copper based films were prepared under varying of conditions such as the sintering temperature, time, and heating rate. As a result, the resistivity of the copper based films showed no significant changes at high temperature ($300^{\circ}C$) according to the sintering conditions. On the other hand, at low temperatures, the resistivity of the copper based films depended on the heating rate of the rapid thermal process.

Behaviors and Process Analyses of Spark Sintering for Powders Having a Low Sinterability

  • Matsugi, K.
    • Journal of Powder Materials
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    • v.19 no.2
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    • pp.127-133
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    • 2012
  • The sintering behaviors and process parameters of some compounds (carbides, oxides, sulfides, borides) were investigated experimentally. These compounds were successfully consolidated and showed high densities. Some unique phenomena such as retardation of grain growth, suppression of thermal decomposition and maintenance of initial non-equilibrium phases, were observed by the proper control of process in spark sintering.