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A parameter study on the pre-heat treatment for the fabrication of a large grain YBCO bulk superconductor without intermediate grinding step

  • Hong, Yi-Seul;Kim, Chan-Joong;Lee, Hee-Gyoun
    • Progress in Superconductivity and Cryogenics
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    • v.22 no.1
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    • pp.1-6
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    • 2020
  • This is a parameter study for the direct fabrication of a large grain YBCO bulk superconductors using Y2O3, BaCO3 and CuO powders without any grinding step. The cracks, which have been formed due to volume contraction during calcination step, have been prevented by controlling the heating rate at 930~950 ℃. It has been observed that multi-grain growth has occurred due to the dissolution of Sm123 seed due to the retention of carbon in Ba-Cu-O melt. In order to accelerate the carbon release in prior calcination heat treatment, the reduction of pellet thickness and the drilling of artificial holes have been applied. Single-grain YBCO bulk superconductor has been successfully fabricated by stacking multiple thin slab. However, the crack formation has been rather prominent for the compact with artificial holes. The use of buffer pellet, which is supposed to act as diffusion barrier, has prevented the dissolution of Sm123 seed crystal and has led to the growth of single grain of high content of carbon containing specimen.

Effects of Backward Walking Training with Task Orientation on the Functional Gait of Children with Spastic Hemiplegia

  • Choi, Ji Young;Son, Sung Min;Kim, Chang Ju
    • The Journal of Korean Physical Therapy
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    • v.31 no.5
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    • pp.292-297
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    • 2019
  • Purpose: This study examined the effects of backward walking training with task orientation on the functional walking ability of children with cerebral palsy. Methods: This study was a single-blinded, randomized controlled trial with a crossover design conducted at a single rehabilitation facility with cross-over to the other intervention arm following a two-week break. For a total of 12 children with spastic hemiplegia cerebral palsy, the forward walking training group (n=6) underwent training three times a week for three weeks, 40 minutes a day, and the backward walking training group (n=6) was also trained under the same conditions. To identify the functional walking ability, variables, such as the walking speed, stride length, and step length, were measured using a walk analyzer (OptoGait, Microgate S.r.l, Italy). Results: Both groups showed significant increases in walking speed, stride length, and step length (p<0.01). The backward walking group showed more significant improvement in the walking speed from pre- to post-test (p<0.05). The gait characteristics were similar in the two groups (stride length and step length) but the walking speed in the backward walking group showed a mean difference between the positive effects higher than the forward walking group. Conclusion: Task-oriented backward walking training, which was conducted on the ground, may be a more effective treatment approach for improving the walking functions of spastic hemiplegia children than forward walk training.

Direct fabrication of a large grain YBCO bulk superconductor without intermediate grinding step

  • Hong, Yi-Seul;Kim, Chan-Joong;Lee, Hee-Gyoun
    • Progress in Superconductivity and Cryogenics
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    • v.21 no.3
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    • pp.27-31
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    • 2019
  • Large grain YBCO bulk superconductors are fabricated by the top-seeded melt growth (TSMG) or top-seeded infiltration growth (TSIG) method. Both growth methods use at least one of $YBa_2Cu_3O_{7-{\delta}}$, $Y_2BaCuO_5$, $BaCuO_3$ pre-reacted precursor powders. However, the synthesis of the pre-reacted powders includes multiple calcination runs which are cost-bearing and time-consuming. In this work, we report the successful growth of single-domain YBCO bulk superconductors directly by using the powder compact that has been pressed from the mixture of $Y_2O_3$, $BaCuO_3$ and CuO powders without any intermediate grinding step. Single-domain YBCO bulk superconductor has been also prepared by using $Y_2O_3$, $BaO_2$ and CuO powders without intermediate grinding step. Investigations on the trapped magnetic field and microstructure of the melt-processed specimen show that the elimination of the repeated processes of calcinations and pulverization has hardly affected on the crystal growth and the magnetic properties of the grown YBCO bulk superconductors. However, it is thought that the presence of residual carbon affects on the size of Y211 particles in melt-processed YBCO bulk superconductor.

THE EFFECT OF THERMOCYCLING ON THE DURABILITY OF DENTIN ADHESIVE SYSTEMS (열순환이 상아질 접착제의 결합 내구성에 미치는 영향)

  • Moon, Young-Hoon;Kim, Jong-Ryul;Choi, Kyung-Kyu;Park, Sang-Jin
    • Restorative Dentistry and Endodontics
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    • v.32 no.3
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    • pp.222-235
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    • 2007
  • The objectives of this study was to evaluate the effect of thermocycling on the ${\mu}TBS$ (microtensile bond strength) to dentin with four different adhesive systems to examine the bonding durability. Freshly extracted $3^{rd}$ molar teeth were exposed occlusal dentin surfaces, and randomly distributed into 8 adhesive groups 3-steps total-etching (Scotchbond Multi-Purpose Plus; SM, All Bond-2; AB), 2-steps total-etching (Single Bond; SB, One Step plus; OS), 2-steps self-etching (Clearfil SE Bond; SE, AdheSE AD) and single-step self-etching systems (Promp L-Pop; PL, Xeno III; XE) Each adhesive system in 8 adhesives groups was applied on prepared dentin surface as an instruction and resin composite (Z250) was placed incrementally and light-cured. The bonded specimens were sectioned with low-speed diamond saw to obtain $1\times1mm$ sticks after 24 hours of storage at $37^{\circ}C$ distilled water and proceeded thermocycling at the pre-determined cycles of 0, 1,000 and 2,000. The ${\mu}TBS$ test was carried out with EZ-tester at 1mm/min. The results of bond strength test were statistically analyzed using one-way ANOVA/ Duncan's test at the a < 0.05 confidence level. Also, the fracture mode of debonded surface and the interface were examined under SEM. The results of this study were as follows ; 1. 3-step total etching adhesives showed stable, but bond strength of 2-step adhesives were decreased as thermocycling stress. 2. SE showed the highest bond strength, but single step adhesives (PL, XE) had the lowest value both before and after thermocycling. 3 Most of adhesives showed adhesive failure. The total-etching systems were prone to adhesive failure and the single-step systems were mixed failure after thermocycling. Within limited results of this study, the bond strength of adhesive system was material specific and the bonding durability was affected by the bonding step/ procedure of adhesive Simplified bonding procedures do not necessarily imply improved bonding performance.

Development of Facility Layout Design Algorithm Based on Artificial Intelligence Concept (인공지능 개념을 이용한 공장 설비배치 알고리즘 개발)

  • Kim, Hwan-Seong;Lee, Sang-Yong
    • Journal of Korean Society for Quality Management
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    • v.19 no.1
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    • pp.151-162
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    • 1991
  • The purpose of this study is to propose a facility layout design algorithm based on artificial intelligence concept, and then to develop a computer program which is more practical than any other conventional facility layout design systems. The algorithm is composed of five step layout procedures; knowledge and data input, knowledge interpretation, priority determination, inference of layout design, and evaluation, In the step of priority determination, the algorithm is divided into single row and multi row layout problem. In the step of inference of layout design, alternatives are generated by constraints-directed reasoning and depth first search method based on artificial intelligence concept. Alternatives are evaluated by the moving cost and relationship value by interactive man-machine interface in the step of evaluation. As a case study, analytical considerations over conventional programs such as CRAFT and CORELAP was investigated and compared with algorithm propsed in this study. The proposed algorithm in this study will give useful practical tool for layout planner. The computer progran was written in C language for IBM PC-AT.

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Development of 765kV Shell Type Transformers for Generator Step-up (발전소용 외철형 765kV 변압기 개발)

  • Kim Yungmin;Kim Dogyoon;Joe Gwangje;Bae Yongbae
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.54 no.12
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    • pp.515-519
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    • 2005
  • We have developed shell type 765kV transformers for generator step-up. Our research and development for shell type 765kV transformers have been continued since 1990. The shell type 765kV transformers of single phase 3MVA for step-up and 500MVA for power transmission were developed in Dec. 1992 and Oct. 1996, respectively. 204MVA 765kV transformer for generator step-up was also developed with the basis of technique and experience to the present. Total 12 phases of 204MVA 765kV transformers will be delivered at Tangjin thermal power plant by 2006. This paper describes electrical and structural features of the shell type 204MVA 765kV transformer.

Integrated Vehicle Routing Model for Multi-Supply Centers Based on Genetic Algorithm (유전자알고리즘 및 발견적 방법을 이용한 차량운송경로계획 모델)

  • 황흥석
    • Journal of the Korea Society for Simulation
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    • v.9 no.3
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    • pp.91-102
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    • 2000
  • The distribution routing problem is one of the important problems in distribution and supply center management. This research is concerned with an integrated distribution routing problem for multi-supply centers based on improved genetic algorithm and GUI-type programming. In this research, we used a three-step approach; in step 1 a sector clustering model is developed to transfer the multi-supply center problem to single supply center problems which are more easy to be solved, in step 2 we developed a vehicle routing model with time and vehicle capacity constraints and in step 3, we developed a GA-TSP model which can improve the vehicle routing schedules by simulation. For the computational purpose, we developed a GUI-type computer program according to the proposed methods and the sample outputs show that the proposed method is very effective on a set of standard test problems, and it could be potentially useful in solving the distribution routing problems in multi-supply center problem.

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High-Quality Epitaxial Low Temperature Growth of In Situ Phosphorus-Doped Si Films by Promotion Dispersion of Native Oxides (자연 산화물 분산 촉진에 의한 실 시간 인 도핑 실리콘의 고품질 에피택셜 저온 성장)

  • 김홍승;심규환;이승윤;이정용;강진영
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.13 no.2
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    • pp.125-130
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    • 2000
  • Two step growth of reduced pressure chemical vapor eposition has been successfully developed to achieve in-situ phosphorus-doped silicon epilayers, and the characteristic evolution on their microstructures has been investigated using scanning electron microscopy, transmission electron microscopy, and secondary ion mass spectroscopy. The two step growth, which employs heavily in-situ P doped silicon buffer layer grown at low temperature, proposes crucial advantages in manipulating crystal structures of in-situ phosphorus doped silicon. In particular, our experimental results showed that with annealing of the heavily P doped silicon buffer layers, high-quality epitaxial silicon layers grew on it. the heavily doped phosphorus in buffer layers introduces into native oxide and plays an important role in promoting the dispersion of native oxides. Furthermore, the phosphorus doping concentration remains uniform depth distribution in high quality single crystalline Si films obtained by the two step growth.

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Resistance Switching Enhancement in Multi-step Deposition by Multi-deposition and Multi-anneal

  • Kim KyongRae;Ko Han-kyoung;Lee Taeho;Park In-Sung;Ahn Jinho
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2005.09a
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    • pp.151-154
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    • 2005
  • In this paper, we present the enhanced performance of resistive RAM devices with multi-step deposited and annealed oxides. By using multi-step deposition and low temperature multi-step annealins, forming-free Re-RAM is achieved with lower operation voltages and larger resistive ratio than those of conventional Re-RAM with typical single deposited oxide.

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Si기판을 이용한 대면적 CdTe 박막의 MOCVD성장

  • Kim, Gwang-Cheon;Im, Ju-Hyeok;Yu, Hyeon-U;Jeong, Gyu-Ho;Kim, Hyeon-Jae;Kim, Jin-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.11a
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    • pp.275-275
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    • 2009
  • CdTe(331)/Si(211) and CdTe(400)/Si(100) thin films have been grown by MOCVD(metal organic chemical vapor deposition) system for large scale of IFPAs(IR focal plane arrays). We have investigated the effect of various growth parameters on the surface morphology and structural quality. Single crystalline CdTe(331) films were grown by two stage growth method - low temperature buffer layer step and high temperature growth step. In other case, single crystal of CdTe(400) films were grown on a few atomic layer thickness of GaAs which is grown on Si(100) substrate by molecular beam epitaxy. The crystalline quality of the films was analyzed by X-ray diffraction. The surface morphology and crystal structure of CdTe films were characterized by optical microscope.

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