• Title/Summary/Keyword: signal integrity

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Study of SI Characteristic of Multilayer PCB with a Through-Hole Via (관통형 비아가 있는 다층 PCB의 SI 성능 연구)

  • Kim, Li-Jin;Lee, Jae-Hyun
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.21 no.2
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    • pp.188-193
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    • 2010
  • In this paper, SI(Signal Integrity) characteristic of the 4-layer PCB(Printed Circuit Boards) with a through-hole via was analyzed by impedance mismatching between the through-hole via and the transmission line, and deterioration of clock pulse response characteristic due to the P/G plane resonances which are generated between the power and the ground plane. The minimized impedance mismatching between the through-hole via and the transmission line for the improving of SI characteristic is confirmed by the TDR(Time Domain Reflector) simulation and lumped element modeling of the through-hole via. And the cancellation method of P/G plane resonances for improvement of the SI characteristic is represented by simulation result.

Through Silicon Stack (TSS) Assembly for Wide IO Memory to Logic Devices Integration and Its Signal Integrity Challenges

  • Shin, Jaemin;Kim, Dong Wook
    • The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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    • v.24 no.2
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    • pp.51-57
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    • 2013
  • The current expanding mobile markets incessantly demands small form factor, low power consumption and high aggregate throughput for silicon-level integration such as memory to logic system. One of emerging solution for meeting this high market demand is 3D through silicon stacking (TSS) technology. Main challenges to bring 3D TSS technology to the volume production level are establishing a cost effective supply chain and building a reliable manufacturing processes. In addition, this technology inherently help increase number of IOs and shorten interconnect length. With those benefits, however, potential signal and power integrity risks are also elevated; increase in PDN inductance, channel loss on substrate, crosstalk and parasitic capacitance. This paper will report recent progress of wide IO memory to high count TSV logic device assembly development work. 28 nm node TSV test vehicles were fabricated by the foundry and assembled. Successful integration of memory wide IO chip with less than a millimeter package thickness form factor was achieved. For this successful integration, we discussed potential signal and power integrity challenges. This report demonstrated functional wide IO memory to 28 nm logic device assembly using 3D package architecture with such a thin form factor.

SI Analysis for Quality Assurance of High-Speed Signal Interfaced Between Processor and DDR2 Memory on PCB Module (PCB Module에서의 Processor와 DDR2 메모리 사이에 인터페이스되는 고속신호 품질확보를 위한 SI해석)

  • Ha, Hyeon-Su;Kim, Min-Sung;Ha, Pan-Bong;Kim, Young-Hee
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2013.10a
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    • pp.386-389
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    • 2013
  • In this paper, for signal integrity analysing high-speed signal between a processor and a DDR2 memory, transient analysis is done and eye diagrams are generated using IBIS models of IC chips and S-parameters of transmission line. From the eye diagrams of such high-speed signals as DQ, DQS/DQSb, Clock, Address and Control, signal quality is assured through measuring timing and voltage margins during setup and hold times and verifying that the over-/under-shoot and the cross points of differential signals satisfy their specifications.

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A Method for Reducing the Number of Metal Layers for Embedded LSI Package

  • Ohshima, Daisuke;Mori, Kentaro;Nakashima, Yoshiki;Kikuchi, Katsumi;Yamamichi, Shintaro
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.4
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    • pp.27-33
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    • 2010
  • We have successfully demonstrated a high-pin-count and thin embedded-LSI package to realize next generation's mobile terminals. The following three design key points were applied: (i) Using Cu posts, (ii) Using the coreless structure, (iii) Using a Cu plate as the ground plane. In order to quantitatively determine the contribution of the three points, the five-stage process for reducing the number of metal layers is described by means of the electrical simulation. The point-(i) and (ii) are effective from the viewpoint of the power integrity (PI); that is, these points play important roles in reducing the number of metal layers, and especially the point-(ii) contributes at least twice as the point-(i). The point-(iii) is not effective in the PI, but has a few effects on the signal integrity (SI). For reducing the number of metal layers, we should, at first, pay attention whether the PI characteristics fulfill the specification, and then we should confirm the SI characteristics.

Verifications of the Impact-echo Technique for Integrity Evaluations of the Drilled Shaft using Full Scale Tests (현장시험에 의한 충격반향기법의 말뚝 건전도 검사 적용성 평가)

  • Jung, Gyung-Ja;Cho, Sung-Min;Kim, Hong-Jong;Jung, Jong-Hong
    • Proceedings of the Korean Geotechical Society Conference
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    • 2005.03a
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    • pp.33-40
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    • 2005
  • Impact-echo test, a kind of simple and economical method to evaluate the integrity of drilled piles has some limitations to use because the stress wave can be generated only on the head of a pile and the wave propagation in the pile with surrounding soils are very complicated. Numerical analyses and model tests in the laboratory have shown that both the ratio of length to diameter of a pile and the stiffness ratio of pile to soil have influence on the resolution of testing results. Full scale testing piles which have artificial defects were used to verify the capability of impact-echo technique as a tool for the pile integrity evaluation. Behaviour of the reflected signal of stress wave was investigated according to the type of defects. Elastic modulus of the pile was calculated using the wave velocity in the pile and the unconfined strength of concrete specimen. Influences of the stiffness difference between the pile and the ground on the characteristics of a wave signal were also examined.

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Design of the Pseudolite Pulsing Scheme

  • Chang, Jae-Won;Cho, Deuk-Jae;Park, Chan-Sik;Lee, Sang-Jeong
    • 제어로봇시스템학회:학술대회논문집
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    • 2004.08a
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    • pp.215-218
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    • 2004
  • The pseudolites are ground-based transmitters that can be configured to emit GPS-like signals with the purpose of enhancing the GPS by providing increased accuracy, integrity, and availability. Although the use of the pseudolites offers many potentially significant benefits, a number of technical issues must also be addressed. One is the pseudolite signal power level which is related with near-far problem, and other issues include deployment requirements, signal data rate, signal integrity monitoring, and user antenna location and sensitivity. In order to solve the near-far problem, the frequency offset or the pulsing schemes is implemented in most the pseudolites. However, in the case of the previous pulsing scheme with the fixed code pattern, the near-far problem still remains. This paper aims to design a sequential pulsing scheme to avoid the near-far problem. A pulse mode pseudolite has less interference than the continuous mode.

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A Study on the Signal Analysis of Loose Parts Monitoring System (LPMS 신호분석 연구)

  • Lee, Sang-Guk
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2014.10a
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    • pp.839-841
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    • 2014
  • The Nuclear Steam Supply System(NSSS) is designed to provide an integrated approach that includes areas of monitoring relevant to the integrity of the NSSS. LPMS is designed to function as an alarm system by providing sensor channel alarms for the associated subsystems. LPMS is equipped to provide analysis tools for new alarm events, historical events and for historical periodically stored channel data (e.g. waveforms) for most channels. This paper is intended to introduce the diagnosis principle and abnormal symptom of loose parts monitoring system as a monitoring tool in Nuclear Steam Supply System. And also, we are going to introduce signal analysis program in order to perform the actual diagnosis in power plants.

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Design of High-Speed Multi-Layer PCB for Ultra High Definition Video Signals (UHD급 영상구현을 위한 다층인쇄회로기판의 특성 임피던스 분석에 관한 연구)

  • Jin, Jong-Ho;Son, Hui-Bae;Rhee, Young-Chul
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.19 no.7
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    • pp.1639-1645
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    • 2015
  • In UHD high-speed video transmission system, when a signal within certain frequency region coincides electrically and structurally, the system becomes unstable because the energy is concentrated, and signal flux is interfered and distorted. For the instability, power integrity analysis should be conducted. To remove the signal distortion for MLB, using a high-frequency design technique for EMI phenomenon, EMI which radiates electromagnetic energy fluxed into power layer was analyzed considering system stabilization. In this paper, we proposed an adaptive MLB design method which minimizes high-frequency noise in MLB structure, enhances signal integrity and power integrity, and suppresses EMI. The characteristic impedance for multi-layer circuit board proposed in this study were High-Speed Video Differential Signaling(HSVDS) line width w = 0.203, line gap d = 0.203, beta layer height h = 0.145, line thickness t = 0.0175, dielectric constant εr = 4.3, and characteristic impedance Zdiff = 100.186Ω. When high-speed video differential signal interface board was tested with optimized parameters, the magnitude of Eye diagram output was 672mV, jittering was 6.593ps, transmission frequency was 1.322GHz, signal to noise was 29.62dB showing transmission quality improvement of 10dB compared to previous system.

Development of Remote Integrity Monitoring System for GNSS (GNSS 원격 무결성 감시시스템 개발)

  • Bae, Jung-Won;Song, Jae-Hun;Jeon, Hyang-Sik;Nam, Gi-Uk;Lee, Han-Seong
    • Aerospace Engineering and Technology
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    • v.5 no.2
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    • pp.16-26
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    • 2006
  • GNSS is a satellite-based radio navigation aid. For using it in civil air navigation area, any GNSS service should meet the requirements of accuracy, integrity, continuity and availability in each flight phase established by ICAO. In this study, a remote integrity monitoring system(RIMS) for GNSS are proposed and explained to utilize it in the design of GNSS augmentation system such as GBAS and GRAS. The RIMS consists of signal-in-space receiving subsystem and signal processing subsystem. Each GPS receiver is connected to Host PC by the serial to ethernet converting device which is able to convert serial port connection to LAN port connection in order to exchange information via the internet. We can overcome the siting limitation of GPS receiver and antenna, and reduce signal loses in the cable between GPS antenna and receiver. This system is providing the development environment for GBAS CAT-I system.

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Smart monitoring system using electromagnetic waves to evaluate the integrity of reinforced concrete structural elements

  • Jong-Sub Lee;Dongsoo Lee;Youngdae Kim;Goangseup Zi;Jung-Doung Yu
    • Computers and Concrete
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    • v.31 no.4
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    • pp.293-306
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    • 2023
  • This study proposes and demonstrates a smart monitoring system that uses transmission lines embedded in a reinforced concrete structure to detect the presence of defects through changes in the electromagnetic waves generated and measured by a time-domain reflectometer. Laboratory experiments were first conducted to identify the presence of voids in steel-concrete composite columns. The results indicated that voids in the concrete caused a positive signal reflection, and the amplitude of this signal decreased as the water content of the soil in the void increased. Multiple voids resulted in a decrease in the amplitude of the signal reflected at each void, effectively identifying their presence despite amplitude reduction. Furthermore, the electromagnetic wave velocity increased when voids were present, decreased as the water content of the soil in the voids increased, and increased with the water-cement ratio and curing time. Field experiments were then conducted using bored piles with on-center (sound) and off-center (defective) steel-reinforcement cage alignments. The results indicated that the signal amplitude in the defective pile section, where the off-center cage was poorly covered with concrete, was greater than that in the pile sections where the cage was completely covered with concrete. The crosshole sonic logging results for the same defective bored pile failed to identify an off-center cage alignment defect. Therefore, this study demonstrates that electromagnetic waves can be a useful tool for monitoring the health and integrity of reinforced concrete structures.