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http://dx.doi.org/10.6109/jkiice.2015.19.7.1639

Design of High-Speed Multi-Layer PCB for Ultra High Definition Video Signals  

Jin, Jong-Ho (Department of Information and Communication Engineering, Kyungnam University)
Son, Hui-Bae (Department of Information and Communication Engineering, Kyungnam University)
Rhee, Young-Chul (Department of Information and Communication Engineering, Kyungnam University)
Abstract
In UHD high-speed video transmission system, when a signal within certain frequency region coincides electrically and structurally, the system becomes unstable because the energy is concentrated, and signal flux is interfered and distorted. For the instability, power integrity analysis should be conducted. To remove the signal distortion for MLB, using a high-frequency design technique for EMI phenomenon, EMI which radiates electromagnetic energy fluxed into power layer was analyzed considering system stabilization. In this paper, we proposed an adaptive MLB design method which minimizes high-frequency noise in MLB structure, enhances signal integrity and power integrity, and suppresses EMI. The characteristic impedance for multi-layer circuit board proposed in this study were High-Speed Video Differential Signaling(HSVDS) line width w = 0.203, line gap d = 0.203, beta layer height h = 0.145, line thickness t = 0.0175, dielectric constant εr = 4.3, and characteristic impedance Zdiff = 100.186Ω. When high-speed video differential signal interface board was tested with optimized parameters, the magnitude of Eye diagram output was 672mV, jittering was 6.593ps, transmission frequency was 1.322GHz, signal to noise was 29.62dB showing transmission quality improvement of 10dB compared to previous system.
Keywords
High-Speed Video Differential Signaling; Multi-Layer PCB; TDR; Signal Integrity; UHD;
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