• Particle and aerosol research
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• v.12 no.3
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• pp.57-63
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• 2016

The laser-induced breakdown spectroscopy (LIBS) has been used for rapid detection of elemental compositions of various materials in multi-media (solid, liquid, gas, and aerosols). In this study, the aerosol-LIBS has been developed for real-time monitoring of process-induced particles produced during the semiconductor manufacturing. The developed aerosol-LIBS mainly consists of laser, optics, spectrometer, and aerosol chamber. A new aerosol chamber was constructed for the aerosol-LIBS to be applied for various semiconductor manufacturing process, including exhaust tubes, and low pressure and high temperature chamber. The aerosol-LIBS was evaluated by using laboratory generated aerosols for detection of various elements. As a result, P, Fe, Mg, Cu, Co, Ni, Ca, Na, and K emission lines were successfully detected by the aerosol-LIBS. Further evaluation of the aerosol-LIBS is being conducted.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.2 no.4
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• pp.17-24
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• 2003

Chemical mechanical polishing(CMP) has been applied for planarization of topography after patterning process in semiconductor fabrication process. Tungsten CMP is necessary to build up interconnects of semiconductor device. But the tungsten dishing and the oxide erosion defects appear at end-point during tungsten CMP. It has been known that the generation of dishing and erosion is based on the over-polishing time, which is determined by pattern selectivity. Fixed abrasive pad takes advantage of decreasing the defects resulting flam reducing pattern selectivity because of the lower abrasive concentration. The manufacturing technique of fixed abrasive pad using hydrophilic polymers is introduced in this paper. For application to tungsten CMP, chemicals composed of oxidizer, catalyst, and acid were developed. In comparison of the general pad and slurry for tungsten CMP, the fixed abrasive pad and the chemicals resulted in appropriate performance in point of removal rate, uniformity, material selectivity and roughness.

• Journal of the Korean Society of Safety
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• v.25 no.1
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• pp.27-31
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• 2010

It is a well known fact that the LCD and Semiconductor Devices are a central part of IT industry which is important in the present and the future. But the biggest problem of Semiconductor and LCD manufacturing is maintaining a cleaning room environment. For this reason, the soft X-ray type Ionizer was used as the electrostatic reducer device, which protects damage of the product against electrostatic discharge in the manufacturing process. Therefore it is a essential important factor during Semiconductor and LCD production process. But the soft X-ray has a intrinsic problem with harmful to human being in case of soft X-ray exposure. That's reason we have the research to solve above problem and made an apparatus that it was covered with shielding structure to protect X-ray radiation to outside. And besides, it has a possibility to eliminate the charged electrostatic in the narrow space through the slot for Ion emissions with dual soft X-ray sources on the both side. It is also not make the particles from itself when it has been operated.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.25 no.1
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• pp.36-44
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• 2015

Objectives: This study aimed to elucidate the physicochemical properties of silica powder and airborne particles as by-products generated from fabrication processes to reduce unknown risk factors in the semiconductor manufacturing work environment. Materials and Methods: Sampling was conducted at 200 mm and 300 mm semiconductor wafer fabrication facilities. Thirty-two powder and airborne by-product samples, diffusion(10), chemical vapor deposition(10), chemical mechanical polishing(5), clean(5), etch process(2), were collected from inner chamber parts from process and 1st scrubber equipment during maintenance and process operation. The chemical composition, size, shape, and crystal structure of silica by-product particles were determined by using scanning electron microscopy and transmission electron microscopy techniques equipped with energy dispersive spectroscopy, and x-ray diffractometry. Results: All powder and airborne particle samples were composed of oxygen(O) and silicon(Si), which means silica particle. The by-product particles were nearly spherical $SiO_2$ and the particle size ranged 25 nm to $50{\mu}m$, and most of the particles were usually agglomerated within a particle size range from approximately 25 nm to 500 nm. In addition, the crystal structure of the silica powder particles was found to be an amorphous silica. Conclusions: The silica by-product particles generated from the semiconductor manufacturing processes are amorphous $SiO_2$, which is considered a less toxic form. These results should provide useful information for alternative strategies to improve the work environment and workers' health.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.24 no.3
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• pp.272-280
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• 2014

Objectives: The purpose of this study was to evaluate the characteristics of worker exposure to hazardous chemical substances and propose the direction of work environment management for protecting worker's health in the semiconductor assembly process. Methods: Four assembly lines at two semiconductor manufacturing companies were selected for this study. We investigated the types of chemicals that were used and generated during the assembly process, and evaluated the workers' exposure levels to hazardous chemicals such as benzene and formaldehyde and the current work environment management in the semiconductor assembly process. Results: Most of the chemicals used at the assembly process are complex mixtures with high molecular weight such as adhesives and epoxy molding compounds(EMCs). These complex mixtures are stable when they are used at room temperature. However workers can be exposed to volatile organic compounds(VOCs) such as benzene and formaldehyde when they are used at high temperature over $100^{\circ}C$. The concentration levels of benzene and formaldehyde in chip molding process were higher than other processes. The reason was that by-products were generated during the mold process due to thermal decomposition of EMC and machine cleaner at the process temperature($180^{\circ}C$). Conclusions: Most of the employees working at semiconductor assembly process are exposed directly or indirectly to various chemicals. Although the concentration levels are very lower than occupational exposure limits, workers can be exposed to carcinogens such as benzene and formaldehyde. Therefore, workers employed in the semiconductor assembly process should be informed of these exposure characteristics.

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.864-867
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• 2002

LG Electronics developed a perfect flat color display tube which was named "FLATRON" . This tube provides ergonomic performances with perfectly flat face and innovative manufacturing process. Foil transfer is a new technology for manufacturing screen layer for Flatron. Its main features include several properties of film, releasing agent, adhesive, aluminum layer, holes after bake-out and foil transfer process. It will be used innovative and cost oriented process for FLATRON for in CRT mass production..

• Journal of the Korea Society for Simulation
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• v.19 no.1
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• pp.1-11
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• 2010

K company produces semiconductor package products under the make-to-order policy to supply for domestic and foreign semiconductor manufacturing companies. Its production process is a machine-paced assembly line type, which consists of die sawing, assembly, and test. This paper suggests three plans to increase process throughput based on the process analysis of K company and evaluates them via a simulation model using a real data collected. The three plans are line balancing by adding machines to the bottleneck process, product group scheduling, and reallocation of the operators in non-bottleneck processes. The evaluation result shows the highest daily throughput increase of 17.3% with an effect of 2.8% reduction of due date violation when the three plans are applied together. Payback period for the mixed application of the three plans is obtained as 1.37 years.

• Journal of the Korean Society for Precision Engineering
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• v.10 no.3
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• pp.182-190
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• 1993

In manufacturing process of semiconductor package, the thermal stress owing to high temperature in moulding and the bubbles generated in chip bonding process become main causes to produce void. On this study we evaluated quantitatively void size by use of ultrasonic spectroscopy method which analyze the reflective pulses with broad band frequency in frequency domain, and after destructive testing we verified effectiv- eness of sizing void by use of ultasonic spectroscopy.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.9-10
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• 2005

Process diagrams of selective epitaxial growth of silicon(SEG) could be developed from CVD thermodynamics. They could not only be helpful with understanding of the mechanism, but also offer good processing guidelines in manufacturing high density devices. Through the process optimization skill, applications of SEG to high-density device structures could be possible without problems such as loading effect and facet generation, with producing outstanding electronic properties.

• Proceedings of the Safety Management and Science Conference
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• 2009.11a
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• pp.187-201
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• 2009

Semiconductor industry is based on equipment industry and timing industry. In particular, semiconductor process is very complex and as semiconductor-chip width tails and is becoming equipment gradually more as a high technology. Equipment operation is primarily engaged in semiconductor manufacturing (engineers and operator) of being conducted by, equipment errors have also been raised. Equipment operational data related to the error of korea occupational safety and health agency were based on data and production engineers involved in the operator's questionnaire was drawn through the error factor. Equipment operating in the error factor of 9 big item and 36 detail item detailed argument based on the errors down, and 9 big item the equipment during operation of the correlation error factor was conducted. Each of the significance level was correlated with the tabulation and analysis. Using the maximum correlation coefficient, the correlation between the error factors to derive the relationship between factors were analyzed. Facility operating with the analysis of error factors (big and detail item) derive a relationship between the model saw. The end of the operation of the facility in operation on the part of the two factors appeared as prevention. Safety aspects and ergonomics aspects of the approach should be guided to the conclusion.