Size, Shape, and Crystal Structure of Silica Particles Generated as By-products in the Semiconductor Workplace |
Choi, Kwang-Min
(Samsung Health Research Institute, Samsung Electronics Co. Ltd.)
Yeo, Jin-Hee (Samsung Health Research Institute, Samsung Electronics Co. Ltd.) Jung, Myung-Koo (Samsung Health Research Institute, Samsung Electronics Co. Ltd.) Kim, Kwan-Sick (Health Management Team, Samsung Electronics Co. Ltd.) Cho, Soo-Hun (Samsung Health Research Institute, Samsung Electronics Co. Ltd.) |
1 | Bhaskar R, Li J, Xu L. A comparative study of particle size dependency of IR and XRD methods for quartz analysis. Am Ind Hyg Assoc J 1989;55:605-609 |
2 | Choi KM, Kim TH, Kim KS, Kim SG. Hazard identification of powder generated from a chemical vapor deposition process in the semiconductor manufacturing industry. J Occup Environ Hyg 2013;10(1):D1-D5 DOI |
3 | Ino K, Natori I, Ichikawa A, Vrtis RN, Ohmi T. Plasma enhanced in situ chamber cleaning evaluated by extracted-plasma-parameter analysis. IEEE Transctions on Semiconductor Manufacturing 1996;9(2):230-240 DOI |
4 | Ji B, Elder DL, Yang JH, Badowski PR, Karwacki EJ. Power dependence of plasma stability for in situ chamber cleaning. J Appl Phys 2009;95: 84446-84451 |
5 | Levinshtein ME, Rumyantsev SL, Shur MS. (ed.) Properties of Advanced Semiconductor Materials: GaN, AlN, InN, BN, SiC, SiGe. John Wiley & Sons. ; 2001 |
6 | Manzione LT. Plastic Packaging of Microelectronics Devices. Van Nostrand Reinhold, New York: 1990 |
7 | May GS, Spanos CJ. Fundamental of Semiconductor Manufacturing and Process Control. Hoboken, NJ.: John Wiley & Sons, Inc.; 2006. p. 25-81 |
8 | McGuire GE. (ed) Semiconductor Materials and Process Technology Handbook. Park Ridge, NJ.: Noyes Publications; 1988 |
9 | Meeks E, Larson RS, Ho P, Apblett C, Han SM, et al. Modeling of deposition in high density plasma reactors and comparisons of model predictions with experimental measurements. J Vac Sci Technol A 1998;16(2):544-563 DOI |
10 | Napierska D, Thomassen L, Lison D, Martens J, Hoet PH. The nanosilica hazard: another variable entity. Particle and Fibre Toxicology 2010;7:39 DOI |
11 | National Institute for Occupational Safety and Health (NIOSH): Silica, Crystalline, by XRD: Method 7500. In NIOSH Manual of Analytical Methods (NMAM), Fourth edition issue 4; 2003 |
12 | Nishi Y, Doering R.(ed.) Handbook of semiconductor manufacturing technology. CRC Press; 2000 |
13 | Parks CG, Conrad K, Cooper GS. Occupational exposure to crystalline silica and autoimmune disease. Environ. Health Perspect 1999;107 (Suppl. 5):793-802 DOI |
14 | Sayes CM, Wahi R. Wahi PA, Kurian et al. Correlating nanoscale titania structure with toxicity: A cytotoxicity and inflammatory response study with human dermal fibroblasts and human lung epithelial cells. Toxicol Sci 2006;92(1):174-185 DOI |
15 | Wolf S, Tauber RN. Silicon Processing. Lattice, Sunset Beach, CA: 1986 |
16 | Whyte W. Cleanroom Technology - fundamentals of design, testing and operation. Chichester, U.K.: John Wiley & Sons, Inc.; 2001. Chapter 1:1-8 |
17 | Yang H, Liu C, Yang D, Zhang H, Xi Zhuge. Comparative study of cytotoxicity, oxidative stress and genotoxicity induced by four typical nanomaterials: the role of particle size, shape and composition. J Appl Toxicol 2009;29(1):69-78 DOI |
18 | Zhang H, Dunphy DR, Jiang X, Meng H, Sun B et al. Process pathway dependence of amorphous silica nanoparticle toxicity: colloidal vs pyrolytic. J Am Chem Soc 2012;134(38):15790-15804 DOI |