• The korean journal of orthodontics
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• v.43 no.5
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• pp.235-241
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• 2013

Objective: The purpose of this study was to investigate whether extension of the custom base is necessary for enhancement of bond strength, by comparing the debonding forces and residual adhesives of 3 different lingual bracket systems. Methods: A total of 42 extracted upper premolars were randomly divided into 3 groups of 14 each for bonding with brackets having (1) a conventional limited resin custom base; (2) an extended gold alloy custom base: Incognito${TM}$; and (3) an extended resin custom base: KommonBase${TM}$. The bonding area was measured by scanning the bracket bases with a 3-dimensional digital scanner. The debonding force was measured with an Instron universal testing machine, which applied an occlusogingival shear force. Results: The mean debonding forces were 60.83 N (standard deviation [SD] 10.12), 69.29 N (SD 9.59), and 104.35 N (SD17.84) for the limited resin custom base, extended gold alloy custom base, and extended resin custom base, respectively. The debonding force observed with the extended resin custom base was significantly different from that observed with the other bases. In addition, the adhesive remnant index was significantly higher with the extended gold alloy custom base. Conclusions: All 3 custom-base lingual brackets can withstand occlusal and orthodontic forces. We conclude that effective bonding of lingual brackets can be obtained without extension of the custom base.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.830-833
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• 2003

This paper describes the fabrication and characteristics of 3C-SiCOI sotctures by SDB and etch-back technology for high-temperature MEMS applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si(001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The wafer bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR. The strength of the bond was measured by tensile strengthmeter. The bonded interface was also analyzed by SEM. The properties of fabricated 3C-SiCOI structures using etch-back technology in TMAH solution were analyzed by XRD and SEM. These results indicate that the 3C-SiCOI structure will offers significant advantages in the high-temperature MEMS applications.

• Journal of Sensor Science and Technology
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• v.14 no.3
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• pp.206-210
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• 2005

The SOI structure with buried alumina was fabricated by ALD followed by bonding and etchback process. The interface of alumina and silicon was analyzed by CV measurements and cross section was investigated by SEM analysis. The density of interface state of alumina and silicon was 2.5E11/$cm^{2}$-eV after high temperature annealing for wafer bonding. It was confirmed that the surface silicon layer was completely isolated from substrate by cross section SEM and AES depth profile. The device on this alumina SOI structure would have better thermal properties than that on conventional SOI due to higher thermal conductivity of alumina than that of silicon dioxide.

• Transactions of the Korean Society of Automotive Engineers
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• v.13 no.4
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• pp.129-134
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• 2005

There is a strong industrial demand for the development of light-weight vehicle to improve fuel efficiency and dynamic performance. The effective method of achieving the weight reduction is to use low-density materials such as aluminum and magnesium. In applying these materials to the vehicle, it is often required to join dissimilar materials such as aluminum and steel. However, conventional joining method, namely resistance spot welding cannot be used in joining dissimilar materials. Self·piercing rivet(SPR) and adhesive bonding is a good alternative to resistance spot welding. In this study, the impact test of double hat-shaped member made by resistance spot welding, SPR and adhesive bonding was performed. As a result, various parameters of crashworthiness were analyzed and evaluated. Also, the applicability of SPR and adhesive bonding as an alternative to resistance spot welding was suggested.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.9 no.10
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• pp.4034-4053
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• 2015

In order to meet various requirements for transmission quality of both primary users (PUs) and secondary users (SUs) in cognitive radio networks, we introduce a channel bonding mechanism for PUs and a channel reservation mechanism for SUs, then we propose a novel spectrum allocation strategy. Taking into account the mistake detection and false alarm due to imperfect channel sensing, we establish a three-dimensional Markov chain to model the stochastic process of the proposed strategy. Using the method of matrix geometric solution, we derive the performance measures in terms of interference rate of PU packets, average delay and throughput of SU packets. Moreover, we investigate the influence of the number of the reserved (resp. licensed) channels on the system performance with numerical experiments. Finally, to optimize the proposed strategy socially, we provide a charging policy for SU packets.

• Smart Structures and Systems
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• v.22 no.3
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• pp.341-358
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• 2018

This present study investigates Love-type wave propagation in composite structure consists of a loosely bonded functionally graded piezoelectric material (FGPM) stratum lying over a functionally graded initially-stressed fibre-reinforced material (FGIFM) substrate. The closed-form expressions of the dispersion relation have been obtained analytically for both the cases of electrically open and electrically short conditions. Some special cases of the problem have also been studied and the obtained results are found in well-agreement with the classical Love wave equation. The emphatic influence of wave number, bonding parameter associated with bonding of stratum with substrate of the composite structure, piezoelectric coefficient as well as dielectric constant of the piezoelectric stratum, horizontal initial stresses, and functional gradedness of the composite structure on the phase velocity of Love-type wave has been reported and illustrated through numerical computation along with graphical demonstration in both the cases of electrically open and electrically short condition for the reinforced and reinforced-free composite structure. Comparative study has been carried out to analyze the distinct cases associated with functional gradedness of the composite structure and also various cases which reveals the influence of piezoelectricity, reinforcement and horizontal initial stress acting in the composite structure, and bonding of the stratum and substrate of the composite structure in context of the present problem which serves as one of the major highlights of the study.

• Restorative Dentistry and Endodontics
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• v.25 no.4
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• pp.550-560
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• 2000

In this study, shear bond strength of two bonding systems were measured and appearance of dentin surfaces were observed with SEM according to the storage time of eugenol on dentin surface, thus evaluated the effect of eugenol on bond strength of two dentin bonding systems. Control groups were directly bonded to dentin surface with One Step, Prime & Bond 2.1. Experimental groups were divided into experimental I and II according to dentin bonding agents. After eugenol application, dentin surfaces were bonded with One Step and Prime & Bond 2.1 according to the each storage time of immediately, 3min, 24hour, 48hour and 1week, and then control and experimental groups were filled with light cured composite resin(Z-100). After 24 hours water storage at $37^{\circ}C$, all samples were subjected to a shear load to fracture at a cross head 1.0mm/min with Instron universal testing machine(No. 4467). Etched dentin surface storaged for each time of immediately, 3min, 24hour, 48hour and 1 week after eugenol application were observed under Scanning Electron Microscope(Hitachi S-2300) at 20kvp. The data were evaluated statistically with two-way ANOVA and Tukey's HSD. The results were as follows; 1. Shear bond strengths were higher in control groups than in the experimental groups. 2. As storage time was increased after eugenol application, the shear bond strengths were decreased in experimental groups. 3. In experimental I, II the shear bond strengths were the lowest in which storage time was 1 week after eugenol application. 4. As storage time was increased after eugenol application, etched dentin surfaces showed obstructed dentinal tubule.

• Korean Journal of Materials Research
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• v.15 no.11
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• pp.711-716
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• 2005

The effects of change in the component of bonding materials in carbon nanotube cathode (CNT-cathode) on field enhancement and field emission characteristics were investigated. The field enhancement factor$\beta$ was dependent on the electrical conductivity of the bonding materials. The use of frit glass as a bonding material showed a higher field enhancement factor and better field emission characteristics than an Ag paste. The reason for why the frit glass showed better field emission characteristics can be summarized as follows. First, a frit glass improves the real aspect ratio of CNTs compared to an Ag paste. Second, the number of CNTs in CNT-cathodes is considerably reduced because the CNTs were extensively oxidized during $390^{\circ}C$ heat treatment in air atmosphere in the case of Ag paste.

• Journal of the Korean Society of Industry Convergence
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• v.15 no.4
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• pp.111-115
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• 2012

Ultrasonic meching technoloy has been developed over recent years for wire bonding.In this study, ultrasonic welding horn is analysed and designed with FEM, then manufactured based on it. The wire bonding mechine has been designed by conical horn model with very easy to come by and is readily accessible. The analysis is carried out by SoldEdge & Ansys software.

• Journal of the Korean Society of Industry Convergence
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• v.15 no.1
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• pp.37-42
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• 2012

Trends in semiconductor equipment industry are to reduce the cost of producing semiconductor, semiconductor process development, facility development, and the minimum investment in terms of cost and quality. Semiconductor equipments are being considered to review and development is proceeding at the same time. In the first part of the semiconductor assembly process, in which the importance of die bonding process is emerging, a wide leadframe type die bonding machine is demanded for productivity. Die bonding machine was designed through experiments and by trial and error. It costs a lot of time and financial burden. The purpose of this study is to solve these problems by using the CAE tool 3G. By using finite element method, thermal analysis of die bonding machine to the various widths leadframe die bonder machine rail is performed for design.