• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.65-70
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• 2021

In this study, interfacial properties and mechanical properties of joints were reported after Cu pads finished with organic solderability preservative (OSP) on flame retardant-4 (FR-4) printed circuit board (PCB) and electronic components were joined with a Sn-57Bi-1Ag solder paste by using a laser bonding process. The laser bonding process was performed under various bonding conditions with changing a laser power and a bonding time and effects of bonding conditions on interfacial and mechanical properties of joints were analyzed. In order to apply for industry, properties of bonding joints using a reflow bonding process which are widely used were compared. When the laser bonding process were performed, we observed that Cu₆Sn₅ intermetallic compounds (IMCs) were fully formed at the interface although the bonding times were very short about 2 and 3 s. Furthermore, void formations of the joints by using the laser bonding process were suppressed at the joints with comparing to the reflow bonding process and shear strengths of bonding joints were higher than that by using the reflow bonding process. Therefore, in spite of a very short bonding time, it is expected that joints will be stably formed and have a high mechanical strength by using the laser bonding process.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.61-66
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• 2010

Cu-Cu thermo-compression bonding process was successfully developed as functions of the deposited Cu thickness and $Ar+H_2$ forming gas annealing conditions before and after bonding step in order to find the low temperature bonding conditions of 3-D integrated technology where the interfacial toughness was measured by 4-point bending test. Pre-annealing with $Ar+H_2$ gas at $300^{\circ}C$ is effective to achieve enough interfacial adhesion energy irrespective of Cu film thickness. Successful Cu-Cu bonding process achieved in this study results in delamination at $Ta/SiO_2$ interface rather than Cu/Cu interface.

• The Journal of the Korean dental association
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• v.55 no.12
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• pp.850-860
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• 2017

Orthodontic treatment with premolar extraction is usually performed to correct bialveolar protrusion. These methods require the use of stiff rectangular working archwire which requires lengthy alignment and leveling before insertion. In this case report, interproximal reproximation was performed instead of extraction. To establish clearance between the archwire and resin domes fixing the archwire, an archwire was inserted into a water-soluble tube before fabricating resin domes. This tube is solved away by the saliva. During fabrication of resin domes, the archwire was deflected intentionally reflecting the displacement of teeth from their ideal position. This can be called as deflection-based bonding (DBB) technique. DBB is different from conventional method of positioning the brackets on its ideal position and then inserting an archwire to align the brackets. Because the orthodontic force of the archwire comes from its deflection from passive configuration, deflecting an archwire as needed can move the teeth more predictably than just bonding brackets on its ideal position. Also, areas with good alignment before orthodontic treatment can be maintained simply by not deflecting the archwire during bonding in these areas. After initial alignment, interproximal reproximation was performed to create 4.8 mm space in the maxillary arch and 4.2 mm space in the mandibular arch. These spaces were closed using orthodontic mini-implant anchorage thus retracting the maxillary incisors 4 mm posteriorly accompanied with 0.7 mm and 0.3 mm distal movement of right and left molars. By using interproximal reproximation and water-soluble tube with DBB, mild bialveolar protrusion was successfully treated without extraction.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.8
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• pp.4756-4762
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• 2014

Damaged wind turbine blades are repaired conventionally using a hand lay-up method with epoxy, where the bonding strength is not high. Epoxy has poor curing characteristics at low temperatures. The infusion method with polyester was proposed. Infusion method is believed to distribute resin uniformly. Polyester is used because it hardens better than epoxy at low temperatures. At room temperature, the proposed method increased the bonding strength by 77.7% compared to the conventional method. Using the proposed method at 15 and $5^{\circ}C$, the bonding strength increased compared to the conventional method. This paper proposes a new method for repairing wind turbine blades, even at temperatures where the conventional method cannot be used because epoxy resin does not harden. The bonding strength of the proposed method at low temperatures is higher than that of the conventional method at room temperature.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.133-140
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• 2019

The effects of thermal cycle conditions on the bonding strength and crack propagation behaviors in electroplated Cr/electroplated Ni-P coatings were systematically evaluated. 1^st heat treatment was performed at 500℃ for 3 hours after electroplating Ni-P, and then, 2^nd heat treatment was performed at 750℃ for 6 hours after electroplating Cr. The measured bonding strength by ASTM C633 were around 25.6 MPa before thermal cycling, while it increased to 47.6 MPa, after 1,000 cycles. Increasing thermal cycles led to dominant fail mode with cohesive failure inside adhesive, which seemed to be closely related to the increasing bonding strength possibly not only due to higher Cr surface roughness, but also to penetrated channeling crack density. Also, increasing density of penetrated channeling cracks in electroplating Cr layer led to slightly stronger bonding strength due to mechanical interlocking effects of adhesive inside channeling cracks.

• Journal of Welding and Joining
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• v.30 no.3
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• pp.26-31
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• 2012

Three-dimensional integrated circuit (3D IC) technology has become increasingly important due to the demand for high system performance and functionality. We have evaluated the effect of Buffered oxide etch (BOE) on the interfacial bonding strength of Cu-Cu pattern direct bonding. X-ray photoelectron spectroscopy (XPS) analysis of Cu surface revealed that Cu surface oxide layer was partially removed by BOE 2min. Two 8-inch Cu pattern wafers were bonded at $400^{\circ}C$ via the thermo-compression method. The interfacial adhesion energy of Cu-Cu bonding was quantitatively measured by the four-point bending method. After BOE 2min wet etching, the measured interfacial adhesion energies of pattern density for 0.06, 0.09, and 0.23 were $4.52J/m^2$, $5.06J/m^2$ and $3.42J/m^2$, respectively, which were lower than $5J/m^2$. Therefore, the effective removal of Cu surface oxide is critical to have reliable bonding quality of Cu pattern direct bonds.

• Restorative Dentistry and Endodontics
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• v.21 no.1
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• pp.187-201
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• 1996

The purpose of this study was to evaluate the sealing ability of a calcium hydroxide plug treated with a bonding agent. Ninety extracted human anterior teeth and premolars with single canal were used in this study. Crowns were removed. the canal's were instrumented. and the roots were randomly divided into three groups of 30 each. In control group. a single apical seat was prepared with #60 K file 1mm short of the apex and the root canal was obturated with Gutta-percha and Sealapex by the lateral condensation method. In experimental group 1 and group 2. to prepare an apical isthmus of 1mm in length. the first apical seat was prepared with a #45 K file 1mm short of the anatomical apex and with a #60 K file 2mm short for the second apical seat. Dry calcium hydroxide powders were packed in the apical isthmus with a hand plugger and #60 K file and then. the root canal was obturated with Gutta-percha and Seal apex by the lateral condensation method. In experimental group 2. following an application of the bonding agent to the plug. the root canal was obturated in the same way. The teeth of each group were immersed in a 2% methylene blue dye solution. for 1, 2, and 4 weeks. The distance from the tip of the cone to the deepest penetration was measured using the Tool maker's microscope. The results were as follows : 1. The teeth having the calcium hydroxide plug treated with the dentin bonding agent (experimental group 2) showed the lowest leakage with 1.4705mm and the control group without apical plug(no apical isthmus) showed the highest leakage with 3.1735mm. 2. The control group without apical plug showed higher leakage than experimental group 1 having the calcium hydroxide plug treated without the dentin bonding agent(p>0.05). 3. The control group without apical plug and experimental group 1, having the calcium hydroxide plug treated without the dentin bonding agent. showed higher leakage than experimental group 2. having the calcium hydroxide plug treated with the dentin bonding agent(p<0.001). 4. The immersion time had no significant effect on the degree of leakage. In conclusion, the results showed that the calcium hydroxide plug treated with the dentin bonding agent could decrease the microleakage from the root apex effectively.

• Restorative Dentistry and Endodontics
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• v.30 no.4
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• pp.283-293
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• 2005

The purpose of this study was to evaluate the effect of dual bonding technique by comparing microshear bond strength between two different luting methods of resin cement to tooth dentin. Three dentin bonding systems(All-Bond 2, One-Step, Clearfil SE Bond), two temporary cements (Propac, Freegenol) were used in this study. In groups used conventional luting procedure, dentin surfaces were left untreated. In groups used dual bonding technique, three dentin bonding systems were applied to each dentin surface. All specimens were covered with each temporary cement. The temporary cements were removed and each group was treated using one of three different dentin bonding system. A resin cement was applied to the glass cylinder surface and the cylinder was bonded to the dentin surface. Then, micro-shear bond strength test was performed. For the evaluation of the morphology at the resin/dentin interface, SEM examination was also performed. 1. Conventional luting procedure showed higher micro-shear bond strengths than dual boning technique. However, there were no significant differences. 2. Freegenol showed higher micro-shear bond strengths than Propac, but there were no significant differences. 3. In groups used dual bonding technique, SE Bond showed significantly higher micro-shear bond strengths in One-Step and All-Bond 2 (p<0.05), but there was no significant difference between One-Step and All-Bond 2. 4. In SEM observation, with the use of All-Bond 2 and One-Step, very long and numerous resin tags were observed. This study suggests that there were no findings that the dual bonding technique would be better than the conventional luting procedure.

• Restorative Dentistry and Endodontics
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• v.21 no.2
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• pp.585-601
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• 1996

The purpose of this study was to elucidate the effect of blood-and saliva-contamination during dentin pretreatment procedure on tensile bond strength, and to investigate the effect of contaminant-removing treatments on the recovery of bond strength of dentin bonding agents. Dentin specimens prepared from freshly extracted bovine mandibular anterior teeth were divided into non-contaminated control and contaminated experimental groups. The specimens of the contaminated group were contaminated with saliva or blood after etching or priming procedure, followed by contaminant-removing treatments. All the specimens were bonded with All Bond$^{(R)}$ 2 dentin bonding agent and Bisfil$^{TM}$ composite resin or Scotchbond$^{TM}$ Multipurpose and Z100. After all the bonded specimens were stored in $37^{\circ}C$ distilled water for 24 hours, tensile bond strengths were measured. The contaminated dentin and fractured dentin surfaces were examined under the scanning electron microscope. The results were as follows : Contaminated specimens showed lower bond strength than non-contaminated ones regardless of the kind of contaminant, contamination time and contaminant-removing treatments, except specimens which were acid-etched following saliva contamination after etching in All Bond$^{(R)}$ 2 groups (p<0.05). Blood contaminant resulted in much bond strength decrease than saliva ones (p<0.01), and contamination after priming resulted in much decrease in bond strength than after etching (p<0.01). Re-etching resulted in increase of bond strength in the specimens contaminated with saliva after etching but not in blood contaminated ones. Re-priming resulted in increase of bond strength in the specimens contaminated after priming regardless of the kind of contaminant.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.7
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• pp.4357-4363
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• 2015

This study is to compare the differences of bonding strength based on the Degassing temperatures and various opaque materials for Ni-Cr alloy specimen which does not contain beryllium(Be). Numerous comparison tests have been performed to measure the bonding strength by experimenting 3-point flexural rigidity tests in order to find out ways of stabilization and enhancement of bonding strength between metal and porcelain. AVOVA, surface component observation experiment by SAM/EDS, and Tukey's HSAD posteriori tests results are as follows: First, The bonding strength in all groups has exceeded the minimum (25MPa) of ISO9693 bonding strength regulation for dental mental-porcelain specimen. Second, The bonding strength of Group V1 was $32.37{\pm}1.91MPa$, $38.25{\pm}1.38MPa$ in Group V2, $46.43{\pm}2.14MPa$ in Group V3 and $47.21{\pm}1.72MPa$ Group V4. The difference has been statistically meaningful. Tukey's HSAD posteriori tests results have shown that the bonding strength in Group V4 was higher than that of Group V1. Third, the bonding strength between metal and porcelain without degassing process was higher than that of with degassing process, and the bonding strength of powder opaque was higher than that of paste opaque. Fourth, Group V4 has ranked the highest on the comparison table of metal and porcelain bonding strength.