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http://dx.doi.org/10.6117/kmeps.2019.26.4.133

Thermal Cycle Reliabilties and Cracking Characteristics of Electroplated Cr/Ni-P Coatings  

Lee, Jina (School of Materials Science and Engineering, Andong National University)
Son, Kirak (School of Materials Science and Engineering, Andong National University)
Lee, Kyu Hwan (Surface Technology Division, Korea Institute of Materials Science)
Park, Young-Bae (School of Materials Science and Engineering, Andong National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.26, no.4, 2019 , pp. 133-140 More about this Journal
Abstract
The effects of thermal cycle conditions on the bonding strength and crack propagation behaviors in electroplated Cr/electroplated Ni-P coatings were systematically evaluated. 1st heat treatment was performed at 500℃ for 3 hours after electroplating Ni-P, and then, 2nd heat treatment was performed at 750℃ for 6 hours after electroplating Cr. The measured bonding strength by ASTM C633 were around 25.6 MPa before thermal cycling, while it increased to 47.6 MPa, after 1,000 cycles. Increasing thermal cycles led to dominant fail mode with cohesive failure inside adhesive, which seemed to be closely related to the increasing bonding strength possibly not only due to higher Cr surface roughness, but also to penetrated channeling crack density. Also, increasing density of penetrated channeling cracks in electroplating Cr layer led to slightly stronger bonding strength due to mechanical interlocking effects of adhesive inside channeling cracks.
Keywords
Cr/Ni-P plating; thermal cycle; penetrated channeling crack; bonding strength;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
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