Effect of BOE Wet Etching on Interfacial Characteristics of Cu-Cu Pattern Direct Bonds for 3D-IC Integrations |
Park, Jong-Myeong
(School of Materials Science and Engineering, Andong National University)
Kim, Su-Hyeong (MSP Center, Seoul Technopark) Kim, Sarah Eun-Kyung (Graduate School of NID Fusion Technology, Seoul National University of Science and Technology) Park, Young-Bae (School of Materials Science and Engineering, Andong National University) |
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