• Korean Journal of Metals and Materials
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• v.47 no.9
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• pp.591-596
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• 2009

$TiN_xO_y/TiN_x$ multi-layer thin films with a high resistance(${\sim}k{\Omega}$) were deposited on $SiO_2/Si$ substrates at room temperature by sputtering. The $TiN_x$ thin films show island and smooth surface morphology in samples prepared by ${\alpha}$ and RF magnetron sputtering, respectively. $TiN_xO_y/TiN_x$ multi-layer in has been developed to control temperature coefficient of resistance(TCR) by the incorporation of $TiN_x$ layer(positive TCR) inserted into $TiN_xO_y$ layers(negative TCR). Electrical and structural properties of sputtered $TiN_xO_y/TiN_x$ multi-layer films were investigated as a function of annealing temperature. In order to achieve a stable high resistivity, multi-layer films were annealed at various temperatures in oxygen ambient. Samples annealed at $700^{\circ}C$ for 1 min exhibited good TCR value of approximately $-54 ppm/^{\circ}C$ and a stable high resistivity around $20k{\Omega}/sq$. with good reversibility.

• Journal of the Korea Institute of Information Security & Cryptology
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• v.12 no.3
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• pp.77-85
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• 2002

A Research of binary random sequence generator that uses a linear shift register had been studied since the 1970s. These generators were used in stream cipher. In general, the binary random sequence generator consists of linear shift registers that generate sequences of maximum period and a nonlinear filter function or a nonlinear combination function to generate a sequence of high linear complexity. Therefore, To generate a sequence that have long period as well as high linear complexity becomes an important factor to estimate safety of stream cipher. Usually, the maximum period of the sequence generated by a linear feedback shift register with L resistors is less than or equal to $2^L$-1. In this paper, we propose new binary random sequence generator that consist of L registers and 2 sub-characteristic polynomials. According to an initial state vector, the least period of the sequence generated by the proposed generator is equal to or ions than it of the sequence created by the general linear feedback shift register, and its linear complexity is increased too.

• The Journal of the Korea institute of electronic communication sciences
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• v.16 no.1
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• pp.69-74
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• 2021

This paper introduces a low-power voltage-controlled oscillator(VCO) with filters that consist of resistors and capacitors. The proposed VCO contains a 5-stage current mode buffer, and each buffer cell has a resistor-capacitor filter that connects input and output terminals. The filter adds a zero to the buffer cell. Because the zero moves the oscillation condition to high frequencies, the proposed VCO can generate a high frequency clock with low power consumption. The proposed circuit has been designed with 0.18 ㎛ CMOS process. The power consumption is 9.83 mW at 2.7 GHz. The proposed VCO shows 3.64 pJ/Hz in our simulation study, whereas the conventional circuit shows 4.79 pJ/Hz, indicating that our VCO achieves 24% reduction in power consumption.

• The Journal of the Korea institute of electronic communication sciences
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• v.18 no.2
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• pp.379-386
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• 2023

When patients suffer from finger injuries, their finger joints can become stiff and inflexible due to decreased ability to exercise the finger tendons. This can lead to a loss of strength and difficulty using their hands. To address this, it is important to provide patients with consistent rehabilitation treatment that can help restore finger flexibility and strength simultaneously. In this study, we propose wearable gloves that use FSRs (force sensitive resistors) for finger strength training. The glove is designed to be adjustable using rubber bands and a custom PCB is designed for signal acquisition. For the evaluation of finger strength training, the result was analyzed in four cases. We suggest a vector that represents the center of five finger forces, and the result shows that the vector can indicate the level of force balance.

• Journal of Advanced Marine Engineering and Technology
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• v.38 no.1
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• pp.48-55
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• 2014

These Xenon flashlamp power supply for Ultra Violet has converter with high voltage conversion ratio. General model is composed of transformer with high voltage conversion ratio and voltage doubler rectifier circuit. Purpose of power supply leads dielectric breakdown of Xenon flashlamp and passes current rapidly. When passing current, it has to limit current to avoid over-heat, damage of electrode and acceleration of gas oxidation which are cause of performance degradation of lamps. Generally, inductors and resistors, which are called as "Ballast," are used to limit currents. Generally, Transformer has high turn ratio to make high voltages. But we can get high voltages using the transformer with low turn ratio which is driven with self resonance. Also, an advantage of self resonance is to make a circuit simply through impedance of transformer in resonance frequency which filters output voltage. As using an unique impedance of transformer, the circuit does not need other impedance elements like the ballast. So the power supply assures high efficiency of the arc discharge.

• Applied Chemistry for Engineering
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• v.21 no.4
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• pp.411-416
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• 2010

In this research, we intended to improve the tolerance of thick film resistor using photosensitive polymer resistor paste which was fabricated with alkali-solution developable photosensitive resin and conductive carbon black. At first, we investigated the effect of the selection of carbon black and photosensitive resin on the resistance range and tolerance level of polymer thick film resistor (PTFR). And then, a difference in resistance tolerance was evaluated according to the coating methods of photosensitive resistor paste on test board. In case that the photosensitive resistor paste was coated on whole surface of test board using screen printing, large positional tolerance was obtained because the formation of the thick film with uniform thickness was difficult. On the other hand, when the paste was coated with roller, the resistive thick film with uniform thickness was formed on the whole board area and the result of resistance evaluation showed low tolerance in ${\pm}10%$ range. The tolerance of PTFR could be improved by combination of the precise patterning using photo-process and the coating process for the resistive thick film with uniform thickness.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.1
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• pp.31-38
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• 2003

In the current electronic technology atmosphere, MEMS (Microelectromechanical System) technology is regarded as one of promising device manufacturing technologies to realize market-demanding device properties. In the packaging of MEMS devices, the packaged structure must maintain hermeticity to protect the devices from a hostile atmosphere during their operations. For such MEMS device vacuum packaging, we introduce the LTCC (Low temperature Cofired Ceramic) packaging technology, in which embedded passive components such as resistors, capacitors and inductors can be realized inside the package. The technology has also the advantages of the shortened length of inner and surface traces, reduced signal delay time due to the multilayer structure and cost reduction by more simplified packaging processes owing to the realization of embedded passives which in turn enhances the electrical performance and increases the reliability of the packages. In this paper, the leakage rate of the LTCC package having several interfaces was measured and the possibility of LTCC technology application to MEMS devices vacuum packaging was investigated and it was verified that improved hermetic sealing can be achieved for various model structures having different types of interfaces (leak rate: stacked via; $4.1{\pm}1.11{\times}10^{-12}$/ Torrl/sec, LTCC/AgPd/solder/Cu-tube; $3.4{\pm}0.33{\times}10^{-12}$/ Torrl/sec). In real application of the LTCC technology, the technology can be successfully applied to the vacuum packaging of the Infrared Sensor Array and the images of light-up lamp through the sensor way in LTCC package structure was presented.

• Korean Journal of Materials Research
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• v.11 no.7
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• pp.562-568
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• 2001

Devitrifiable solder glass/$ZrB_2$ sintered composites were prepared by using glass with the composition of $60ZnO-20B_2O_3-10SiO_2-10PbO$(in wt%) and $ZrB_2$, powder as starting materials under the $N_2$atmosphere. $ZrB_2$which the good conduction materials showed sensitive oxidation characteristics, because some parts of the $ZrB_2$in specimens changed into the insulated phase of $ZrO_2$. These Phenomena would be estimated that it caused a few amount of residual oxygen in the furnace and/or specimens and the coordination number change of $B_2O_3$ in the glass. The sintering temperature and the mixed ratios of each phase were control of large ranged the resistivity ranged from 10 to 10$^{3}{\Omega}/cm^2$ orders, and to make a conductible microstructure. From these results, it would be explained that the conduction path of $ZrB_2$particles built up within sintered glass matrix.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.6
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• pp.2747-2753
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• 2011

In this paper, a PWM current-mode DC-DC boost converter for mobile phone flash application has been proposed. The converter which is operated with 5 Mhz high switching frequency is capable of reducing mounting area of passive devices such as inductor and capacitor, consequently is suitable for compact mobile phones. This boost converter consists of a power stage and a control block. Circuit elements of the power stage are inductor, output capacitor, MOS transistors and feedback resistors. Meanwhile, the control block consists of pulse width modulator, error amplifier, oscillator etc. Proposed boost converter has been designed and verified in a $0.5\;{\mu}m$ 1-poly 2-metal CMOS process technology. Simulation results show that the output voltage is 4.26 V in 3.7 V input voltage, output current 100 mA which is larger than 25 ~ 50 mA in conventional 500 Khz driven converter when the duty ratio is 0.15.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.36C no.5
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• pp.27-37
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• 1999

A CMOS ReadOut Integrated Circuit (ROlC) for InfraRed Focal Plane Array (IRFPA) detector is presented, which is a key component in uncooled thermal imaging systems. The ROIC reads out signals from $64\times64$ Barium Strontium Titanate (BST) infrared detector array, then outputs pixel signals sequentially after amplifying and noise filtering. Various design requirements and constraints have been considered including impedance matching, low noise, low power dissipation and small detector pitch. For impedance matching between detector and pre~amplifier, a new circuit based on MOS diode structure is devised, which can be easily implemented using standard CMOS process. Also, tunable low pass filter with single~pole is used to suppress high frequency noise. In additions, a clamping circuit is adopted to enhance the signal~to-noise ratio of the readout output signals. The $64\times64$ IRFPA ROIC is designed using $0.65-\mu\textrm{m}$ 2P3M (double poly, tripple metal) N~Well CMOS process. The core part of the chip contains 62,000 devices including transistors, capacitors and resistors on an area of about $6.3-mm\times6.7-mm$.