대한금속재료학회지 (Korean Journal of Metals and Materials)

  • 제47권9호
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  • Pages.591-596
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  • 2009
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  • 1738-8228(pISSN)
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  • 2288-8241(eISSN)
대한금속재료학회 (The Korean Institute of Metals and Materials)
권호 표지

TiNxOy/TiNx 다층 박막을 이용한 고저항 박막 저항체의 구조 및 전기적 특성평가

Structural and Electrical Properties High Resistance of TiNxOy/TiNx Multi-layer Thin Film Resistors

  • 박경우 (충남대학교 나노정보시스템공학과) ;
  • 허성기 (충남대학교 나노정보시스템공학과) ;
  • ;
  • 안준구 (충남대학교 나노정보시스템공학과) ;
  • 윤순길 (충남대학교 나노정보시스템공학과)
  • Park, Kyoung-Woo (School of Nano Science and Technology, Chungnam National University) ;
  • Hur, Sung-Gi (School of Nano Science and Technology, Chungnam National University) ;
  • Nguyen, Duy Cuong (School of Nano Science and Technology, Chungnam National University) ;
  • Ahn, Jun-Ku (School of Nano Science and Technology, Chungnam National University) ;
  • Yoon, Soon-Gil (School of Nano Science and Technology, Chungnam National University)
  • 투고 : 2009.04.17
  • 발행 : 2009.09.25
⟨ 이전 논문 다음 논문 ⟩

초록

$TiN_xO_y/TiN_x$ multi-layer thin films with a high resistance(${\sim}k{\Omega}$) were deposited on $SiO_2/Si$ substrates at room temperature by sputtering. The $TiN_x$ thin films show island and smooth surface morphology in samples prepared by ${\alpha}$ and RF magnetron sputtering, respectively. $TiN_xO_y/TiN_x$ multi-layer in has been developed to control temperature coefficient of resistance(TCR) by the incorporation of $TiN_x$ layer(positive TCR) inserted into $TiN_xO_y$ layers(negative TCR). Electrical and structural properties of sputtered $TiN_xO_y/TiN_x$ multi-layer films were investigated as a function of annealing temperature. In order to achieve a stable high resistivity, multi-layer films were annealed at various temperatures in oxygen ambient. Samples annealed at $700^{\circ}C$ for 1 min exhibited good TCR value of approximately $-54 ppm/^{\circ}C$ and a stable high resistivity around $20k{\Omega}/sq$. with good reversibility.

키워드

참고문헌

  1. F. Kruger, British Patent 157, 909 (1962)
  2. D. W. Braudaway, IEEE Trans. Instrum. Meas. 48, 878 (1999) https://doi.org/10.1109/19.799639
  3. M. Ohring, The Materials Science of Thin Films, Academic Press, p. 436 (1992)
  4. S. G. Hur, D. J. Kim, B. D. Kang, and S. G. Yoon, J. Electrochemical Society 152, G472-G476 (2005) https://doi.org/10.1149/1.1901675
  5. N. D. Cuong, D. J. Kim, B. D. Kang, and S. G. Yoon, J. Electrochemical Soc. 153, G856-G859 (2006) https://doi.org/10.1149/1.2219707
  6. K. H. Kim, J.-M. Yang, C. W. Ahn, H. S. Seo, I.-S. Kang, and W.-J. Hwang, J. Kor. Inst. Met. & Mater. 46, 458 (2008)
  7. S. G. Hur, D. J. Kim, B. D. Kang, and S. G. Yoon, J. Vac. Sci. Technol. B 22, 2698 (2004) https://doi.org/10.1116/1.1815313
  8. L. Maissel and R. Glang, Handbook of Thin Film Technology, McGraw-Hill, p. 18-1-18-25 (1970)