• 제목/요약/키워드: resistive states

검색결과 26건 처리시간 0.03초

EMTDC Modeling Method of Resistive type Superconducting Fault Current Limiter

  • Taejeon Huh;Lee, Jaedeuk;Park, Minwon;Yu, In-Keun
    • 한국초전도ㆍ저온공학회논문지
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    • 제5권1호
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    • pp.60-65
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    • 2003
  • An effective modeling and simulation scheme of a resistive type Superconducting fault Current Limiter (SFCL) using PSCAD/EMTDC is proposed in this paper. In case of High Temperature Superconducting (HTS) resistive type fault current limiter current limiting is implemented by the ultra-fast transition characteristics from the superconducting (non-resistive) state to the normal (resistive) state by overstepping the critical current density. The states can generally be divided into three sub-states: the superconducting state the quench state and the recovery state respectively. In order to provide alternative application schemes of a resistive type SFCL, an effective modeling and simulation method of the SFCL is necessary. For that purpose, in this study, an actual experiment based component model is developed and applied for the simulation of the real resistive type SFCL using PSCAD/EMTDC. The proposed simulation scheme can be implemented to the grid system readily under various system conditions including sort of faults and the system capacity as well. The simulation results demonstrate the effectiveness of the proposed model and simulation scheme.

Behavioral Current-Voltage Model with Intermediate States for Unipolar Resistive Memories

  • Kim, Young Su;Min, Kyeong-Sik
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제13권6호
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    • pp.539-545
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    • 2013
  • In this paper, a behavioral current-voltage model with intermediate states is proposed for analog applications of unipolar resistive memories, where intermediate resistance values between SET and RESET state are used to store analog data. In this model, SET and RESET behaviors are unified into one equation by the blending function and the percentage volume fraction of each region is modeled by the Johnson-Mehl-Avrami (JMA) equation that can describe the time-dependent phase transformation of unipolar memory. The proposed model is verified by the measured results of $TiO_2$ unipolar memory and tested by the SPECTRE circuit simulation with CMOS read and write circuits for unipolar resistive memories. With the proposed model, we also show that the behavioral model that combines the blending equation and JMA kinetics can universally describe not only unipolar memories but also bipolar ones. This universal behavioral model can be useful in practical applications, where various kinds of both unipolar and bipolar memories are being intensively studied, regardless of polarity of resistive memories.

Impedance Characterization of Tantalum Oxide Deposited through Pulsed-Laser Deposition

  • Kwon, Kyeong-Woo;Jung, Jin-Kwan;Park, Chan-Rok;Kim, Jin-Sang;Baek, Seung-Hyub;Hwang, Jin-Ha
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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    • pp.207.1-207.1
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    • 2013
  • Tantalum oxide has been extensively investigated as one of the promising Resistive switching materials applicable to Resistive Dynamic Access Memories. Impedance spectroscopy offers simultaneous measurements of electrical and dielectric information, separation of electrical origins among bulk, grain boundaries, and interfaces, and the monitoring of electrical components. Such benefits have been combined with the resistive states of resistive switching devices which can be described in terms of equivalent circuits involving resistors, capacitors, and inductors, The current work employed pulsed laser deposition in order to prepare the oxygen-deficient tantalum oxide. The fabricated devices were controlled between highresistance and low-resistance states in controlled current compliance modes. The corresponding electrical phenomena were monitored both in the dc-based current-voltage characteristics and in the ac-based impedance spectroscopy. The origins of the electrical switching are discussed towards optimized ReRAM devices in terms of interfacial effects.

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나노 적층 구조를 응용한 저항성 기반 비휘발성 메모리 소자 특성 제어 (Control of Charge Transports in Nonvolatile Resistive Memory Devices through Embedded Nanoscale Layers)

  • 유일환;황진하
    • 한국세라믹학회지
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    • 제46권3호
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    • pp.336-343
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    • 2009
  • Nickel oxide thin films exhibit the resistive switching as a function of applied voltages. The switching phenomena involve low and high resistance states after electroforming. The electrical features are believed to be associated with the formation and rupture of filaments. The set and reset behaviors are controlled by the oxidation and reduction of filaments. The indirect evidence of filaments is corroborated by the presence of nanocrystalline nickel oxides found in high-resolution transmission electron microscopy. The insertion of insulating layers seems to control the current-voltage characteristics by preventing the continuous formation of conductive filaments, potentially leading to artificial control of resistive behaviors in NiO-based systems.

Resistive Switching in Vapor Phase Polymerized Poly (3, 4-ethylenedioxythiophene)

  • ;성명모
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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    • pp.384-384
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    • 2012
  • We report nonvolatile memory properties of poly (3, 4-ethylenedioxythiophene) (PEDOT) thin films grown by vapor phase polymerization using FeCl3 as an oxidant. Liquid-bridge-mediated transfer method was employed to remove FeCl3 for generation of pure PEDOT thin films. From the electrical measurement of memory device, we observed voltage induced bipolar resistive switching behavior with ON/OFF ratio of 103 and reproducibility of more than 103 dc sweeping cycles. ON and OFF states were stable up to 104 seconds without significant degradation. Cyclic voltammetry data illustrates resistive switching effect can be attributed to formation and rupture of conducting paths due to oxidation and reduction of PEDOT. The maximum current before reset process was found to be increase linearly with increase in compliance current applied during set process.

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상온에서 RF 스퍼터링 방법으로 증착한 Hafnium Oxide 박막의 저항 변화 특성 (Resistive Switching Characteristics of Hafnium Oxide Thin Films Sputtered at Room Temperature)

  • 한용;조경아;윤정권;김상식
    • 한국전기전자재료학회논문지
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    • 제24권9호
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    • pp.710-712
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    • 2011
  • In this study, we fabricate resistive switching random access memory (ReRAM) devices constructed with a Al/$HfO_2$/ITO structure on glass substrates and investigate their memory characteristics. The hafnium oxide thin film used as a resistive switching layer is sputtered at room temperature in a sputtering system with a cooling unit. The Al/$HfO_2$/ITO device exhibits bipolar resistive switching characteristics, and the ratio of the high resistance (HRS) to low resistance states (LRS) is more than 60. In addition, the resistance ratio maintains even after $10^4$ seconds.

Bipolar Resistance Switching Characteristics of $NiO_{1+x}$ films with Adding Higher-Valence Impurities

  • 김종기;손현철
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2010년도 하계학술대회 논문집
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    • pp.370-370
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    • 2010
  • The effects of adding higher-valence impurities on the bipolar resistive switching characteristics of Pt/$NiO_{1+x}$/TiN MIM stacks and physical properties were investigated. $NiO_{1+x}$ films with 14% W deposited at 20% oxygen partial pressure exhibited the bipolar resistance switching characteristics in Pt/$NiO_{1+x}$/TiN MIM stacks, while $NiO_{1+x}$ films with 8.2% W show unipolar resistance switching behavior. The relationship of W-doping and the crystallinity was studied by X-ray diffraction. The metallic Ni contents and $WO_x$ binding states with W amount was investigated by XPS. Our result showed that the metallic Ni, $WO_x$ binding states, and crystallinity in $NiO_{1+x}$ played an important role on the bipolar resistive switching.

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전기장 광화학 증착법에 의한 직접패턴 비정질 FeOx 박막의 제조 및 저항변화 특성 (Electric-field Assisted Photochemical Metal Organic Deposition for Forming-less Resistive Switching Device)

  • 김수민;이홍섭
    • 마이크로전자및패키징학회지
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    • 제27권4호
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    • pp.77-81
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    • 2020
  • Resistive RAM (ReRAM)은 전이금속 산화물의 저항변화 특성을 이용하는 차세대 비휘발 메모리로 전이금속산화물 내의 산소공공의 재분포를 통한 저항변화 특성을 이용한다. 따라서 저항변화 특성을 위해 전이금속산화물 내에는 일정량 이상의 산소공공이 요구되며 이를 위해서는 박막 형성 공정에서 산화 수를 조절할 수 있는 공정이 필요하다. 본 연구에서는 직접패턴이 가능한 photochemical metal organic deposition (PMOD) 공정을 사용하여 UV 노출에 의해 photochemical metal organic precursor의 ligand가 분해되는 과정에서 전기장을 인가하여 박막내의 산화 수를 조절하는 실험을 진행하였다. Electric field assisted PMOD (EFAPMOD) 법을 이용하여 FeOx 박막의 산화 수 조절이 가능함을 x-ray photoelectron spectroscopy (XPS) 분석과 I-V 측정을 통하여 확인하였으며, EFAPMOD 공정 중 인가하는 전압의 크기를 조절하여 박막의 산화 수를 조절할 수 있음을 확인하였다. 따라서 EFAPMOD 공정 중 인가전압의 크기를 이용하여 저항변화 특성에 적합한 적정한 산화수를 가지는 금속산화물 박막을 얻고 그 저항변화 특성을 조정할 수 있음을 확인하였다.

산소공공을 이용한 V2O5 저항성 메모리의 전기적인 동작특성 해석 (Electrical Characteristics Analysis of Resistive Memory using Oxygen Vacancy in V2O5 Thin Film)

  • 오데레사
    • 한국정보통신학회논문지
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    • 제21권10호
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    • pp.1827-1832
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    • 2017
  • 본 연구는 산화물반도체의 저항을 이용한 메모리소자를 만들기 위해서 $V_2O_5$ 를 산소가스를 이용하여 증착하고 열처리를 하였다. 산소의 유량이 많을수록 산소공공의 형성을 위하여 높은 열처리온도가 필요하였으며, 산소공공은 쇼키접합을 형성하면서 전기적인 특성이 저항성 메모리소자에 적합한 구조로 만들어지고 있었다. $V_2O_5$ 박막은 열에 의한 이온화 반응에 의하여 산소공공이 형성되었으며, 전압 혹은 전류제어 가능한 저항성 메모리 소자를 위하여 쇼키접합이 +전압과 -전압에서 균형있게 이루어지는 것이 요구되며, 쇼키접합은 150도 혹은 200도에서 열처리가 이루어진 경우 쇼키접합이 잘 형성되는 것을 확인할 수 있었다. $V_2O_5$ 음이온인 산소공공은 역방향전압 혹은 순방향 전압인지에 따라서 저항이 변하면서 쓰기/지우기 상태로 전기적인 동작이 이루어졌으며 저항성메모리로서 구동을 하는 것을 확인하였다.

Effect of Non-lattice Oxygen Concentration on Non-linear Interfacial Resistive Switching Characteristic in Ultra-thin HfO2 Films

  • 김영재;김종기;목인수;이규민;손현철
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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    • pp.359-360
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    • 2013
  • The effect of electrode and deposition methods on non-linear interfacial resistive switching in HfO2 based $250{\times}250$ nm2 cross-point device was studied. HfO2 based device has the interfacial resistive switching properties of non-linearity and self-compliance current switching. The operating current in HfO2 based device was increased with negatively increasing the heat of formation energy in top electrode. Also, it was investigated that the operating current in HfO2 based device was changed with deposition methods of O3 reactant ALD, H2O reactant ALD and dc reactive sputtering, resulting the magnitude of the operating current and on/off ratio in order of HfO2 films deposited by dc reactive sputtering, H2O reactant ALD, and O3 reactant ALD. To investigate the effect of electrode and deposition methods on operating current of non-linear interfacial resistive switching in the cross-point device, X-ray photoelectron spectroscopy was measured. Through the analysis of O 1s spectra, non-lattice oxygen concentration, which is closely related to oxygen vacancies, was increased in order of Pt, TiN, and Ti top electrodes and in order of O3 reactant ALD, H2O reactant ALD, and O3 reactant ALD, and dc reactive sputtering deposition method. From all results, non-lattice oxygen concentration in ultra-thin HfO2 films play a crucial role in the operating current and memory states (LRS & HRS) in the non-linear interfacial resistive switching.

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