• Title/Summary/Keyword: resistive states

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EMTDC Modeling Method of Resistive type Superconducting Fault Current Limiter

  • Taejeon Huh;Lee, Jaedeuk;Park, Minwon;Yu, In-Keun
    • Progress in Superconductivity and Cryogenics
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    • v.5 no.1
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    • pp.60-65
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    • 2003
  • An effective modeling and simulation scheme of a resistive type Superconducting fault Current Limiter (SFCL) using PSCAD/EMTDC is proposed in this paper. In case of High Temperature Superconducting (HTS) resistive type fault current limiter current limiting is implemented by the ultra-fast transition characteristics from the superconducting (non-resistive) state to the normal (resistive) state by overstepping the critical current density. The states can generally be divided into three sub-states: the superconducting state the quench state and the recovery state respectively. In order to provide alternative application schemes of a resistive type SFCL, an effective modeling and simulation method of the SFCL is necessary. For that purpose, in this study, an actual experiment based component model is developed and applied for the simulation of the real resistive type SFCL using PSCAD/EMTDC. The proposed simulation scheme can be implemented to the grid system readily under various system conditions including sort of faults and the system capacity as well. The simulation results demonstrate the effectiveness of the proposed model and simulation scheme.

Behavioral Current-Voltage Model with Intermediate States for Unipolar Resistive Memories

  • Kim, Young Su;Min, Kyeong-Sik
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.13 no.6
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    • pp.539-545
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    • 2013
  • In this paper, a behavioral current-voltage model with intermediate states is proposed for analog applications of unipolar resistive memories, where intermediate resistance values between SET and RESET state are used to store analog data. In this model, SET and RESET behaviors are unified into one equation by the blending function and the percentage volume fraction of each region is modeled by the Johnson-Mehl-Avrami (JMA) equation that can describe the time-dependent phase transformation of unipolar memory. The proposed model is verified by the measured results of $TiO_2$ unipolar memory and tested by the SPECTRE circuit simulation with CMOS read and write circuits for unipolar resistive memories. With the proposed model, we also show that the behavioral model that combines the blending equation and JMA kinetics can universally describe not only unipolar memories but also bipolar ones. This universal behavioral model can be useful in practical applications, where various kinds of both unipolar and bipolar memories are being intensively studied, regardless of polarity of resistive memories.

Impedance Characterization of Tantalum Oxide Deposited through Pulsed-Laser Deposition

  • Kwon, Kyeong-Woo;Jung, Jin-Kwan;Park, Chan-Rok;Kim, Jin-Sang;Baek, Seung-Hyub;Hwang, Jin-Ha
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.207.1-207.1
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    • 2013
  • Tantalum oxide has been extensively investigated as one of the promising Resistive switching materials applicable to Resistive Dynamic Access Memories. Impedance spectroscopy offers simultaneous measurements of electrical and dielectric information, separation of electrical origins among bulk, grain boundaries, and interfaces, and the monitoring of electrical components. Such benefits have been combined with the resistive states of resistive switching devices which can be described in terms of equivalent circuits involving resistors, capacitors, and inductors, The current work employed pulsed laser deposition in order to prepare the oxygen-deficient tantalum oxide. The fabricated devices were controlled between highresistance and low-resistance states in controlled current compliance modes. The corresponding electrical phenomena were monitored both in the dc-based current-voltage characteristics and in the ac-based impedance spectroscopy. The origins of the electrical switching are discussed towards optimized ReRAM devices in terms of interfacial effects.

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Control of Charge Transports in Nonvolatile Resistive Memory Devices through Embedded Nanoscale Layers (나노 적층 구조를 응용한 저항성 기반 비휘발성 메모리 소자 특성 제어)

  • You, Yil-Hwan;Hwang, Jin-Ha
    • Journal of the Korean Ceramic Society
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    • v.46 no.3
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    • pp.336-343
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    • 2009
  • Nickel oxide thin films exhibit the resistive switching as a function of applied voltages. The switching phenomena involve low and high resistance states after electroforming. The electrical features are believed to be associated with the formation and rupture of filaments. The set and reset behaviors are controlled by the oxidation and reduction of filaments. The indirect evidence of filaments is corroborated by the presence of nanocrystalline nickel oxides found in high-resolution transmission electron microscopy. The insertion of insulating layers seems to control the current-voltage characteristics by preventing the continuous formation of conductive filaments, potentially leading to artificial control of resistive behaviors in NiO-based systems.

Resistive Switching in Vapor Phase Polymerized Poly (3, 4-ethylenedioxythiophene)

  • Kalode, P.Y.;Seong, Myeong-Mo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.384-384
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    • 2012
  • We report nonvolatile memory properties of poly (3, 4-ethylenedioxythiophene) (PEDOT) thin films grown by vapor phase polymerization using FeCl3 as an oxidant. Liquid-bridge-mediated transfer method was employed to remove FeCl3 for generation of pure PEDOT thin films. From the electrical measurement of memory device, we observed voltage induced bipolar resistive switching behavior with ON/OFF ratio of 103 and reproducibility of more than 103 dc sweeping cycles. ON and OFF states were stable up to 104 seconds without significant degradation. Cyclic voltammetry data illustrates resistive switching effect can be attributed to formation and rupture of conducting paths due to oxidation and reduction of PEDOT. The maximum current before reset process was found to be increase linearly with increase in compliance current applied during set process.

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Resistive Switching Characteristics of Hafnium Oxide Thin Films Sputtered at Room Temperature (상온에서 RF 스퍼터링 방법으로 증착한 Hafnium Oxide 박막의 저항 변화 특성)

  • Han, Yong;Cho, Kyoung-Ah;Yun, Jung-Gwon;Kim, Sang-Sig
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.24 no.9
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    • pp.710-712
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    • 2011
  • In this study, we fabricate resistive switching random access memory (ReRAM) devices constructed with a Al/$HfO_2$/ITO structure on glass substrates and investigate their memory characteristics. The hafnium oxide thin film used as a resistive switching layer is sputtered at room temperature in a sputtering system with a cooling unit. The Al/$HfO_2$/ITO device exhibits bipolar resistive switching characteristics, and the ratio of the high resistance (HRS) to low resistance states (LRS) is more than 60. In addition, the resistance ratio maintains even after $10^4$ seconds.

Bipolar Resistance Switching Characteristics of $NiO_{1+x}$ films with Adding Higher-Valence Impurities

  • Kim, Jong-Gi;Son, Hyeon-Cheol
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.370-370
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    • 2010
  • The effects of adding higher-valence impurities on the bipolar resistive switching characteristics of Pt/$NiO_{1+x}$/TiN MIM stacks and physical properties were investigated. $NiO_{1+x}$ films with 14% W deposited at 20% oxygen partial pressure exhibited the bipolar resistance switching characteristics in Pt/$NiO_{1+x}$/TiN MIM stacks, while $NiO_{1+x}$ films with 8.2% W show unipolar resistance switching behavior. The relationship of W-doping and the crystallinity was studied by X-ray diffraction. The metallic Ni contents and $WO_x$ binding states with W amount was investigated by XPS. Our result showed that the metallic Ni, $WO_x$ binding states, and crystallinity in $NiO_{1+x}$ played an important role on the bipolar resistive switching.

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Electric-field Assisted Photochemical Metal Organic Deposition for Forming-less Resistive Switching Device (전기장 광화학 증착법에 의한 직접패턴 비정질 FeOx 박막의 제조 및 저항변화 특성)

  • Kim, Su-Min;Lee, Hong-Sub
    • Journal of the Microelectronics and Packaging Society
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    • v.27 no.4
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    • pp.77-81
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    • 2020
  • Resistive RAM (ReRAM) is a strong candidate for the next-generation nonvolatile memories which use the resistive switching characteristic of transition metal oxides. The resistive switching behaviors originate from the redistribution of oxygen vacancies inside of the oxide film by applied programming voltage. Therefore, controlling the oxygen vacancy inside transition metal oxide film is most important to obtain and control the resistive switching characteristic. In this study, we introduced an applying electric field into photochemical metal-organic deposition (PMOD) process to control the oxidation state of metal oxide thin film during the photochemical reaction by UV exposure. As a result, the surface oxidation state of FeOx film could be successfully controlled by the electric field-assisted PMOD (EFAPMOD), and the controlled oxidation states were confirmed by x-ray photoelectron spectroscopy (XPS) I-V characteristic. And the resistive switching characteristics with the oxidation-state of the surface region could be controlled effectively by adjusting an electric field during EFAPMOD process.

Electrical Characteristics Analysis of Resistive Memory using Oxygen Vacancy in V2O5 Thin Film (산소공공을 이용한 V2O5 저항성 메모리의 전기적인 동작특성 해석)

  • Oh, Teresa
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.21 no.10
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    • pp.1827-1832
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    • 2017
  • To observe the characteristics to be a resistive memory of $V_2O_5$ deposited by oxygen various gas flows and annealed, the hysteresis curves of $V_2O_5$ were analyzed. The good resistive memory was obtained from the electrical characteristics of $V_2O_5$ films with the Schottky contact as a result of electron-hole pair, and the oxygen vacancy generated from the annealing process contributes the high quality of Schottky contact and the formation of resistive memories. The balanced Schottky contacts owing to the oxygen vacancy effect as the result of an ionic reaction were formed at the $V_2O_5$ film annealed at $150^{\circ}C$ and $200^{\circ}C$ and the balanced Schottky contact with negative to positive voltages enhanced the electrical operation with write/erase states according to the forward or reverse bias voltages for the resistive memory behavior due to the oxygen vacancy.

Effect of Non-lattice Oxygen Concentration on Non-linear Interfacial Resistive Switching Characteristic in Ultra-thin HfO2 Films

  • Kim, Yeong-Jae;Kim, Jong-Gi;Mok, In-Su;Lee, Gyu-Min;Son, Hyeon-Cheol
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.359-360
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    • 2013
  • The effect of electrode and deposition methods on non-linear interfacial resistive switching in HfO2 based $250{\times}250$ nm2 cross-point device was studied. HfO2 based device has the interfacial resistive switching properties of non-linearity and self-compliance current switching. The operating current in HfO2 based device was increased with negatively increasing the heat of formation energy in top electrode. Also, it was investigated that the operating current in HfO2 based device was changed with deposition methods of O3 reactant ALD, H2O reactant ALD and dc reactive sputtering, resulting the magnitude of the operating current and on/off ratio in order of HfO2 films deposited by dc reactive sputtering, H2O reactant ALD, and O3 reactant ALD. To investigate the effect of electrode and deposition methods on operating current of non-linear interfacial resistive switching in the cross-point device, X-ray photoelectron spectroscopy was measured. Through the analysis of O 1s spectra, non-lattice oxygen concentration, which is closely related to oxygen vacancies, was increased in order of Pt, TiN, and Ti top electrodes and in order of O3 reactant ALD, H2O reactant ALD, and O3 reactant ALD, and dc reactive sputtering deposition method. From all results, non-lattice oxygen concentration in ultra-thin HfO2 films play a crucial role in the operating current and memory states (LRS & HRS) in the non-linear interfacial resistive switching.

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