• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.286-287
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• 2012

Reset-first resistive switching mechanism based on reduction reaction in HfO2-x with oxygen drift-diffusion was studied. we first report that the indirect evidence of local filamentary conductive path formation in bulk HfO2 film with local TiOx region at Ti top electrode formed during forming process and presence of anion-migration at interface between electrode and HfO2 during resistive switching through high resolution transmission electron microscopy (HRTEM), electron disperse x-ray (EDX), and electron energy loss spectroscopy (EELS) mapping. Based on forming process mechanism, we expected that redox reaction from Ti/HfO2 to TiOx/HfO2-x was responsible for an increase of initial current with increasing the post-annealing process. First-reset resistive switching in above $350^{\circ}C$ annealed Ti/HfO2 film was exhibited and the redox phenomenon from Ti/HfO2 to TiOx/HfO2-x was observed with high angle annular dark field (HAADF) - scanning transmission electron microscopy (STEM), EDX and x-ray photoelectron spectroscopy. Therefore, we demonstrated that the migration of oxygen ions at interface region under external electrical bias contributed to bipolar resistive switching behavior.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.28.2-28.2
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• 2011

Resistance random access memory (ReRAM) is a promising candidate for next-generation nonvolatile memory because of its advantageous qualities such as simple structure, superior scalability, fast switching speed, low-power operation, and nondestructive readout. We investigated the resistive switching behavior of tantalum oxide that has been widely used in dynamic random access memories (DRAM) in the present semiconductor industry. As a result, it possesses full compatibility with the entrenched complementary metal-oxide-semiconductor processes. According to previous studies, TiN is a good oxygen reservoir. The TiN top electrode possesses the specific properties to control and modulate oxygen ion reproductively, which results in excellent resistive switching characteristics. This study presents fully room temperature fabricated the TiN/$TaO_x$/Pt devices and their electrical properties for nonvolatile memory application. In addition, we investigated the TiN electrode dependence of the electrical properties in $TaO_x$ memory devices. The devices exhibited a low operation voltage of 0.6 V as well as good endurance up to $10^5$ cycles. Moreover, the benefits of high devise yield multilevel storage possibility make them promising in the next generation nonvolatile memory applications.

• Proceedings of the Materials Research Society of Korea Conference
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• 2005.05a
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• pp.126-126
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• 2005

• Transactions on Electrical and Electronic Materials
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• v.16 no.5
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• pp.290-292
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• 2015

We have reported about bipolar resistive switching effect on Poly[2-methoxy-5-(2-ethylhexyloxy)-1,4-phenylenevinylene]:Graphene oxide composite films, which are sandwiched between aluminum and indium tin oxide electrodes. In this case, I-V sweep curve showed a hysteretic behavior, which varied according to the polarity of the applied voltage bias. The device exhibited excellent switching characteristics, with the ON/OFF ratio being approximately two orders in magnitude. The device had good endurance (10⁵ cycles without degradation) and long retention time (5 × 10³ s) at room temperature. The bistable switching behavior varied according to the trapping and de-trapping of charges on GO sites; the carrier transport was described using the space-charge-limited current (SCLC) model.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.31-35
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• 2020

This study demonstrates metal-oxide based memtransistor device and the gate tunable memristive characteristic using atomic layer deposition (ALD) and ZnO n-type oxide semiconductor. We fabricated a memtransistor device having channel width 70 ㎛, channel length 5 ㎛, back gate, using 40 nm thick ZnO thin film, and measured gate-tunable memristive characteristics at each gate voltage (50V, 30V, 10V, 0V, -10V, -30V, -50V) under humidity of 40%, 50%, 60%, and 70% respectively, in order to investigate the relation between a memristive characteristic and hydrogen doping effect on the ZnO memtransistor device. The electron mobility and gate controllability of memtransistor device decreased with an increase of humidity due to increased electron carrier concentration by hydrogen doping effect. The gate-tunable memristive characteristic was observed under humidity of 60% 70%. Resistive switching ratio increased with an increase of humidity while it loses gate controllability. Consequently, we could obtain both gate controllability and the large resistive switching ratio under humidity of 60%.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.10a
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• pp.15.2-15.2
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• 2011

비휘발성 저항 메모리소자인 resistance random access memory (ReRAM)는 간단한 소자구조와 빠른 동작특성을 나타내며 고집적화에 유리하기 때문에 차세대 메모리소자로써 각광받고 있다. 현재, 이성분계 산화물, 페로브스카이트 산화물, 고체 전해질 물질, 유기재료 등을 응용한 저항 메모리소자에 대한 연구가 활발히 진행되고 있다. 그 중 ZnO를 기반으로 하는 amorphous InGaZnO (a-IGZO) 박막은 active layer 로써 박막트랜지스터 적용 시 우수한 전기적 특성을 나타내며, 빠른 동작특성과 높은 저항 변화율을 보이기 때문에 ReRAM 에 응용 가능한 재료로써 기대되고 있다. 또한 가시광선 영역에서 광학적으로 투명한 특성을 보이기 때문에 투명소자로서도 응용이 기대되고 있다. 본 연구에서는 indium tin oxide (ITO) 투명 전극을 적용한 ITO/a-IGZO/ITO 구조의 투명 소자를 제작하여 저항 메모리 특성을 평가하였다. Radio frequency (RF) sputter를 이용하여 IGZO 박막을 합성하고, ITO 전극을 증착하여 투명 저항 메모리소자를 구현하였고, resistive switching 효과를 관찰하였다. 또한, 열처리를 통해 a-IGZO 박막 내의 Oxygen vacancy와 같은 결함의 정도에 따른 on/off 저항의 변화를 관찰할 수 있었다. 제작된 저항 메모리소자는 unipolar resistive switching 특성을 보였으며, 높은 on/off 저항의 차이를 유지하였다. Scanning electron microscope (SEM)을 통해 합성된 박막의 형태를 평가하였고, X-ray diffraction (XRD) 및 transmission electron microscopy (TEM)을 통해 결정성을 평가하였다. 제작된 소자의 전기적 특성은 HP-4145 를 이용하여 측정하고 비교 분석하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.2
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• pp.81-84
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• 2014

The bipolar resistive switching characteristics of resistive random access memory (ReRAM) based on $HfO_2$ thin films have been demonstrated by using Ag/$HfO_2$/Pt structured ReRAM device. MIcrowave irradiation (MWI) treatment at low temperature was employed in device fabrication with $HfO_2$ thin films as a transition layer. Compared to the as-deposited Ag/$HfO_2$/Pt device, highly improved uniformity characteristics of resistance values and operating voltages were obtained from the MWI treatment Ag/$HfO_2$/Pt ReRAM device. In addition, a stable DC endurance (> 100 cycles) and a high data retention (> $10^4$ sec) were achieved.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.53-58
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• 2022

One of the most promising emerging technologies for the next generation of nonvolatile memory devices based on resistive switching (RS) is the resistive random-access memory mechanism. To date, RS effects have been found in many transition metal oxides. However, no clear evidence has been reported that ZnO-based resistive transition mechanisms could be associated with strong correlation effects. Here, we investigated N, F-co-doped ZnO (NFZO), which shows bipolar RS. Conducting micro spectroscopic studies on exposed surfaces helps tracking the behavioral change in systematic electronic structural changes during low and high resistance condition of the material. The significant difference in electronic conductivity was observed to attribute to the field-induced oxygen vacancy that causes the metal-insulator Mott transition on the surface. In this study, we showed the strong correlation effects that can be explored and incorporated in the field of multifunctional oxide electrons devices.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.2
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• pp.147-152
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• 2016

In this study, we fabricated Ag-based electrochemical metallization memory devices which is also called conductive-bridge random-access memory (CBRAM) in order to investigate the resistive switching behavior depending on the bottom electrode (BE). RRAM cells of two different layer configurations having $Ag/Si_3N_4/TiN$ and $Ag/Si_3N_4/p^+$ Si are studied for metal-insulator-metal (MIM) and metal-insulator-silicon (MIS) structures, respectively. Switching voltages including forming/set/reset are lower for MIM than for MIS structure. It is found that the workfunction different affects the performances.

• Journal of Electrical Engineering and information Science
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• v.3 no.1
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• pp.14-20
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• 1998

The resistive shunting for the fine control of a Direct Energy Transfer(DET) systems is fully developed, but the non-resistive shunting using variable size solar array segments is in progress. This paper presents the spacecraft power control through switching of solar array segments, which uses a fully regulated DET power regulation. This method eliminates a dissipative element and removes the associated design limitations which arise from the dissipative elements for radiating cooling in deep space. The switching shunt regulator comprises the switched Solar Array Shunt(SAS) modules that regulate the solar array power. These SAS modules connect/disconnect the solar array segments to/from the bus according to the loading in the main bus without significant variations in the dissipation level. In this paper, twelve segments are used in the shunting. In order to verify the basis of analysis, the computational result of an analytic loop gain is performed.