• E2M - 전기 전자와 첨단 소재
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• 제9권3호
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• pp.291-297
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• 1996

The surface properties of AI(Si, Cu) alloy film after plasma etching using the chemistries of chlorinated and fluorinated gases with varying the etching time have been investigated using X-ray Photoelectron Spectroscopy. Impurities of C, Cl, F and O etc are observed on the etched AI(Si, Cu) films. After 95% etching, aluminum and silicon show metallic states and oxidized (partially chlorinated) states, copper shows Cu metallic states and Cu-Cl$_{x}$(x$_{x}$ (x$_{x}$ (1

• 한국주조공학회지
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• 제38권3호
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• pp.55-59
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• 2018

To optimize the conductivity and to reduce the weight by as much as possible, Al-Cu composites were prepared through a suction-casting procedure. Pure copper metal foam was infiltrated by melted aluminum with the use of the vacuum, after which warm rolling was conducted to remove several remaining pores at the interface between the Cu foam and the aluminum matrix. Despite the short casting time, significant dissolution of Cu into the melt was observed. Moreover, it was found that various Al-Cu intermetallic compounds arose at the interface during the isothermal heating process after the casting and rolling steps. The average thickness of the Al-Cu intermetallic compound tended to increase in proportion to the heating time. The electrical and thermal conductivity levels of the cast composites were found to be comparatively low, mainly due to the dissolution of the Cu foam and the formation of intermetallics at the interface.

• Journal of Welding and Joining
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• 제32권5호
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• pp.72-79
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• 2014

Shaped charge(SC) ammunition is a weapon that penetrates directly the target by made jet from metal liner on impacting at a target. In SC, the liner occupies significantly important role causing an explosion and penetration of the target. The Al-Ni composite coating was deposited on copper liner in a solid state via kinetic spraying to improve the explosive force. The mechanical properties, reactivity and microstructure were investigated to confirm the possibility of kinetic sprayed Al/Ni composite coating as a reactive liner material. Reactive liner using Al/Ni composite exhibited much enhanced reactivity than pure copper liner due to Self-propagating High-temperature Synthesis (SHS) reaction with significantly improved adhesive bond strength. Especially, among the Al/Ni composite coatings, AN11 (the Al versus Ni atomic percent ratio is 1:1) showed the greatest reactivity due to its widest reaction area between deposited Al and Ni.

• Journal of Welding and Joining
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• 제28권2호
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• pp.47-53
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• 2010

According to the research report for the recent a few years, the dissimilar welding of Cu and STS 304 alloy have been presented that a weldability is very poor. This article present a study on Lap joint by Electron beam welding dissimilar materials. The weld metals was constituted between pure copper and STS 304 steel. The experiment was performed with 125mA welding current, 520mA focusing current. The Vacuum condition of chamber is 5${\times}$10-5torr and welding speed is 300mm/min. Showing the bead shape of weld metal, the thickness of the stainless 304 using as the protect materials is 3mm and the thickness of a copper is 15mm. The analysis about the microstructure were carried out in which it was observed with SEM. The results showed that complex heterogeneous fusion zone microstructure characterized both by rapid cooling and mixing of the molten metal, however the liquation crack was formated in the fusion line.

• Journal of Welding and Joining
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• 제31권5호
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• pp.77-81
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• 2013

We have investigated thermal stability of the mechanical and thermal conductive properties of Cu/STS/Cu 3 layered clad metal lead frame material for a LED device package at different temperatures ranging from RT to $200^{\circ}C$. The fabricated Cu/STS/Cu clad metal has a good thermal stability for the mechanical tensile strength and thermal conductivity of the over 50 $Kg/mm^2$ to the $150^{\circ}C$ and 270 $W/m{\cdot}K$ to the $200^{\circ}C$, respectively. This clad metal lead frame material at a high temperature of $150^{\circ}C$ shows a reinforced mechanical tensile strength by 1.5 times to conventional pure copper lead frame materials and also a comparable thermal conductivity to typical copper alloy lead frame materials.

• 한국산학기술학회논문지
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• 제5권5호
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• pp.458-461
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• 2004

본 논문에서는 Si wafer와 Cu사이의 밀착력을 증가시키기 위해 Si wafer전처리 후 plasma와 SAMs처리 방법에 의한 Cu도금의 형성에 관한 방법을 설명하였다. Si wafer를 Piranha solution과 $0.5{\%}$ HF처리 후 유기박막인 SAMs과 plasma를 이용하는 방법으로 wafer와 Cu층 사이의 밀착력을 증가시켰다. 도금층의 밀착력은 scratch test 로 측정하였으며 , AFM을 이용해 시편에 형성된 패턴의 형태를 관찰하고 SEM과 EDS를 이용해 시편의 조직을 관찰하였다. 그 결과 Si wafer를 $O_{2}, He, SAMs$를 혼합처리 했을 때 밀착성이 가장 우수하였다.

• Journal of Welding and Joining
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• 제30권3호
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• pp.32-37
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• 2012

Lead frame which has a high thermal conductivity and high mechanical strength is one of core technology for ultra-thin electronics such as LED lead frames, memory devices of semiconductors, smart phone, PDA, tablet PC, notebook PC etc. In this paper, we fabricated a Cu/STS/Cu 3-layered clad metal for lead frame packaging materials and characterized the mechanical properties and thermal conductive properties of the clad metal lead frame material. The clad metal lead frame material has a comparable thermal conductivity to typical copper alloy lead frame materials and has a reinforced mechanical tensile strength by 1.6 times to typical pure copper lead frame materials. The thermal conductivity and mechanical tensile strength of the Cu/STS/Cu clad metal are 284.35 W/m K and $52.78kg/mm^2$, respectively.

• Electronic Materials Letters
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• 제14권6호
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• pp.712-717
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• 2018

In this letter, we have introduced copper chloride ($CuCl_2$) as an additive in the $CH_3NH_3PbI_3$ precursor solution to improve the surface morphology and crystallinity of $CH_3NH_3PbI_3$ films in a single solvent system. Our optimized perovskite solar cells (PSCs) with 2.5 mol% $CuCl_2$ additive showed best power conversion efficiency (PCE) of 15.22%. The PCE of the PSCs fabricated by $CuCl_2$ (2.5 mol%) additive engineering was 56% higher than the PSC fabricated with pristine $CH_3NH_3PbI_3$.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집D
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• pp.181-188
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• 2001

The present research is an experimental study of subcooled flow boiling behavior using flat, microporousenhanced square heater surfaces in pure FC-72. Two $1-cm^{2}$ copper surfaces, one highly polished (plain) and one microporous coated, were flush-mounted into a 12.7 mm square, horizontal flow channel. Testing was performed for fluid velocities ranging from 0.5 to 4 m/s (Reynolds numbers from 18,700 to 174,500) and pure subcooling levels from 4 to 20 K. Results showed both surfaces' nucleate flow boiling curves collapsed to one line showing insensitivity to fluid velocity and subcooling. The log-log slope of the microporous surface nucleate boiling curves was lower than the plain surface due to the conductive thermal resistance of the microporous coating layer. Both, increased fluid velocity and subcooling, increase the CHF values for both surfaces, however, the already enhanced boiling characteristics of the microporous coating appear dominant and require higher fluid velocities to provide additional enhancement of CHF to the microporous surface.

• 대한기계학회논문집B
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• 제37권7호
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• pp.647-653
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• 2013

본 연구에서는 산화구리(CuO) 나노분말과 순수 물을 혼합하여 제조한 나노유체를 이용하여 가열된 고체표면에 있어서 나노유체 액적의 증발특성에 대한 실험적 연구를 수행하였다. 실험결과로부터 가열된 표면에서 나노유체 액적의 증발속도는 순수 물 액적보다 증발속도가 약간 증가하는 경향이 있음을 알 수 있었으며, 이는 나노유체에 포함된 나노입자가 유체의 열전도도를 향상시켜 고체 표면에서 액적으로의 열전달이 촉진되었기 때문인 것으로 판단된다. 또한 고체의 표면조도가 커질수록 액적의 증발속도가 약간 증가하였으며, 이는 고체의 표면조도가 커질수록 고체-액체의 접촉 면적이 증가하여 열전달이 촉진되었기 때문인 것으로 추정된다.