• Journal of Korean Society for Quality Management
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• v.28 no.3
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• pp.18-30
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• 2000

Recent studies have shown that the $\bar{X}$ chart with variable sampling intervals(VSI) and the $\bar{X}$ chart with variable sample size(VSS) are much quicker than Shewhart $\bar{X}$ chart in detecting shiks in the process. Shewhart $\bar{X}$ chart has been beneficial to detect large shifts but it is hard to apply Shewhart $\bar{X}$ chart in detecting moderate shifts in the process mean. In this article the $\bar{X}$ chart using variable sample size(VSS) and variable sampling Intervals(VSI) has been proposed to supplement the weak point mentioned above. So the purpose of this paper is to consider finding the design parameters which minimize expected loss costs for unit process time and measure the performance of VSSI(variable sample size and sampling interval) $\bar{X}$ chart. It is important that assignable causes be detected to maintain the process controlled. This paper has been studied under the assumption that one cycle is from starting of the process to eliminating the assignable causes in the process. The other purpose of this article is to represent the expected loss costs in one cycle with three process parameters(sample size, sampling interval and control limits) function and find the three parameters.

• Fire Science and Engineering
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• v.8 no.2
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• pp.51-57
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• 1994

본문에서는 다음사항에 대해 논한다 ; 1. 미국의 화학공업산업 분야에서 현재 행하고 있는 손실관리 기법 2. 손실관리기법의 발전 과정 3. 앞으로의 손실관리기법 동향 미국내의 화학공장들은 경제적, 사회적 그리고 정치적 영향을 받으면서 운영되고 있다. 이들 각기 다른 영향의 상충은 솔선적이고 규제성이 있는 행동으로 이어지게 되었는데 이러한 행동은 오늘날 매우 잘 알려진 공정 안전관리 (Process Safety Management)의 근간이 되었다.

• Journal of Korea Society of Industrial Information Systems
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• v.9 no.3
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• pp.32-37
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• 2004

This paper investigates the mathematical model of multi-server retrial queueing system with the Batch Markovian Arrival Process (BMAP), the Phase type (PH) service distribution and the finite buffer. The sufficient condition for the steady state distribution existence and the algorithm for calculating this distribution are presented. Finally, a formula to solve loss probability in the case of complete admission discipline is derived.

• Bulletin of the Korean Space Science Society
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• 2004.04a
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• pp.39-39
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• 2004

It has been known that ring current particles can be lost through dayside MP(magnetopause). However, details of the loss mechanism of this process has not received much attention. In this study, we show that the solar wind dynamic pressure P$\sub$D/ can play a significant role in the dayside loss. In order to show that, we have first conducted superposed epoch analysis using 95 geomagnetic storm events selected from the period 1997 to 2002. (omitted)

• Journal of Korea Society of Industrial Information Systems
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• v.11 no.1
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• pp.1-6
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• 2006

Queueing models are good models for fragments of communication systems and networks, so their investigation is interesting for theory and applications. Theses queues may play an important role for the validation of different decomposition algorithms designed for investigating more general queueing networks. So, in this paper we illustrate that the batch size distribution affects the loss probability, which is the main performance measure of a finite buffer queues.

• Journal of the Korean Society of Tobacco Science
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• v.11 no.1
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• pp.79-85
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• 1989

For the Purpose of this study, were researched the optimum condition preconditioning condition of orient tobacco leaves . The loss of 3-methyl pentanoic acid (3-MP) component of BASMA leaves in the treatment process amount to about 60% , but the loss of 3-MP At the optimum conditions of BASMA CTC treatment, the temperature was 45-$65^{\circ}C$ and the treatment time 25-35 minutes. And further, the physical properties of BASMA after CTC treatment was remarkably similar to the control's. Since VTC minimized the loss, it is suggested that CTC method should be changed by VTC method.

• Proceedings of the KIPE Conference
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• 2019.07a
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• pp.50-52
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• 2019

Dynamic resistance equalization is a viable technique to balance SOC of cells in a parallel-connected battery configuration due to high equalization performance, simplicity and low-cost. However, an inappropriate design of the equalization resistor can degrade the equalization performance and increase the power loss. This paper proposes an optimization process to design the equalization resistors to minimize power loss and equalization error. The simulation results show that the optimally designed resistor significantly enhance the performance in comparison with the conventional fixed-resistor equalization.

• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.557-558
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• 2008

This paper presents the effects of via losses to be connected with an embedded DPDT(Double Pole Double Thru) in a substrate. The substrate consists of two ABF(Ajinomoto Bonding Film) and a Epoxy core. In order to verify and test effects of via, via chains in a substrate using SoP-L process are proposed and measured. Via loss can be calculated as averaging the total via holes. The exact loss of a DPDT switch embedded in substrate are extracted by using the results of via chain and measured data from embedded DPDT. The calculated one via insertion loss is about 0.0005 dB on basis of measured via chains. This result confirms very low loss in via. So the inserti on loss of the embedded switch is confirmed only switch loss as loss is 0.4 dB.

• Transactions of the Korean Society of Pressure Vessels and Piping
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• v.13 no.2
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• pp.75-83
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• 2017

In severe accident conditions of light water reactors, the loss of coolant may cause problems in integrity of zirconium fuel cladding. Under the condition of the loss of coolant, the zirconium fuel cladding can be exposed to high temperature steam and reacted with them by producing of hydrogen, which is caused by the failure in oxidation resistance of zirconium cladding materials during the loss of coolant accident scenarios. In order to avoid these problems, we develop a multi-metallic layered composite (MMLC) fuel cladding which compromises between the neutronic advantages of zirconium-based alloys and the accident-tolerance of non-zirconium-based metallic materials. Cold pilgering process is a common tube manufacturing process, which is complex material forming operation in highly non-steady state, where the materials undergo a long series of deformation resulting in both diameter and thickness reduction. During the cold pilgering process, MMLC claddings need to reduce the outside diameter and wall thickness. However, multi-layers of the tube are expected to occur different deformation processes because each layer has different mechanical properties. To improve the utilization of the pilgering process, 3-dimensional computational analyses have been made using a finite element modeling technique. We also analyze the dimensional change, strain and stress distribution at MMLC tube by considering the behavior of rolls such as stroke rate and feed rate.

• ETRI Journal
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• v.25 no.2
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• pp.65-72
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• 2003

To achieve cost and size reductions, we developed a low cost manufacturing technology for RF substrates and a high performance passive process technology for RF integrated passive devices (IPDs). The fabricated substrate is a conventional 6" Si wafer with a 25${\mu}m$ thick $SiO_2$ surface. This substrate showed a very good insertion loss of 0.03 dB/mm at 4 GHz, including the conductive metal loss, with a 50 ${\Omega}$ coplanar transmission line (W=50${\mu}m$, G=20${\mu}m$). Using benzo cyclo butene (BCB) interlayers and a 10 ${\mu}m$ Cu plating process, we made high Q rectangular and circular spiral inductors on Si that had record maximum quality factors of more than 100. The fabricated inductor library showed a maximum quality factor range of 30-120, depending on geometrical parameters and inductance values of 0.35-35 nH. We also fabricated small RF IPDs on a thick oxide Si substrate for use in handheld phone applications, such as antenna switch modules or front end modules, and high-speed wireless LAN applications. The chip sizes of the wafer-level-packaged RF IPDs and wire-bondable RF IPDs were 1.0-1.5$mm^2$ and 0.8-1.0$mm^2$, respectively. They showed very good insertion loss and RF performances. These substrate and passive process technologies will be widely utilized in hand-held RF modules and systems requiring low cost solutions and strict volumetric efficiencies.