• 한국정밀공학회지
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• 제27권7호
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• pp.28-35
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• 2010

In the display industry, COG bonding method is being applied to production of LCD panels that are used for mobile phones and monitors, and is one of the mounting methods optimized to compete with the trend of ultra small, ultra thin and low cost of display. In COG bonding process, electrical characteristics such as contact resistance, insulation property, etc and mechanical characteristics such as bonding strength, etc depend on properties of conductive particles and epoxy resin along with ACF materials used for COG by manufacturers. As the properties of such materials have close relation to optimization of bonding conditions such as temperature, pressure, time, etc in COG bonding process, it is requested to carry out an in-depth study on characteristics of COG bonding, based on which development of bonding process equipment shall be processed. In this study were analyzed the characteristics of COG bonding process, performed the analysis and reliability evaluation on electrical and mechanical characteristics of COG bonding using ACF to find optimum bonding conditions for ACF, and performed the experiment on bonding characteristics regarding fine pitch to understand the affection on finer pitch in COG bonding. It was found that it is difficult to find optimum conditions because it is more difficult to perform alignment as the pitch becomes finer, but only if alignment has been made, it becomes similar to optimum conditions in general COG bonding regardless of pitch intervals.

• 대한치과보철학회지
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• 제46권4호
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• pp.372-380
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• 2008

연구목적: 본 연구의 목적은 즉시 상아질 봉쇄 (immediate dentin sealing; IDS)을 시행한 경우와 지연 상아질 봉쇄 (delayed dentin sealing ; DDS)를 시행한 경우를 비교하고, 지연 상아질 봉쇄 시 상아질 접착제를 먼저 중합한 경우와 복합레진과 함께 중합한 경우에 있어서 상아질과 복합레진의 결합강도를 비교하는 것이다. 재료 및 방법: 사람의 건전한 대구치 20개의 치관부를 삭제하여 상아질 표면을 노출시켰다. 상아질 접착 후 바로 복합레진을 축조하는 과정에서 군을 4 가지로 나누었다. 대조군은 주수 하에 model trimmer를 이용하여 치관부 삭제 후 바로 2-step etch-and-rinse dentin bonding agent (ONE-STEP, Bisco, USA)를 이용하여 상아질 접착을 시행하고 복합레진 (RENEW, Bisco, USA)을 수복하였다. 실험군 A는 치아 삭제 후, Fermit을 이용한 임시수복 상태로 5일간 생리식염수에 보관하였다. 임시수복 제거 후 상아질 접착제를 도포하고 별도의 중합없이 레진을 축조하고 함께 중합하였다. 실험군 B는 치아 삭제 후, 상아질 접착제 도포 및 중합하고 임시수복을 시행하여 5일간 생리식염수에 보관하였다. 임시수복 제거 후 상아질 접착제를 도포하고 별도의 중합없이 레진을 축조하고 함께 중합하였다. 실험군 C는 치아 삭제 후, 임시수복 상태로 5일간 생리식염수에 보관하였다. 임시수복 제거 후, 상아질 접착제를 도포 및 중합하고, 레진을 축조 및 중합하였다. 각 치아를 단면적 1 $mm^2$, 길이 10-12 mm의 막대형 시편으로 절단하여, 미세인장 결합강도를 측정하였다. 측정된 결합강도는 one-way ANOVA를 이용하여 비교 분석하였으며, 사후 검증은 Scheffe test를 이용하여 분석하였다. 연구결과: 본 실험의 결과는 다음과 같다. 1. 치아 삭제 후 별도의 상아질 접착 시행 없이 임시수복하고, 레진 축조 전 상아질 접착을 도포 후 별도의 중합과정 없이 레진과 함께 중합할 경우, 상아질과의 미세인장 결합강도는 유의하게 낮은 값을 보였다 (P < .01). 2. 치아 삭제 및 임시 수복 기간 후, 상아질 접착제를 먼저 중합하고 복합 레진을 수복하는 경우와 치아 삭제 후 상아질 접착을 시행하고 수복물 장착 시 상아질 접착을 재시행하는 경우 간의 상아질에 대한 결합강도의 차이는 없었다 (P > .05).

• 반도체디스플레이기술학회지
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• 제4권4호
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• pp.27-31
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• 2005

This article contains the development of FPC bonder that used for repair or trial product. Nowadays, in FPO module process (including PDP) accept the thermo-compress bonding method when attach FPC(Flexible Printed Circuit Board), TCP(Tape Carrier Package) and COF(Chip on the FPC) by ACF(Anisotropic Conductive Film). This system consists of ACF attachment part, pre-bonding part, main bonding part, loading / unloading part. This composition is a stand-alone system, not an in-line system. Hereafter, this composition should be developing into in-line system in all area of FPD industry.

• 문화기술의 융합
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• 제4권3호
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• pp.209-212
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• 2018

이방성 도전필름(ACF)을 사용한 본딩은 납땜이 용이하지 않은 이질적인 소재 간 미세 접합을 형성하는데 널리 사용되어진다. 성공적인 ACF 본딩 구현을 위한 3가지 제한조건이 존재한다. 본딩 접촉점은 설정된 작업 시간동안 적절한 압력과 온도를 유지한 헤드에 의해서 압착되어야 한다. 본 논문에서는 머신 비전을 기반으로 한 ACF 본딩기법을 제안하고 실험을 통해 검증한다. 시스템은 본딩 작업대 상의 PCB 위치 및 방향을 계산하고 헤드가 압착되어야 하는 최적의 접촉점을 결정한다. 제안한 시스템이 접촉면 상의 헤드 평탄도를 보장함으로써 접착력을 향상시킬 수 있음을 실험결과를 통해 보여준다.

• 한국전기전자재료학회논문지
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• 제15권4호
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• pp.301-307
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• 2002

Direct bonded SOI wafer pairs with $Si ll SiO_2/Si_3N_4 ll Si$ the heterogeneous insulating layers of SiO$_2$-Si$_3$N$_4$are able to apply to the micropumps and MEMS applications. Direct bonding should be executed at low temperature to avoid the warpage of the wafer pairs and inter-diffusion of materials at the interface. 10 cm diameter 2000 ${\AA}-SiO_2/Si(100}$ and 560 $\AA$- ${\AA}-Si_3N_4/Si(100}$ wafers were prepared, and wet cleaned to activate the surface as hydrophilic and hydrophobic states, respectively. Cleaned wafers were pre- mated with facing the mirror planes by a specially designed aligner in class-100 clean room immediately. We employed a heat treatment equipment so called fast linear annealing(FLA) with a halogen lamp to enhance the bonding of pre mated wafers We kept the scan velocity of 0.08 mm/sec, which implied bonding process time of 125 sec/wafer pairs, by varying the heat input at the range of 320~550 W. We measured the bonding area by using the infrared camera and the bonding strength by the razor blade clack opening method, respective1y. It was confirmed that the bonding area was between 80% and to 95% as FLA heat input increased. The bonding strength became the equal of $1000^{\circ}C$ heat treated $Si ll SiO_2/Si_3N_4 ll Si$ pair by an electric furnace. Bonding strength increased to 2500 mJ/$\textrm{m}^2$as heat input increased, which is identical value of annealing at $1000^{\circ}C$-2 hr with an electric furnace. Our results implies that we obtained the enough bonding strength using the FLA, in less process time of 125 seconds and at lowed annealing temperature of $400^{\circ}C$, comparing with the conventional electric furnace annealing.

• Restorative Dentistry and Endodontics
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• 제40권1호
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• pp.23-29
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• 2015

Objectives: The aim of this study was to evaluate the effect of pre-etching on the bond strength of silorane-based composite specific adhesive system to dentin. Materials and Methods: Thirty human molars were randomly divided into 5 groups according to the different bonding strategies. For teeth restored with silorane-based composite (Filtek Silorane, 3M ESPE), the specific self-etching adhesive system (Adhesive System P90, 3M ESPE) was used with and without pre-etching (Pre-etching/Silorane and Silorane groups). Teeth restored with methacrylate based-composite (Filtek Z250, 3M ESPE) were hybridized with the two-step self-etching system (Clearfil SE Bond, Kuraray), with and without pre-etching (Pre-etching/Methacrylate and Methacrylate groups), or three-step adhesive system (Adper Scotchbond Multi-Purpose, 3M ESPE) (Three-step/Methacrylate group) (n = 6). The restored teeth were sectioned into stick-shaped test specimens ($1.0{\times}1.0mm$), and coupled to a universal test machine (0.5 mm/min) to perform microtensile testing. Results: Pre-etching/Methacrylate group presented the highest bond strength values, with significant difference from Silorane and Three-step/Methacrylate groups (p < 0.05). However, it was not significantly different from Pre-etching/Silorane and Methacrylate groups. Conclusions: Pre-etching increased bond strength of silorane-based composite specific adhesive system to dentin.

• 마이크로전자및패키징학회지
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• 제17권4호
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• pp.61-66
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• 2010

3차원 TSV 접합 시접합 두께 및 전, 후 추가 공정 처리가 Cu-Cu 열 압착 접합에 미치는 영향을 알아보기 위해 0.25, 0.5, 1.5, 3.0 um 두께로 Cu 박막을 제작한 후 접합 전 $300^{\circ}C$에서 15분간 $Ar+H_2$, 분위기에서 열처리 후 $300^{\circ}C$에서 30분 접합 후 후속 열처리 효과를 실시하여 계면접착에너지를 4점굽힘 시험법을 통해 평가하였다. FIB 이미지 확인 결과 Cu 두께에 상관없이 열 압착 접합이 잘 이루어져 있었다. 계면접착에너지 역시 두께에 상관없이 $4.34{\pm}0.17J/m^2$ 값을 얻었으며, 파괴된 계면을 분석 한 결과 $Ta/SiO_2$의 약한 계면에서 파괴가 일어났음을 확인하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.198-198
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• 2009

The size of LCD Panel is gradually getting bigger. But the efficient uses of glass and the increasing output of narrow bezel type makes importantly the role of sealant which bonding two glasses. We devised a new tester with pre-inserted blade for interfacial fracture toughness measurement, and evaluated quantitatively bonding ability of sealant. The blade tester has been analyzed with two process parameter, moving speed and inserting depth of blade.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 1999년도 학회창립 10주년 기념 1999년도 가을 학술발표회 논문집
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• pp.709-712
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• 1999

This paper was aimed to investigate the shear strengthening effect of the pre-loaded reinforced concrete beams strengthened by carbon fiber sheet (CFS). Main tet parameters was the magnitude of pre-loading at the time of the retrofit and the strengthening method of carbon fiber sheet. A series of nine specimens was tested to evaluate the corresponding effect of each parameters such as maximum load capacity, load-deflection relationship, and failure mode. The results of this study showed that the failure mode is bonding failure between the concrete and the CFS before the tensile failure strain of the CFS is reached.

• 대한치과교정학회지
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• 제41권6호
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• pp.447-453
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• 2011

Objective: We compared the shear bond strength (SBS) of lingual retainers bonded to bovine enamel with three different resins using direct and indirect methods. Methods: Both ends of pre-fabricated twisted ligature wires were bonded to bovine enamel surfaces using Light-Core, Tetric N-Flow, or Transbond XT. Phosphoric acid-etched enamel surfaces were primed with One-Step prior to bonding with Light-Core or Tetric N-Flow. Transbond XT primer was used prior to bonding with Transbond XT. After 24 hours in water at $37^{\circ}C$, we performed SBS tests on the samples. We also assigned adhesive remnant index (ARI) scores after debonding and predicted the clinical performance of materials and bonding techniques from Weibull analyses. Results: Direct bonding produced significantly higher SBS values than indirect bonding for all materials. The SBS for Light-Core was significantly higher than that for Tetric N-Flow, and there was no significant difference between the direct bonding SBS of Transbond XT and that of Light-Core. Weibull analysis indicated Light-Core performed better than other indirectly bonded resins. Conclusions: When the SBS of a wire retainer is of primary concern, direct bonding methods are superior to indirect bonding methods. Light-Core may perform better than Transbond XT or Tetric N-Flow when bonded indirectly.