Direct Bonding of SillSiO2/Si3N4llSi Wafer Fairs with a Fast Linear Annealing |
이상현
(서울시립대학교 신소재공학과)
이상돈 (서울시립대학교 신소재공학과) 송오성 (서울시립대학교 신소재공학과) |
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Study on pre bonding according with HF pre-treatment conditions in Si wafer direct bonding
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Wafer bonding for silicon-on-insulator technologies
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DOI ScienceOn |
3 |
Smart-cut: A new silicon on insulator material technology based on hydrogen implantation and wafer bonding
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DOI |
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Study on the Characterastics of Si Wafer Direct Bonding using FLA Method
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Fabrication of a SOI hall sensor using Si-wafer direct bonding technology and its characteristics
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과학기술학회마을 |
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The crack opening method in silicon wafer bonding how useful in it?
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DOI ScienceOn |
7 |
Bond strength measurement related to silicon surface hydrophilicity
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DOI |
8 |
The oxide nitride oxide film deposition on the tunnel-structured polycrystalline silicon (polysilicon) electrodes for high-density DRAMs
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DOI |
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Stability of interfacial oxide layers during silicon wafer bonding
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DOI |
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Gap states silicon nitride
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Bubble-free wafer bonding of GaAs and Inp pn silicon in a microcleanroom
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DOI |
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Direct bonding of Si∥SiO₂/Si₃N₄∥Si wafer pairs with a furnace
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DOI ScienceOn |
13 |
큰 초기접합력을 갖는 Si 기관 직접접합에 관한 연구
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Continuous on-chip micropumping through a microneedle
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Direct bonding of Si ∥1.3㎛-SiO₂∥Si SOI substrates prepared by FLA method
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과학기술학회마을 |
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Boron contamination and antimony segregation at the interface of directly bonded silicon wafers
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DOI |
18 |
Silicon-to-silicon direct bonding method
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DOI |
19 |
Interferometry of actuated microcantilevers to determine material properties and test structure nonidealities in MEMS
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DOI ScienceOn |