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http://dx.doi.org/10.17703/JCCT.2018.4.3.209

Development of a Method for ACF Bonding Based on Machine Vision  

Lee, Seokwon (Dept. of Mechatronics Eng., Korea Polytechnic Univ.)
Publication Information
The Journal of the Convergence on Culture Technology / v.4, no.3, 2018 , pp. 209-212 More about this Journal
Abstract
Anisotropic conductive film(ACF) bonding is widely used for making fine interconnections between two different materials where soldering is not easily applicable. There are three constraints for the successful implementation of ACF bonding. A bonding contact should be pressed by a hot head with the right pressure and temperature for a pre-defined curing time. In this paper, a method for ACF bonding based on machine vision system is proposed and verified through some experiments. The system calculates the position and orientation of printed circuit boards(PCBs) on a bonding table and estimates the optimal hitting point where the hot head should be applied. Experimental results show that the proposed system achieves better adhesive strength by providing head flatness over contact surfaces.
Keywords
Anisotropic Conductive Film; Bonding; Machine Vision; Adhesive Strength;
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