• Journal of Power Electronics
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• 제7권4호
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• pp.294-300
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• 2007

This paper deals with a design of a bootstrap power supply using snubber energy regeneration, which is used to power a high-side gate driver of a half-bridge circuit. In the proposed circuit, the energy stored in the low-side snubber capacitor is transferred to the high-side bootstrap capacitor without any magnetic components. Thus, the power dissipation in the RCD snubber can be effectively reduced. The operation principle and design method of the proposed circuit are presented. The experimental results are also provided to show the validity of the proposed circuit.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2001년도 ICCAS
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• pp.114.6-114
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• 2001

According to expansion of wireless communication system and mobile device, interest has been growing in personal navigation system integrated with wireless system. In portable consumer electronics, such as cellular phones, GPS and PDA, one of major design factors is the power consumption. Solutions of reducing the power dissipation are low voltage, low system clock power management and so on. This paper develops a GPS receiver based on the advanced power management algorithm that achieves very low average power consumption. Both RF and DSP chips are powered down and reactivated only when the position fixing is required. In order to run, the developed includes the RTC calibration function and the fast reacquisition function using XMC (eXtended Multiple Correlator) ...

• 한국전자파학회:학술대회논문집
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• 한국전자파학회 2003년도 종합학술발표회 논문집 Vol.13 No.1
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• pp.113-117
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• 2003

This paper describes the design and the simulation results of the RF CMOS Class-E Power Amplifier for a 2.4GHz ISM band. This circuit is composed two connected amplifiers. where Class F amplifier drives Class E amplifier. The proposed circuit can reduce the total power dissipation of the driving stage and can work with higher efficiency. The power amplifier has been implemented in a standard $0.25{\mu}m$ CMOS technology and is shown to deliver 100mW output power to load with 41% power added efficiency(PAE) from a 2.5V supply.

• 한국정보처리학회:학술대회논문집
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• 한국정보처리학회 2005년도 춘계학술발표대회
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• pp.863-866
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• 2005

Low-power design is one of the most important challenges encountered in maximizing battery life in portable devices as well as saving energy during system operation. In this paper we propose a low-power DCT (Discrete Cosine Transform) architecture using a modified Computation Sharing Multiplication (CSHM). The overall rate of power consume is reduced during DCT: the proposed architecture does not perform arithmetic operations on unnecessary bits during the Computation Sharing Multiplication calculations. Experimental results show that it is possible to reduce power dissipation up to about $7{\sim}8%$ without compromising the final DCT results. The proposed lowpower DCT architecture can be applied to consumer electronics as well as portable multimedia systems requiring high throughput and low-power.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2003년도 통신소사이어티 추계학술대회논문집
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• pp.335-339
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• 2003

This Paper describes the design and the simulation results of the RF CMOS Class-E Power Amplifier for a 2.4GHz ISM band. This circuit is composed two connected amplifiers. where Class F amplifier drives Class E amplifier. The proposed circuit can reduce the total power dissipation of the driving stage and can work with higher efficiency. The power amplifier has been implemented in a standard 0.25$\mu\textrm{m}$ CMOS technology and is shown to deliver 100mW output Power to load with 41％ power added efficiency(PAE) from a 2.5V supply.

• 한국조명전기설비학회:학술대회논문집
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• 한국조명전기설비학회 2004년도 춘계학술대회 논문집
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• pp.492-496
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• 2004

When using a conventional power factor correction circuit, a comparatively huge capacitor is used to boost-up output voltage. It has a large amount of harmonic distortion in the input current waveform. To improve the input current waveform of diode rectifiers, we propose a new operating principle for the power factor correction circuit. Due to the fact that the proposed circuit uses smaller ones and a smaller reactor, the output voltage increases and obtains higher input current waveforms. These are suitable for the harmonics guidelines. The proposed circuit is able to obtain higher power factor and efficiency. Also, it has reduced switching loss and held over-shooting by using an inverter of eliminated dead-time HPWM that has non-linear impedance circuits to make up diodes, capacitance and a reactor. We compared the conventional PWM inverter and proposed HPWM inverters and found that a high input power factor of 97[%] and an efficiency of 98[%] were also obtained.

• Steel and Composite Structures
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• 제26권2호
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• pp.139-150
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• 2018

In this paper, two kinds of buckling restrained braces (BRBs) are designed to improve the mechanical properties and fatigue life, the reserved gap and viscoelastic filler with high energy dissipation capacity are employed as the sliding element, respectively. The fatigue life of BRBs considering the effect of sliding element is predicted based on Manson-Coffin model. The property tests under different displacement amplitudes are carried out to evaluate the mechanical properties and fatigue life of BRBs. At last, the finite element analysis is performed to study the effects of the gap and viscoelastic filler on mechanical properties BRBs. Experimental and simulation results indicate that BRB employed with viscoelastic filler has a higher fatigue life and more stable mechanical property compared to BRB employed with gap, and the smaller reserved gap can more effectively improve the energy dissipation capacity of BRB.

• 한국안전학회지
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• 제14권4호
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• pp.3-12
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• 1999

This research concentrates on the influence of non-linearities associated with impact for the nonlinear rocking behavior of rigid block subjected to one dimensional sinusoidal excitation of horizontal direction. The transition of two governing rocking equations, the abrupt reduction in the kinetic energy associated with impact, and sliding motion of block. In this study, two type of rocking vibration system are considered. One is the undamped rocking vibration system, disregarding energy dissipation at impact and the other is the damped rocking system, including energy dissipation and sliding motion. The response analysis using non-dimensional rocking equation is carried out for the change of excitation parameters and friction coefficient. The chaos responses were discovered in the wide response region, particularly, for the case of high excitation amplitude and their chaos characteristics were examined by the time history, Poincare map, power spectra and Lyapunov Exponent of rocking responses. The complex behavior of chaos response, in the phase space, were illustrated by Poincare map. The bifurcation diagram and Poincare map were shown to be effective in order to understand chaos of rocking system.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2008년도 Techno-Fair 및 추계학술대회 논문집 전기물성,응용부문
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• pp.93-94
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• 2008

Diagnostic tests were performed in three high voltage motors. These tests included insulation resistance, polarization index, ac current, dissipation factor($tan{\delta}$) and partial discharge magnitude. The rewind of motor stator insulation at rated voltage is assessed by the results of these tests. After completing the diagnostic tests, the stator windings of motors were subjected to gradually increasing ac voltage, until the insulation punctured. NO.1 and No.2 motors failed near rated voltage of 14.0 kV, respectively. These motors are lower that expected for good quality coils in 6.6 kV class motors. The breakdown voltage of No.3 motor was 15.0 kV.

• 조명전기설비학회논문지
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• 제25권12호
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• pp.34-41
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• 2011

In order to understand the thermal performance of each LED chips in multi-chip LED package, a quantitative parametric analysis of the temperature evolution was investigated by thermal transient analysis. TSP (Temperature Sensitive Parameter) value was measured and the junction temperature was predicted. Thermal resistance between the p-n junction and the ambient was obtained from the structure function with the junction temperature evolution during the cooling period of LED. The results showed that, the thermal resistance of the each LED chips in 4 chip-LED package was higher than that of single chip- LED package.