Journal of the Korean Institute of Illuminating and Electrical Installation Engineers (조명전기설비학회논문지)

The Korean Institute of IIIuminating and Electrical Installation Engineers (한국조명전기설비학회)
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Thermal Dissipation Characteristics of Multi-Chip LED Packages

멀티 칩 LED 패키지의 방열 특성

  • 김병호 (호서대학교 디지털디스플레이공학과) ;
  • 문철희 (호서대학교 디지털디스플레이공학과)
  • Received : 2011.10.11
  • Accepted : 2011.11.28
  • Published : 2011.12.30
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Abstract

In order to understand the thermal performance of each LED chips in multi-chip LED package, a quantitative parametric analysis of the temperature evolution was investigated by thermal transient analysis. TSP (Temperature Sensitive Parameter) value was measured and the junction temperature was predicted. Thermal resistance between the p-n junction and the ambient was obtained from the structure function with the junction temperature evolution during the cooling period of LED. The results showed that, the thermal resistance of the each LED chips in 4 chip-LED package was higher than that of single chip- LED package.

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References

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