• The Journal of Korean Physical Therapy
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• v.20 no.1
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• pp.23-31
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• 2008

Purpose: The purpose of this study was finding out the effects of spinal stabilization exercise using Centaur which is a 3D spinal stabilization sports implement on Chronic low back pain patients over 8 weeks. Methods: 30 patients with DDD were observed during the study. Their average age was 66.88years, height was 152.12cm and average weight was 58.91kg, 4 males and 26 females were involved. 8 various investigations were performed and varied values were compared with reinvestigation done after having exercised 8 weeks using 3-D CENTAUR We used VAS(visual analog scale) in order to see the variation of pain intensity, MOI(modified oswestry index) in order to see limitation of daily life. Results: VAS was lessened from 7.57 to 2.63, limitation of routine life(MOS) from 23.48 to 11.30, there were remarkable differences statistically(p<0.05). As a result of muscular investigation for static spinal stabilization by 8 variations of body deflection, muscular strength were all increased and there were signigicant differences statistically(p<0.05). Conclusion: It has turned out that pain and limitation of routine life was lessened, as a result of 8 weeks exercise using CENTAUR, and deep muscular power was increased. Thus it has turned out that 3-D spinal stabilization exercise has an effect on the strengthening spinal muscles and alleviation of their pain for old patients with DDD.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.503-504
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• 2006

This paper presents the design and fabrication of a LC voltage-controlled oscillator (VCO) using 1-poly 6-metal mixed signal CMOS process. To obtain the high-quality factor inductor in LC resonator, patterned-ground shields (PGS) is placed under the symmetric inductor to reduce the effect from image current of resistive Si substrate. Moreover, due to the incapability of using thick top metal layer of which the thickness is over $2{\mu}m$, as used in many RF CMOS process, the structure of dual-metal layer in which we make electrically short circuit between the top metal and the next metal below it by a great number of via materials along the metal traces is adopted. The circuit operated from 2.63 GHz to 3.09 GHz tuned by accumulation-mode MOS varactor. The corresponding tuning range was 460 MHz. The measured phase noise was -115 dBc/Hz @ 1MHz offset at 2.63 GHz carrier frequency and the current consumption and the corresponding power consumption were about 2.6 mA and 4.68 mW respectively.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.4
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• pp.506-510
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• 2016

A triple-band (TB) oscillator was implemented in the TSMC $0.18{\mu}m$ 1P6M CMOS process, and it uses a cross-coupled nMOS pair and two shunt $4^{th}$ order LC resonators to form a $6^{th}$ order resonator with three resonant frequencies. The oscillator uses the varactors for band switching and frequency tuning. The core current and power consumption of the high (middle, low)- band core oscillator are 3.59(3.42, 3.4) mA and 2.4(2.29, 2.28) mW, respectively at the dc drain-source bias of 0.67V. The oscillator can generate differential signals in the frequency range of 8.04-8.68 GHz, 5.82-6.15 GHz, and 3.68-4.08 GHz. The die area of the triple-band oscillator is $0.835{\times}1.103mm^2$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.5
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• pp.401-406
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• 2005

Two dimensional MEDICI simulator is used to study the electrical characteristics of Dual Gate Emitter Switched Thyristor. The simulation is done in terms of the current-voltage characteristics with the variations of p-base impurity concentrations and current flow. Compared with the other power devices such as MOS Controlled Cascade Thyristor(MCCT), Conventional Emitter Switched Thyristor(C-EST) and Dual Channel Emitter Switched Thyristor(DC-EST), Dual Gate Emitter Switched Thyristor(DG-EST) shows to have tile better electrical characteristics, which is the high latch-up current density and low forward voltage-drop. The proposed DG-EST which has a non-planer u-base structure under the floating N+ emitter indicates to have the better characteristics of latch-up current and breakover voltage in spite of the same turn-off characteristics.

• Proceedings of the KIEE Conference
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• 2000.07d
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• pp.3124-3126
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• 2000

The application of IR(Infrared) communication is very wide and IR receiver has become a standard of home entertainment. A preamplifier with single 5V supply was designed for IR receiver IC. To operate at long distance, receiver IC should have high gain and low noise characteristic. To provide constant output signal magnitude, independent of transciever distance, gain limiting stage is needed. And to cut-off DC noise component effectively, large resistance and capacitance are required. Transimpedance type preamplifier, and diode limiting amplifier, and current limiting amplifier were designed. It is another function of current limiting amplifier that transforms single input signal to differential output signal. Using AMS BiCMOS model, both BJT version and MOS version was designed. Total power consumption is O.lmW, and IC size is $0.3mm^2$

• Journal of IKEEE
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• v.14 no.3
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• pp.190-198
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• 2010

This paper describes a auto focus piezo actuator driver IC for portable digital camera. The 80[V] DC voltage is generated by a DC-DC converter and supplied to power of piezo moving control circuit. The voltage of piezo actuator needs range -20[V] to 80[V] proportional to 1[Vp-p] input control voltages. The dimensions and number of external parts are minimized in order to get a smaller hardware size. IIC(Inter-IC) interface logic is designed for data interface and it makes debugging easy, test for mass productions. The power consumption is around 40[mW] with supply voltage of 3.6[V]. This device has been fabricated in a 0.6[um] double poly, triple metal 100[V] BCD MOS process and whole chip size is 1600*1500 [$um^2$].

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.3
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• pp.1700-1706
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• 2014

In this paper, a step down converter for LED backlight of mobile application has been proposed. The converter which is operated with 4 MHz high switching frequency is capable of reducing mounting area of passive devices consists of a power stage and a control block. Circuit elements of the power stage are inductor, output capacitor, MOS transistors and feedback resistors. The control block consists of pulse width modulator, error amplifier and oscillator etc. Proposed step down converter has been designed and verified using a $0.35{\mu}m$ 1-poly 4-metal BCD process technology. Simulation results show that the output voltage is 1.8 V in 3.7 V input voltage, output current 100 mA which is larger than 25 ~ 50 mA in conventional 500 KHz driven converter when the duty ratio is 0.4.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.44 no.1
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• pp.69-78
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• 2007

A Frequency synthesizer for T-DMB and mobile-DTV applications was designed using $0.18{\mu}m$ CMOS process with 1.8V supply. PMOS transistors were chosen for VCO core to reduce phase noise. The VCO range is 920MHz-2100MHz using switchable inductors, capacitors and varactors. Varactor biases that improve varactor acitance characteristics were minimized as two, and $K_{VCO}$(VCO gain) value was aintained by switchable varactor. Additionally, VCO was designed that VCO gain and the interval of VCO gain were maintained using VCO gain compensation logic. VCO, PFD, CP and LF were verified by Cadence Spectre, and divider was simulated using Matlab Simulink, ModelSim and HSPICE. VCO consumes 10mW power, and is 56.3% tuning range. VCO phase noise is -127dBc/Hz at 1MHz offset for 1.58GHz output frequency. Total power consumption of the frequency synthesizer is 18mW, and lock time is about $140{\mu}s$.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2015.10a
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• pp.861-862
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• 2015

In this paper we present a low area 12-bit SAR ADC (Successive Approximation Register Analog-to-Digital Converter). The proposed circuit is fabricated using Magnachip/SK Hynix 1-Poly 6-Metal $0.18-{\mu}m$ CMOS process, and it is powered by a 1.8-V supply. Total chip area is reduced by replacing the MIM capacitors with MOS capacitors instead of the capacitors consisting of overall part in chip area. The proposed circuit showed improved power dissipation of 1.9mW, and chip area of $0.45mm^2$ as compared to conventional research results at the power supply of 1.8V. The designed circuit also showed high SNDR (Signal-to-Noise Distortion Ratio) of 70.51dB, and excellent effective number of bits of 11.4bits.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.36C no.5
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• pp.27-37
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• 1999

A CMOS ReadOut Integrated Circuit (ROlC) for InfraRed Focal Plane Array (IRFPA) detector is presented, which is a key component in uncooled thermal imaging systems. The ROIC reads out signals from $64\times64$ Barium Strontium Titanate (BST) infrared detector array, then outputs pixel signals sequentially after amplifying and noise filtering. Various design requirements and constraints have been considered including impedance matching, low noise, low power dissipation and small detector pitch. For impedance matching between detector and pre~amplifier, a new circuit based on MOS diode structure is devised, which can be easily implemented using standard CMOS process. Also, tunable low pass filter with single~pole is used to suppress high frequency noise. In additions, a clamping circuit is adopted to enhance the signal~to-noise ratio of the readout output signals. The $64\times64$ IRFPA ROIC is designed using $0.65-\mu\textrm{m}$ 2P3M (double poly, tripple metal) N~Well CMOS process. The core part of the chip contains 62,000 devices including transistors, capacitors and resistors on an area of about $6.3-mm\times6.7-mm$.