• Title/Summary/Keyword: powder metal

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Influence of Atomizing Condition on Particle Size Distributions for High Pressure Water Atomized Powder

  • Nakabayashi, Koei;Tanaka, Yoshinari;Hirai, Masazumi
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09a
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    • pp.18-19
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    • 2006
  • To improve the properties of fine metal powder, such as particle size distribution and geometric standard deviation, this work was done at various atomizing conditions. The new atomization mechanism and the correlation equation were proposed to estimate the mean particle diameter.

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Influence of Metal-Coating Layer on an Electrical Resistivity of Thick-Film-Type Thermoelectric Modules Fabricated by a Screen Printing Process (스크린 프린팅 공정에 의해 제조된 열전후막모듈의 전기저항에 미치는 금속코팅층의 영향)

  • Kim, Kyung-Tae;Koo, Hye-Young;Ha, Gook-Hyun
    • Journal of Powder Materials
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    • v.18 no.5
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    • pp.423-429
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    • 2011
  • Thermoelectric-thick films were fabricated by using a screen printing process of n and p-type bismuth-telluride-based pastes. The screen-printed thick films have approximately 30 ${\mu}m$ in thickness and show rough surfaces yielding an empty gap between an electrode and the thick film. The gap might result in an increase of an electrical resistivity of the fabricated thick-film-type thermoelectric module. In this study, we suggest a conductive metal coating onto the surfaces of the screen-printed paste in order to reduce the contact resistance in the module. As a result, the electrical resistivity of the thermoelectric module having a gold coating layer was significantly reduced up to 30% compared to that of a module without any metal coating. This result indicates that an introduction of conductive metal layers is effective to decrease the contact resistivity of a thick-film-typed thermoelectric module processed by screen printing.

A COMPARATIVE STUDY OF THE PHYSICOCHEMICAL PROPER TIES AND BOND STRENGTH TO METAL BETWEEN THE REGULAR OPAQUE POWDER AND CORE POWDER (도재소부전장금관용 Opaque 분말과 도재전장관용 core 분말의 물리화학적 성질 및 금속과의 결합력에 대한 비교연구)

  • Lim, Jang-Seop;Chung, Chang-Mo;Jeon, Young-Chan
    • The Journal of Korean Academy of Prosthodontics
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    • v.35 no.1
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    • pp.144-164
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    • 1997
  • The purpose of this study were to investigate the chemical composition, mean particle size, linear thermal expansion coefficient and metal-bonding strength of the regular opaque powder and core powder. In this study, 4 types of ceramic powders, namely Duceram Jacket Opaque powder, Duceram Opaque powder, Vita Hi-Ceram powder, Vita VMK Paint On-88 powder were used. Chemical composition was evaluated by EDS(Energy Dispersive X-ray Spectrophotometer, Oxford QX-2000, England), particle size was measured by MALVERN Instruments(MALVERN Instruments SB. OC., U.S.A.. ad linear thermal expansion coefficient was measured by dilatometer(Motoyama, Japan). Bond strength was measured by the Universal tsting machine(Istron Co., Ltd., U.S.A.). The Results were as follows : 1. Through recognition of the relative difference in chemical composition between the core powder and the regular opaque powder, the difference in the proportion of $Al_2O_3$ in each type of material is demonstrated ; Duceram Jaket Opaque powder : 30.16%, Duceram Opaque powder : 16.60%, Vita Hi-Ceram : 63.64%, Vita VMK Paint-On 88 : 16.16%. 2. There was no significant difference in the proportion of metal-bonding materials between the core powder and the regular opaque powder. 3. In the regular opaque powder, alkaline materials were incoporated in order to increase the coefficient of thermal expansion. 4. In the particle size analysis, there was no significant difference in mean particle size or in the particle size distribution between the core powder and the regular opaque powder. 5. In the thermal expansion test for temperature range of $25-600^{\circ}C$, the regular opaque powder had higher coefficient of thermal expansion than that of core powder. 6. In the 4 point flexural bending test, there was no statistically significant difference in the mean bond strength between the core powder and the opaque powder among the Duceram products.

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Effect of Additive Powder on Microstructural Evolutions and Mechanical Properties of the Wide-gap Brazed Region in IN738 superalloy (초내열합금 wide-gap 브레이징부의 미세조직 및 기계적 성질 변화에 미치는 첨가금속분말의 영향)

  • Kim Y. H.;Kwun S. I.;Byeon J. W.;Lee W. S.
    • Korean Journal of Materials Research
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    • v.15 no.6
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    • pp.399-407
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    • 2005
  • The effect of IN738 additive powder on microstructure and mechanical properties of the wide-gap region brazed with BNi-3 filler metal powder was investigated. The wide-gap brazing was conducted in a vacuum of $2\times10^{-5}torr\;at\;1200^{\circ}C$ with various powder mixing ratios of additive to filler powders. The microstructures of the wide-gap brazed region were analyzed by SEM and AES. The region brazed with only BNi-3 filler metal powder had a microstructure consisted of proeutectic, binary eutectic and ternary eutectic structure, while that brazed with a mixture of IN738 additive powder and BNi-3 filler metal powder had a microstructure consisted of IN738 additive powder, binary eutectic of $Ni_3B-Ni$ solid solution and (Cr, W)B. The fracture strength of the wide-gap brazed region was about 680 MPa regardless of the additive powder mixing ratios. Cracks were initiated at the (Cr, W)B and binary eutectic of $Ni_3B-Ni$ solid solution, and propagated through them in the wide-gap brazed region, which lowered the fracture strength of the region.

Carbon Composite Material Using Nickel Nano-Powder Impregnation Research on Electromagnetic Shielding Effect (니켈나노파우더 함침기법을 이용한 탄소복합소재의 전자파차폐 효과에 관한 연구)

  • Seo, Kwang-Su;Kwac, Lee-Ku
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.19 no.12
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    • pp.49-55
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    • 2020
  • In order to improve the electromagnetic shielding rate of Carbon Fiber (CF), it was produced using the nickel nano-powder impregnating method. Using two types of nickel powder having thicknesses of 50 ㎛ and 100 ㎛, and a thermoplastic elastomer resin, a compound containing 10-20% nickel content was mixed and then manufactured through an extruder. The CF coated with the compound was woven and manufactured using a 1-ply specimen. The final nickel content of the specimen was verified using TGA and the distribution of nickel powder on the CF surface was verified using SEM. The metal shows a high shielding rate in the low-frequency band, but the shielding rate decreases at higher-frequency bands. The CF improves at the higher frequency band, and metals reflect electromagnetic waves while carbon absorbs electromagnetic waves. The study of shielding materials, which are stronger and lighter than metal, by using CF lighter than metal and enabling the shielding rate from low-frequency band to high-frequency band, confirmed that the larger the area coated with nickel nano-powder, the better the electromagnetic shielding performance. In particular, CF coated with a thickness of 100 ㎛ has a shielding rate similar to that of copper and can also be used for EV/HEV automotive cables and other applications in the future.

Production of High-Purity Tantalum Metal Powder for Capacitors Using Self-Propagating High-Temperature Synthesis

  • Yong-Kwan Lee;Jae-Jin Sim;Jong-Soo Byeon;Yong-Tak Lee;Yeong-Woo Cho;Hyun-Chul Kim;Sung-Gue Heo;Kee-Ahn Lee;Seok-Jun Seo;Kyoung-Tae Park
    • Archives of Metallurgy and Materials
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    • v.66 no.4
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    • pp.935-939
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    • 2021
  • In this study, high-purity tantalum metal powder was manufactured via self-propagating high-temperature synthesis. During the process, Ta2O5 and Mg were used as the raw material powder and the reducing agent, respectively, and given that combustion rate and reaction temperature are important factors that influence the success of this process, these factors were controlled by adding an excessive mass of the reducing agent (Mg) i.e., above the chemical equivalent, rather than by using a separate diluent. It was confirmed that Ta metal powder manufactured after the process was ultimately manufactured 99.98% high purity Ta metal powder with 0.5 ㎛ particle size. Thus, it was observed that adding the reducing reagent in excess favored the manufacture of high-purity Ta powder that can be applied in capacitors.