• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.392-393
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• 2006

This paper describes the fabrication of SiCN microstructures for super-high temperature MEMS using photopolymerization of pre-ceramic polymer. In this work. polysilazane liquide as a precursor was deposited on Si wafers by spin coating. microstructured and solidificated by UV lithography. and removed from the substrate. The resulting solid polymer microstructures were cross-linked under HIP process and pyrolyzed to form a ceramic of withstanding over $1400^{\circ}C$. Finally, the fabricated SiCN microstructures were annealed at $1400^{\circ}C$ in a nitrogen atmosphere. Mechanical characteristics of the SiCN microstructure with different fabrication process conditions were evaluated. The elastic modules. hardness and tensile strength of the SiC microstructure implemented under optimum process conditions are 94.5 GPa, 10.5 GPa and 11.7 N/min, respectively. Consequently, the SiCN microstructure proposed in this work is very suitable for super-high temperature MEMS application due to very simple fabrication process and the potential possiblity of sophisticated multlayer or 3D microstructures as well as its good mechanical properties.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.376-379
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• 2003

In this paper, a novel processing technique for fabrication of high-temperature MEMS based on polymer-derived SiCN microstructures is described. PDMS molds are fabricated on SU-8 photoresist using standard UV-photolithographic processes. Liquid precursors are injected into the PDMS mold. And then, the resulting solid polymer structures are crosslinked under isostatic pressure, and pyrolyzed to form a ceramic capable of withstanding over $1500^{\circ}C$. These fabricated SiCN structures would be applied for high-temperature applications, such as heat exchanger and combustion chamber.

• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.379-380
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• 2008

This paper presents a wafer-level package using a Dry Film Resist(DFR) for RF MEMS devices. Vertical interconnection is made through the hole formed on the glass cap. Bonding using the DFR has not only less effects on the surface roughness but also low process temperature. We used DFR as adhesive polymer and made the vertical interconnection through Au electroplating. Therefore, we developed a wafer-level package that is able to be used in RF MEMS devices and vertical interconnection.

• Polymer(Korea)
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• v.28 no.1
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• pp.3-9
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• 2004

Silane modified perfluoropolyethers (SPFPE) was synthesized as a self-assembled mono-layers (SAMs) thin film for micro-electro mechanical system (MEMS). SPFPE was compared to the Perfluoropolyethers (PFPE) as well as octadecyltrichlorosilane (OTS) and perfluorooctyltrichlorosilane (FOTS) with respect to the development of hydrophobicity in the SAMs surface. SPFPE shows less hydrophobicity than those of OTS and FOTS. Thermal annealing of SPFPE SAMs resulted in the enhancement of hydrophobicity as much as those of OTS and FOTS. The SAMs formed from SPFPE were found to be similar as OTS and FOTS SAMs with smooth R$\sub$a/ values of 0.3 nm. However, the flexible chain mobility of SPFPE resulted in 50% reduction as much as the fiction force in OTS.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.216-216
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• 2009

This paper describes a novel processing technique for the fabrication of polymer-derived SiCN (silicone carbonitride) microstructures for extreme microelectromechanical system (MEMS) applications. A polydimethylsiloxane (PDMS) mold was formed on an SU-8 pattern using a standard UV photolithographic process. Next, the liquid precursor, polysilazane, was injected into the PDMS mold to fabricate free-standing SiCN microstructures. Finally, the solid polymer SiCN microstructure was cross-linked using hot isostatic pressure at $400^{\circ}C$ and 205 bar. The optimal pyrolysis and annealing conditions to form a ceramic microstructure capable of withstanding temperatures over $1400^{\circ}C$ were determined. Using the optimal process conditions, the fabricated SiCN ceramic microstructure possessed excellent characteristics includingshear strength (15.2 N), insulation resistance ($2.163{\times}10^{14}\;{\Omega}$, and BDV (1.2 kV, minimum). Since the fabricated ceramic SiCN microstructure has improved electrical and physical characteristics compared to bulk Si wafers, it may be applied to harsh environments and high-power MEMS applications such as heat exchangers and combustion chambers.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2006.10a
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• pp.14-17
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• 2006

This paper describes a novel processing technique for fabrication of polymer-derived SiCN (silicone carbonitride) microstructures for super-temperature MEMS applications. PDMS (polydimethylsiloxane) mold is fabricated on SU-8 photoresist using standard UV photolithographic process. Liquid precursor is injected into the PDMS mold. Finally, solid polymer structure is cross-linked using HIP (hot isostatic pressure) at $400^{\circ}C$, 205 bar Optimum pyrolysis and anneal ins conditions are determined to form a ceramic microstructure capable of withstanding over $1400^{\circ}C$. The fabricated SiCN ceramic microstructure has excel lent characteristics, such as shear strength (15.2 N), insulation resistance ($2.163{\times}10^{14}\;{\Omega}$) and BDV (min. 1.2 kV) under optimum process condition.

• Journal of Mechanical Science and Technology
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• v.20 no.4
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• pp.505-512
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• 2006

This paper presents an integrated multifunctional sensor based on MEMS technology, which can be used or embedded in mobile devices for environmental monitoring. An absolute pressure sensor, a temperature sensor and a humidity sensor are integrated in one silicon chip of which the size is $5mm\times5mm$. The pressure sensor uses a bulk-micromachined diaphragm structure with the piezoresistors. For temperature sensing, a silicon temperature sensor based on the spreading-resistance principle is designed and fabricated. The humidity sensor is a capacitive humidity sensor which has the polyimide film and interdigitated capacitance electrodes. The different piezoresistive orientation is used for the pressure and temperature sensor to avoid the interference between sensors. Each sensor shows good sensor characteristics except for the humidity sensor. However, the linearity and hysteresis of the humidity sensor can be improved by selecting the proper polymer materials and structures.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.3 s.96
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• pp.62-71
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• 1999

Integrating micro-machined sensors and actuators on the conventional devices with the copper power lines was incompatible to fabricate the mass produced micro electromechanical system (MEMS) devices. To achieve the compatibility of the wiring method between MEMS parts and devices, we developed the three-dimensional sputter-evaporation system that coats micropatterned thin copper films on the surface of the MEMS element. The system consists of a process chamber, two branch chambers, the substrate holder, and a linear-rotary motion feedthrough. Thin copper film was sputtered and evaporated on the biocompatible polymer, Pellethane$^{circed{R}}$ and silicone, catheter that is 2 mm in diameter and 700 mm in length. The metal film coating technique with three-dimensional thin film sputter-evaporation system was developed to apply the power and signal lines on the micro active endoscope. In this paper, we developed the three-dimensional metal film sputter-evaporation system operated on the low temperature for the biopolymeric substrates used in the medical MEMS devices.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.75-78
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• 1995

This paper presents the feasibility of laser ablation process in 3-D micro machining of MEMS (micro Electro Mechanical System)parts. The micro machining characteristics of polymer(Energy fluence, pulse repetition rate, number of pulse, ablation rate)are investigated and 3-D micro machined samples are demonstrated.

• Polymer Science and Technology
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• v.15 no.2
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• pp.173-183
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• 2004

노벨 물리학상을 수상한 파인만 (Richard p. Feynman) 교수는 1959년 한 강연회에서 "There's Plenty of Room at the Bottom"이라는 내용을 발표한 바 있다. 이는 나노 세계의 가치를 처음으로 알린 계기가 되었으며, 21세기를 이끌어가는 대표적인 과학기술로 자리 잡게 만드는 시발점이 되었다. 20세기 후반부터 나노기술에 대한 관심과 투자는 신기술의 개발뿐만 아니라 종래 기술의 단점 개선과 기술의 향상을 도모하였다. 이로 인하여 기술간의 융합이 이루어졌으며, 학문간의 벽은 점차 사라져 가고 있다. 즉 바이오기술과 나노 (예, BioMEMS), 나노소재를 이용한 환경기술 등 기술융합은 진보된 새로운 기술들을 이끌어가고 있다.(중략)