Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2003.11a
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- Pages.376-379
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- 2003
Fabrication of SiCN structures using PDMS mold for high-temperature applications
PDMS 몰드를 이용한 초고온용 SiCN 구조물의 제작
- Woo, Hyung-Soon (School of Information System Eng., Dongseo Univ.) ;
- Kim, Gue-Hyun (School of Applied Eng., Dongseo Univ.) ;
- Chung, Gwiy-Sang (School of Information System Eng., Dongseo Univ.)
- Published : 2003.11.13
Abstract
In this paper, a novel processing technique for fabrication of high-temperature MEMS based on polymer-derived SiCN microstructures is described. PDMS molds are fabricated on SU-8 photoresist using standard UV-photolithographic processes. Liquid precursors are injected into the PDMS mold. And then, the resulting solid polymer structures are crosslinked under isostatic pressure, and pyrolyzed to form a ceramic capable of withstanding over