• 한국재료학회지
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• 제15권4호
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• pp.246-251
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• 2005

Plasma enhanced chemical vapor deposition(PE-CVD) method has an advantage in synthesizing carbon nanotubes(CNTs) at lower temperature compared with thermal enhanced chemical vapor deposition(TE-CVD) method. In this study, CNTs was prepared by using PE-CVD method. The growth rate of CNT was faster more than 100 times on using Invar alloy than iron as catalyst. It was found that chrome silicide was formed at the interface between chrome layer and silicon substrate which should be considered in designing process. Nanoparticles of Invar catalyst were found oxidized on their surfaces with a depth of 10 m. Microstructure was analyzed by scanning electron microscopy, transmission electron microscopy, scanning transmission electron microscopy, and energy dispersive x-ray spectrometry. Based on the result of analysis, growth mechanism at an initial stage was suggested.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.689-689
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• 2013

Atomic layer deposition (ALD)에 의한 알루미늄 산화 막(Al2O3)은 고효율 결정질 실리콘 태양전지를 위한 우수한 표면 패시베이션 특성을 제공한다. 알루미늄 산화막는 고정적인 음전하를 가지고 있기 때문에 p-형 실리콘 태양 전지 후면은 전계에 의한 우수한 패시베이션 효과를 형성한다. 그러나, ALD 방식으로 증착된 알루미늄 산화막은 매우 긴 공정 시간을 필요로 하기 때문에 기존의 실리콘 태양 전지 공정에 적용하기가 어렵다. 본 논문에서는 알루미늄 산화막 형성에서 공정 시간을 줄이기 위해 Plasma assisted atomic layer deposition (PA-ALD) 방식을 적용했다. PA-ALD 기술은 trimethylaluminum (TMA)과 O2를 사용하여 기판 표면에 알루미늄 산화막을 증착하는 것으로 ALD 방식과 유사하지만, O2 플라즈마를 사용함으로써 증착 속도를 향상시킬 수 있다. 이는 좋은 패시베이션 특성을 가지는 알루미늄 산화막을 실리콘 태양전지양산 공정에 적용할 수 있는 가능성을 제시한다. PA-ALD 방식에 의한 알루미늄 산화막의 패시베이션 특성을 최적화하기 위해서 증착 후 열처리 조건에 대한 연구도 수행하였다. 막증착률이 1.1${\AA}$/cycle인 Al2O3층의 두께 변화에 따른 특성을 최적화하기 위해 공정 온도를 $250^{\circ}C$ 고정하고, 열처리 온도와 시간을 가변하였으며 유효 반송자수명을 측정하여 알루미늄 산화막의 패시베이션 특성을 확인했다.

• Journal of Electrical Engineering and Technology
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• 제1권1호
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• pp.110-113
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• 2006

A high rate deposition sputtering process of magnesium oxide thin film in oxide mode has been developed using a 20 kW unipolar pulsed power supply. The power supply was operated at a maximum constant voltage of 500 V and a constant current of 40 A. The pulse repetition rate and the duty were changed in the ranges of $10\sim50$ kHz and $10\sim60%$, respectively. The deposition rate increased with rising incident power to the target. Maximum incident power to the magnesium target was obtained by the control of frequency, duty and current. The deposition rate of a moving state was 9 nm m/min at the average power of 1.5 kW. This result shows higher deposition rate than any other previous work involving reactive sputtering in oxide mode. The thickness uniformities over the entire substrate area of $982mm{\times}563mm$ were observed at the processing pressure of $2.8\sim9.5$ mTorr. The thickness distribution was improved at lower pressure. This technique is proposed for application to a high through-put sputtering system for plasma display panels.

• 한국표면공학회지
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• 제41권2호
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• pp.43-47
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• 2008

Cubic boron nitride(c-BN) films were deposited on tungsten carbide insert tool by microwave plasma enhanced chemical vapor deposition(MPECVD) from a gas mixture of triethyl borate$(B(C_2H_5O)_3)$, ammonia $(NH_3)$, hydrogen$(H_2)$ and argon(Ar). The qualities of deposited thin film were investigated by x-ray diffrac-tion(XRD), field emission scanning electron microscopy(FE-SEM) and micro Raman spectroscope. The surface morphologies of the synthesised BN as well as crystallinity appear to be highly dependent on the flow rate of $B(C_2H_5O)_3$ and $(NH_3)$ gases. The deposited film had more crystallized phases with 5 scem of $B(C_2H_5O)_3$ and $(NH_3)$ gases than with 2 sccm, and the phase was identified as c-BN by micro Raman spectroscope and XRD. The adhesion strength were also increased with increasing flow rates of $B(C_2H_5O)_3$ and $(NH_3)$ gases.

• 반도체디스플레이기술학회지
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• 제21권2호
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• pp.38-44
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• 2022

Plasma density in semiconductor fabrication equipment becomes higher to achieve the improved the throughput of the process, but the increase of surface corrosion of the ceramic coated chamber wall has been observed by the increased plasma density. Plasma chamber wall coating with aerosol deposition prefer to be firm and uniform to prevent the potential creation of particle inside the chamber from the deformation of the coating materials, and the aerosol discharge nozzle is a good control factor for the deposited coating condition. In this paper, we investigated the design of the nozzle of the aerosol deposition to form a high-quality coating film. Computational fluid dynamics (CFD) study was employed to minimize boundary layer effect and shock wave. The degree of expansion, and design of simulation approach was applied to found out the relationship between the divergence angle and nozzle length as the key parameter for the nozzle design. We found that the trade-off tendency between divergence angle and nozzle length through simulation and quantitative analysis, and present the direction of nozzle design that can improve the uniformity of chamber wall coating.

• 열처리공학회지
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• 제35권2호
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• pp.51-56
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• 2022

In this study, we controlled the shape of a carbon layer on gallium oxide templates. Gallium oxide layers were deposited on sapphire substrates using mist chemical vapor deposition. Subsequently, carbon layers were formed using radio frequency plasma chemical vapor deposition. Various shapes of carbon structures appeared according to the fraction of methane gas, used as a precursor. As methane gas concentration was adjusted from 1 to 100%, The shapes of carbon structures varied to diamonds, nanowalls, and spheres. The growth of carbon isotope structures on Ga₂O₃ templates will give rise to improving the electrical and thermal properties in the next-generation electronic applications.

• 한국표면공학회지
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• 제34권5호
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• pp.409-413
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• 2001

In this study, high rate deposition of thick CrNx films was carried out by crossed field unbalanced magnetron sputtering for the special application such as piston ring employed in automobile engine. For the high rate deposition and thick CrNx films formation with thickness of 30$\mu\textrm{m}$, high power density of $35W/cm^2$ in each target was induced and the multi-layer films of Cr/CrN and $\alpha$-Cr/CrN were synthesized by control of $N_2$ flow rate. The dynamic deposition rate of Cr and $\alpha$-CrN film was reached to 0.17$\mu\textrm{m}$/min and 0.12$\mu\textrm{m}$/rnin and the thick CrN$_{x}$. film of 30$\mu\textrm{m}$ could be obtained less than 5 hours. The maximum hardness was obtained above 2200 kg/mm$^2$ and adhesion strength was measured in about 70N, in case of multi-layers films. And the friction coefficient was measured by 0.4, which was similar to the value of CrN single-layer film.m.

• Applied Microscopy
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• 제47권1호
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• pp.13-18
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• 2017

High-quality graphene was synthesized on Cu foil and $Fe_2O_3$ film using $CH_4$ gas via inductively-coupled plasma chemical vapor deposition (ICPCVD). The graphene film was formed on $Fe_2O_3$ at a temperature as low as $700^{\circ}C$. Few-layer graphene was formed within a few seconds and 1 min on Cu and $Fe_2O_3$, respectively. With increasing growth time and plasma power, the graphene thickness was controllably reduced and ultimately self-limited to a single layer. Moreover, the crystal quality of graphene was constantly enhanced. Understanding the ICPCVD growth kinetics that are critically affected by ICP is useful for the controllable synthesis of high-quality graphene on metals and oxides for various electronic applications.

• 조명전기설비학회논문지
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• 제25권4호
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• pp.79-87
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• 2011

In this paper, the best conditions for the deposition of the high quality diamond thin-film from N-hexane as a carbon source in the microwave plasma process was carried out. Major parameters are the deposition time, flow rates of oxygen and hexane. The deposition time for the steady state thin-film was required more than 4[h], and the suitable flow rates of hexane and oxygen for the high-quality thin-film are 0.4[sccm] and 0.1~0.2[sccm], respectively. In addition, amorphous carbons such as DLC and graphite were grown by increasing the flow rate of hexane, and it decreased by increasing the flow rate of oxygen. Specifically, the growth rate is about 1.5[${\mu}mh-1$] under no addition of oxygen and it decreased about 60[%] as ca. 1.0[${\mu}mh-1$] with oxygen.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2007년도 춘계학술대회
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• pp.309-312
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• 2007

Sputter deposition followed by surface treatment was studied using reactive RF plasma as a method for preparing titanium oxide($TiO_{2}$) films on indium tin oxide(ITO) coated glass substrate for dye-sensitized solar cells(DSSCs). Anatase structure $TiO_{2}$ films deposited by reactive RF magnetron sputtering under the conditions of $Ar/O_{2}$(5%) mixtures, RF power of 600W and substrate temperature of $400^{\circ}C$ were surface-treated by inductive coupled plasma(ICP) with $Ar/O_{2}$ mixtures at substrate temperature of $400^{\circ}C$, and thus the films were applied to the DSSCs, The $TiO_{2}$ Films made on these exhibited the BET specific surface area of 95, the pore volume of $0.3cm^{2}$ and the TEM particle size of ${\sim}25$ nm. The DSSCs made of this $TiO_{2}$ material exhibited an energy conversion efficiency of about 2.25% at $100mW/cm^{2}$ light intensity.