• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.5
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• pp.559-563
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• 2011

Drop impact reliability assessment of solder joints on the flip chip is one of the critical issues for micro system packaging. Our previous researches have been showing that new solder ball compositions of Sn-3.0Ag-0.5Cu has better mechanical reliability than Sn-1.0Ag-0.5Cu. In this paper, dynamic reliability analysis using Finite Element Analysis (FEA) is carried out to assess the factors affecting flip chip in drop simulation. The design parameters are size and thickness of chip, and size, pitch and array of solder ball with composition of Sn1.0Ag0.5Cu. The board systems by JEDEC standard including 15 chips, solder balls and PCB are modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder balls. It is found that larger chip size, smaller chip array, smaller ball diameter, larger pitch, and larger chip thickness have bad effect on maximum yield stress and strain at solder ball of each chip.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.18 no.6
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• pp.459-467
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• 2006

Rapid development of electronic technology requires small size, high density packaging and high power in the electronic devices, which results in more heat generation. Suitable heat dissipation is required to ensure the guaranteed performance and reliable operation of the current state-of-the-art electronic equipment. The aim of the present study is to find out the forced-convective thermal-hydraulic characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices through the analysis and experiment. Various configuration of the pin-fin array is selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. Experimental results are compared with the analyses and correlations of several researchers. Finally, the design guide are provided for the required pressure drop and/or the heat transfer characteristics of the heat exchanger.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.11 s.176
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• pp.165-172
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• 2005

In MEMS (Micro-Electro-Mechanical System), packaging induced stress or stress induced structure deformation becomes increasing concerns since it directly affects the performance of the device. In the decoupled vibratory MEMS gyroscope, the main factor that determines the yield rate is the frequency difference between the sensing and driving modes. The gyroscope, packaged using the anodic bonding at the wafer level and EMC (epoxy molding compound) molding, has a deformation of MEMS structure caused by thermal expansion mismatch. This effect results in large distribution in the frequency difference, and thereby a lower yield rate. To improve the yield rate we propose a packaged SiOG (Silicon On Glass) process technology. It uses a silicon wafer and two glass wafers to minimize the wafer warpage. Thus the warpage of the wafer is greatly reduced and the frequency difference is more uniformly distributed. In addition. in order to increase robustness of the structure against deformation caused by EMC molding, a 'crab-leg' type spring is replaced with a semi-folded spring. The results show that the frequency shift is greatly reduced after applying the semi-folded spring. Therefore we can achieve a more robust vibratory MEMS gyroscope with a higher yield rate.

• Korean Journal of Materials Research
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• v.17 no.3
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• pp.179-183
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• 2007

A plate heat exchanger (PHE) normally uses vacuum brazing technology for connecting plates and fins. However, the reliability of high temperature brazing, especially with nickel-based filler metals containing boron the formation of brittle intermetallic compounds (IMCs) in brazed joints is of major concern. since they considerably degrade the mechanical properties. This research was examined the vacuum brazing of commercially SUS304 stainless steel with BNi-2 (Ni-Cr-B-Si) filler metal, and discussed to determine the influence of brazing temperatures on the microstructure and mechanical strength of brazed joints. In the metallographic analysis it is observed that considerable large area of Cr-B intermetallic compound phases at the brazing layer and the brazing tensile strength is related to removal of this brittle phase greatly. The mechanical properties of brazing layer could be stabilized through increasing the brazing temperature over $100^{\circ}C$ more than melting temperature of filler metals, and diffusing enough the brittle intermetallic compound formed in the brazing layer to the base metal.

• Korean Journal of Materials Research
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• v.17 no.3
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• pp.142-146
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• 2007

Vacuum brazing method has been coming to an important process as one of the new fabricating techniques of metals and alloys. In this study, a vacuum brazing of SUS304 stainless steel with BNi-2 filler metal was carried out in $1{\times}10^{4}$ Torr of vacuum atmosphere. The formation of brittle intermetallic compounds in brazed joints between SUS304 stainless steel and BNi-2 filler metal is a major concern, since they considerably degrade the mechanical properties of joints. To obtain enough stable joining strength, it is necessary to understand the unique properties of brazing process with Ni-based filler metals containing boron. So, in this research we investigated the performance of SUS304/BNi-2 brazed system and the brazed joint properties were evaluated at room temperature by using tensile test. Metallurgical and fractographic analysis were used to characterize the microstructure, the mechanisms of brazing, and joint failure modes.

• Journal of Applied Reliability
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• v.7 no.1
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• pp.23-29
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• 2007

Probe card is a test component which is to classify the known good die with electrical contact before the packaging in the ATE (automatic testing equipment). Conventional probe tip was mostly needle type, it has been difficult to meet with conventional type, because of decreasing chip size, pad to pad pitch and pads size increasingly. For that reason, probe cards using MEMS (micro electro mechanical system) technology have been developed for various semiconductor chips. In this paper, Area Array type MEMS Probe tip was designed,, fabricated, and characterized its mechanical and electrical properties. The authors found that good electrical characteristics under $1{\Omega}$ were acquired with gold (Au) and aluminium (Al) pad contact test over 0.5gf and 4gf respectively. And, contact resistance variation under $0.1{\Omega}$ were achieved with 100,000 times of repetition test. And, insertion loss (IS) for high frequency operation was ascertained over 300MHz at -3dB loss.

• Journal of the Korea Safety Management & Science
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• v.15 no.1
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• pp.183-191
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• 2013

After the Uruguay Round, Korean agriculture industry has been protected and reared with government grants. However, until now there has been very minimal development to establish a solid export industry which can make the most of the trade agreements in place. There has been much research on ways to expand agricultural exports in order to respond properly to this ever changing environment and sustainable agricultural industry. As all other export industries, an efficient logistics network is paramount in order to allow the agricultural industry to respond to changes in demand and penetrate global markets. The lack of systematic logistics activities such as packaging, transportation, unloading, storage, and information transfer in farms has been a major factor in the inefficiency of the agricultural industry resulting in minimal development. From this perspective, 3PL was proposed and applied as a way to build on the streamlining of export of agricultural logistics system. The Agri 3PL is considered as an efficient agricultural exports method as a new concept connecting producers with exporters.

• Korean Journal of Food Science and Technology
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• v.22 no.5
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• pp.575-581
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• 1990

The existence of the equivalent point for a thermal processing system was demonstrated using arbitrarily chosen ideal direct heating curves. i.e. isothermal heating curves at $120^{\circ}C$ for 10min and at $135^{\circ}C$ for 10sec. Under these conditions, G-values and F-values were calculated at various values of Ea- and z-values by applying the Arrhenius and the Bigelow models respectively. The equivalent time and equivalent temperature were determined by both line intersection and linear regression methods. The equivalent points estimated by both the line intersection and the linear regression methods were consistent and their values were the same as the heating time and temperature of the ideal direct heating curves.

• Korean Journal of Computational Design and Engineering
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• v.14 no.3
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• pp.186-196
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• 2009

Mass customization (MC) is a business practice that aims to provide customers with customized products and services at near mass production efficiency. To achieve the aim, a number of methods to implementing MC are proposed. However, most of them require changes in entire process of the company, which make companies hesitate to implement MC even if it is essential to survive. In this paper, we proposed alternatives to partially implement MC for quick adaptation of MC. The base line assumption is not to change the production lines. The pros and cons of alternatives are given by qualitative and quantitative evaluation. Especially, by giving radar chart analysis of the quantitative measures, we give insight on the changes in the business performance measures, such as time to market and cost. Proposed alternatives are based on sub-processes such as purchasing raw materials, production process changes and packaging for efficient logistics. In this way, companies are able to provide customized products with small changing of the current manufacturing system. The process and benefit of the proposed strategy is verified by real world cases of a Korean health food company.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.63 no.4
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• pp.283-289
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• 2014

A Fresnel lens is an optical component which can be used as a cost-effective, lightweight alternative to conventional continuous surface optics. Fresnel lens solar concentrators continue to fulfill a market requirement as a system component in high volume cost effective Concentrating Photovoltaic (CPV) electricity generation. The basic principles of the fresnel lens are reviewed and some practical examples are described. To investigate the performance space of the Fresnel lens, a fast simulation method which is a hybrid between raytracing and analytical computation is employed to generate a cache of simulation data. Injection molders are warming up to the idea of cycling their tool surface temperature during the molding cycle rather than keeping it constant. Heat and cool process are now also finding that raising the mold wall temperature above the resin's glass-transition or crystalline melting temperature during the filling stage and product performance in applications from automotive to packaging to optics. This paper deals with the suitability of Fresnel lenses of imaging and non-imaging designs for solar energy concentration. The concentration fresnel lens confirmed machinability and optical transmittance and roughness measure through manufactured the prototype.