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Design of a Pin-Fin Structure in a Channel Considering the Heat Transfer and Pressure Drop Characteristics  

Shin, Jee-Young (Department of Mechanical Engineering, Dong-Eui University)
Son, Young-Seok (Department of Mechanical Engineering, Dong-Eui University)
Lee, Dae-Young (Korea Institute of Science and Technology)
Publication Information
Korean Journal of Air-Conditioning and Refrigeration Engineering / v.18, no.6, 2006 , pp. 459-467 More about this Journal
Abstract
Rapid development of electronic technology requires small size, high density packaging and high power in the electronic devices, which results in more heat generation. Suitable heat dissipation is required to ensure the guaranteed performance and reliable operation of the current state-of-the-art electronic equipment. The aim of the present study is to find out the forced-convective thermal-hydraulic characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices through the analysis and experiment. Various configuration of the pin-fin array is selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. Experimental results are compared with the analyses and correlations of several researchers. Finally, the design guide are provided for the required pressure drop and/or the heat transfer characteristics of the heat exchanger.
Keywords
Electronic device; Cooling technology; Pin-fin array; Porosity; Design guide;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
연도 인용수 순위
1 Kraus, A D. and Bar-Cohen, A., 1983, Thermal Analysis and Control of Electronic Equipment, McGraw Hill, New York
2 Kim, S. J. and Kim, D., 1999, Forced convection in microstructures for electronic equipment cooling, ASME J. of Heat Transfer, Vol. 121, pp.639-645   DOI
3 Vafai, K. and Kim, S. J., 1989, Forced convection in a channel filled with a porous medium: An exact solution, ASME J. of Heat Transfer, Vol. 111, pp.1103-1106   DOI
4 Shin, J. Y., Son, Y. S. and Lee, D. Y. 2003, Analysis on the cooling characteristics of a channel with pin-fin structure, Transactions of the Society of Air-Conditioning and Refrigerating Engineers of Korea, Vol. 15, No. 8, pp. 667-673 (in Korean)   과학기술학회마을
5 Shin, J. Y., Son, Y S., Kim, S. M. and Lee, D. Y, 2004 Experiments on the heat transfer and pressure drop characteristics of a channel with pin-fin array, Transactions of the Society of Air-Conditioning and Refrigerating Engineers of Korea, Vol. 16, No.7, pp. 623-629 (in Korean)   과학기술학회마을
6 You, H. I. and Chang, C. H., 1997, Numerical prediction of heat transfer coefficient for a pin-fin channel flow, ASME J. of Heat Transfer, Vol. 119, pp.840-843   DOI   ScienceOn
7 VanFossen, G. J., 1982, Heat transfer coefficients for staggered arrays of short pin fins, ASME J. of Heat Transfer, Vol. 104, pp.268-273
8 Cho, H. H. and Goldstein, R. J.. 1997, Heat transfer and friction loss characteristics of shaped short pin -fin arrays, Transactions of the Society of Air-Conditioning and Refrigerating Engineers of Korea, Vol. 9, No.3, pp. 259-267 (in Korean)
9 Jin, J. S., Lee, D. Y. and Kang, B. H., 2000, Effect of the hydraulic boundary layer on the convective heat transfer in porous media, Transactions of The Korea Society of Mechanical Engineers, Vol. 24, No.8, pp. 1119-1127 (in Korean)   과학기술학회마을
10 Kuwahara, F. and Nakayama, A., 1999, Numerical determination of thermal dispersion coefficients using a periodic porous structure, ASME J. of Heat Transfer, Vol. 121, pp. 160-163   DOI   ScienceOn
11 Hanamann, R. J., 1981, Microelectronic device thermal resistance: A format for standardization, Heat Transfer in Electronic Equipment (ASME HTD-20), pp.39-48
12 Kim, S. J., Kim, D. and Lee, D. Y., 2000, On the local thermal equilibrium in microchannel heat sinks, Int. J. of Heat and Mass Transfer, Vol. 43, pp.1735-1748   DOI   ScienceOn
13 Lee, D. Y. and Vafai, K., 1999, Analytical characterization and conceptual assessment of solid and fluid temperature differential in porous media, Int. J. of Heat and Mass Transfer, Vol. 42, pp. 423-435   DOI   ScienceOn
14 Oktay, S., Hannemann, R. and Bar-Cohen, A., 1996, High heat from a small package, Mechanical Engineering, Vol. 108, pp.36-42