• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1191-1194
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• 2003

At present, the fabrication of optical filter for optical communication mostly depends on handwork, and only a few companies are propelling semi-automatic systems compounded with automatic and hand-operated methods. The measurement evaluation of optical filters is not commonly useful, so it causes difficulties in the producing field. And the packaging process becomes a very unstable process because the filters are judged from the results that they are not measured and immediately packaged during that process. In this situation, the automatic assembly system of optical filter for communication is extremely important and has begun to make its appearance as the most necessary technology for developing optical communication component with high-functionality. In this paper, we constructed systems of assembly and performance evaluation for micro optical collimator. And by using that, we designed a system capable of performance evaluation and assembly of film filter of about 30 $\mu\textrm{m}$ thickness as well as optical filter for common communication.

• Journal of the Korean Society of Industry Convergence
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• v.16 no.4
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• pp.133-140
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• 2013

This paper presents an overview of the concepts of optimal feeder design in relation to the loading of bulk solids for Automatic filling system that should be control the amount of goods and packaging to seal. Feeder modular device, important parts of the package, so in order to perform a conceptual design optimization techniques are applied in two steps. First of all derive the problems through structural analysis for the conceptual model of vibrating feeder. Secondly derive reasonable design model based on the results of the structural analysis of modified boundary shape and then verify it. The proposed system has the following goal that is satisfies the dynamic stability with minimum weight and optimization of the shape. As a result, the weight reduction of feeder is 2.1% and 7% increase in the natural frequency.

• Industrial Engineering and Management Systems
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• v.3 no.1
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• pp.71-77
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• 2004

In this paper, the difficulties involved in analyzing and designing a management system for product development are discussed with reference to reducing the impact of products on the environment. We propose some models and methods to analyze information behavior in the process of product development based on a fusion model which integrates the assessments of users’ needs, the environment, and available technology. These models and methods are subsequently applied to the development of a new packaging material. The results of this case study allow us to identify effective information for the design of a management system for product development to reduce the impact of products on the environment.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.24 no.3
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• pp.97-106
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• 2018

This study aimed at examining the suitability of $Tenax^{(R)}$ for the migration testing of food packaging materials, which is currently approved in the EU as a dry food simulant. The results are used as a basis to examine the feasibility of introducing $Tenax^{(R)}$ to Korean regulation. The OMVs of test specimen into various solvents (diethyl ether, ethanol, pentane, and acetone) after exposure to $100^{\circ}C$ for 1 hr were compared. Diethyl ether showed the highest OMV ($1.33mg/dm^2$) among the solvents tested. When the tests were conducted with different amounts of $Tenax^{(R)}$ of 2, 4, or 8 g per specimen, the OMVs were 0.75, 1.33 and $1.40mg/dm^2$, respectively. The OMV obtained with a closed system after wrapping with aluminum foil showed a significantly higher OMV ($1.61mg/dm^2$) than that without aluminum wrapping ($1.318mg/dm^2w$) and an open system without lid ($1.06mg/dm^2$). The specific migration rates of surrogates spiked in the polyethylene test film and paper samples into $Tenax^{(R)}$ were compared with those into liquid food simulants including 95% ethanol and n-heptane, and actual foods such as starch, skim milk, and sugar. In general, the specific migration levels of surrogates into $Tenax^{(R)}$ were similar compared with n-heptane, however those were significantly higher than into actual foods. These results suggest that $Tenax^{(R)}$ may be used as a food simulant for the long-term preservation of dried foods and paper products. However, more studies need to be conducted to investigate the factors influencing the migration into $Tenax^{(R)}$, such as the types of foods and packaging materials tested, migration conditions, and surrogates properties etc.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.81-87
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• 2012

This paper focuses on three-dimensional measurement system of micro balls on micro Ball-Grid-Array(BGA) packages in-line. Most of visual inspection system still suffers from sophisticate reflection characteristics of micro balls. For accurate shape measurement of them, a specially designed visual sensor system is proposed under the sensing principle of phase shifting moire interferometry. The system consists of a pattern projection system with four projection subsystems and an imaging system. In the projection system, four subsystems have spatially different projection directions to make target objects experience the pattern illuminations with different incident directions. For the phase shifting, each grating pattern of subsystem is regularly moved by PZT actuator. To remove specular noise and shadow area of BGA balls efficiently, a compact multiple-pattern projection and imaging system is implemented and tested. Especially, a sensor fusion algorithm to integrate four information sets, acquired from multiple projections, into one is proposed with the basis of Bayesian sensor fusion theory. To see how the proposed system works, a series of experiments is performed and the results are analyzed in detail.

• Korean Journal of Computational Design and Engineering
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• v.16 no.1
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• pp.52-60
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• 2011

In this research, we developed a design system for a compressor of an air conditioner using solid CAD system. The developed design system has some characteristics. First, the design system used a configuration design method, so a designer can design a compressor very quickly by using the constructed master libraries. Next, the system was developed to be used not only by engineers but also by salesmen. It is very easy for a user to use it, so a salesman can get a result very easily with the design system. And it has some design modules which give a considerable convenience to designers. Actually, designers are accustomed to the module based design. Then, it has calculation and analysis functions. Volume and mass of a part, and interference between parts are calculated by using the geometric calculation function of a solid CAD system. Also a packaging calculation was implemented to get the smallest space to package compressors for transportation and storing. An interface with a program to analyze the vibration of a compressor was developed in this design system. The design system is similar to CBD (Case-Based Design) system in the view of the whole design process.

• Proceedings of the Korean DIstribution Association Conference
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• 2000.10a
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• pp.183-185
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• 2000

A proactive approach on environmental issues may be one of critical competitive factors for global business in near future. Especially, distribution systems are very related to the various environmental issues, including development of green products and packaging, selection of the transportation vehicles and pallets, design of retail stores and distribution facilities, participation for solving the local environmental problems, and so on. In order to approach the environmental issues on distribution systems, for the first time managers need to understand the strategic framework for green management and then, to find the key success factors of leading companies in this field. Finally, future directions of strategic green management on distribution systems are discussed and shared.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.2
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• pp.1-6
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• 2000

X-ray lithography mask with SiC membrane and Ta absorber patterns has been fabricated using ECR plasma CVD, d.c. magnetron sputtering, and ECR plasma etching. The stress of stoichiometric SiC film was adjusted by rapid thermal annealing under $N_2$, ambient. Adjusting the working pressure during sputtering process resulted in a near-zero residual stress, reasonable density, and smooth surface morphology of Ta film. Cl-based plasma showed a good etching characteristics of Ta, and two-step etching process was implemented to suppress microloading effect fur sub-quarter $\mu\textrm{m}$ patterning.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.73-77
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• 2015

This paper presents integrated polymeric spectrometer module which offers compact size, easily-fabricated structure and low cost. The proposed spectrometer module includes the nano diffraction grating with non-uniform pitch and planar optical waveguide with concave mirror to be fabricated by UV imprint lithography. To increase the reflection efficiency, we designed the nano diffraction grating with triangular profiles. The polymeric planar spectrometer includes a spectral bandwidth of 700 nm, resolution of 10 nm and precision below 5 nm. This polymeric planar spectrometer is well-suited for sensor system.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.9-14
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• 2012

Robust power delivery and distribution are considered one of the major challenges in electronic devices today. As a technology develops (i.e. frequency and complexity, increase and size decreases), both power density and power supply noise increase, and voltage supply margin decreases. In addition, thermal problem is induced due to high power and poor power distribution. Until now most of studies to improve power delivery and distribution have been focused on device circuit or system architecture designs. Interconnect process technologies to resolve power delivery issues have not greatly been explored so far, but recently it becomes of great interest as power increases and voltage specification decreases in a smaller chip size.