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http://dx.doi.org/10.6117/kmeps.2012.19.1.081

Three-dimensional Machine Vision System based on moire Interferometry for the Ball Shape Inspection of Micro BGA Packages  

Kim, Min-Young (School of Electronics Engineering, IT College, Kyungpook National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.19, no.1, 2012 , pp. 81-87 More about this Journal
Abstract
This paper focuses on three-dimensional measurement system of micro balls on micro Ball-Grid-Array(BGA) packages in-line. Most of visual inspection system still suffers from sophisticate reflection characteristics of micro balls. For accurate shape measurement of them, a specially designed visual sensor system is proposed under the sensing principle of phase shifting moire interferometry. The system consists of a pattern projection system with four projection subsystems and an imaging system. In the projection system, four subsystems have spatially different projection directions to make target objects experience the pattern illuminations with different incident directions. For the phase shifting, each grating pattern of subsystem is regularly moved by PZT actuator. To remove specular noise and shadow area of BGA balls efficiently, a compact multiple-pattern projection and imaging system is implemented and tested. Especially, a sensor fusion algorithm to integrate four information sets, acquired from multiple projections, into one is proposed with the basis of Bayesian sensor fusion theory. To see how the proposed system works, a series of experiments is performed and the results are analyzed in detail.
Keywords
BGA ball inspection; Ball Grid Array; Semiconductor package inspection; Moire interferometry; Multiple projection;
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