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http://dx.doi.org/10.6117/kmeps.2012.19.3.009

Interconnect Process Technology for High Power Delivery and Distribution  

Oh, Keong-Hwan (서울과학기술대학교 글로벌융합산업공학과)
Ma, Jun-Sung (서울과학기술대학교 NID융합기술대학원)
Kim, Sungdong (서울과학기술대학교 기계시스템디자인공학과)
Kim, Sarah Eunkyung (서울과학기술대학교 NID융합기술대학원)
Publication Information
Journal of the Microelectronics and Packaging Society / v.19, no.3, 2012 , pp. 9-14 More about this Journal
Abstract
Robust power delivery and distribution are considered one of the major challenges in electronic devices today. As a technology develops (i.e. frequency and complexity, increase and size decreases), both power density and power supply noise increase, and voltage supply margin decreases. In addition, thermal problem is induced due to high power and poor power distribution. Until now most of studies to improve power delivery and distribution have been focused on device circuit or system architecture designs. Interconnect process technologies to resolve power delivery issues have not greatly been explored so far, but recently it becomes of great interest as power increases and voltage specification decreases in a smaller chip size.
Keywords
power delivery; power distribution; thermal management; interconnect;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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