• 전자통신동향분석
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• 제35권4호
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• pp.1-10
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• 2020

Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.

• 마이크로전자및패키징학회지
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• 제15권1호
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• pp.27-31
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• 2008

전자 부품의 소형화 요구에 따라서 기존 기판의 상부에 실장 되는 저항 소자를 감소하기 위한 방안으로 후막 저항 페이스트를 인쇄하여 저항체를 형성 한 후에 내장하는 수동소자 내장기술이 활발히 연구되고 있다. 본 연구에서는 카본 블랙과 에폭시 수지를 혼합하여 $0.35{\sim}4k{\Omega}/sq$으로 넓은 저항 범위를 가지는 저온 열경화형 후막 저항 페이스트를 제작하였으며, Ni-Cr alloy와 $SiO_2$ 분말을 첨가하여 온도에 따른 저항 변화인 TCR(Temperature Coefficient Resistivity) 값을 $100ppm/^{\circ}C$으로 개선하였다. 최종적으로 제작된 저항 페이스트를 이용하여 내장 저항 기판을 제작하였으며 온도에 변화에 따른 안정적인 저항 특성과 신뢰성을 확보 할 수 있었다.

• 한국포장학회지
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• 제5권2호
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• pp.42-58
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• 1999

Packaging materials and articles that are used in food contact applications can transfer constituents in the foodstuffs. This kind of risk of possible health hazards to consumers has been generally recognized for a long time with the consequence of establishing corresponding food regulations in most developed countries. However, the language of these laws, their interpretation, and their level of enforcement vary from country to country. Accordingly, the actual migrating levels from packaging materials can be varied depending on the migration testing methods as prescribed in the national legislation in each countries. Therefore, there are needs of elimination of non-tariff trade barriers raised by sanitary and phytosanitary or technical measures under the Final Act of the UR Agreement. In this connection, the EU and USA are currently in an ongoing process of legislation harmonization to overcome potential barriers to free trade. In general, regulations governing component transfer in the USA are more complicated and comprehensive than similar regulations in Europe. In future, standard migration testing procedures for microwave heat susceptor materials and for the use of fatty food simulant should be established and also harmonized among countries. The objective of this investigation is to compare the current regulations for migration testing for plastic containers and packaging materials in USA, EU and Korea or Japan. For those regulations, Korean standards are required to be kept up with the international standards. By doing this, the related Korean regulation could be amended along with the worldwide progress for harmonization.

• 마이크로전자및패키징학회지
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• 제14권2호
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• pp.41-47
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• 2007

현재 PCB기판내에 소재나 칩부품을 이용하여 커패시터나 저항을 구현하여 내장시키는 임베디드 패시브기술에 대한 연구가 많이 진행되어 지고 있다. 본 연구에서는 커패시터 용량이나 인덕터의 특성이 검증된 칩부품을 기판내 내장시켜 다이플렉서 기판을 제작하였다. $880\;MHz{\sim}960\;MHz(GSM)$영역과 $1.71\;GHz{\sim}1.88\;GHz(DCS)$영역을 나누는 회로를 구성하기 위해 1005크기의 6개 칩을 표면실장 공정과 함몰공정으로 형성시켜 Network Analyzer로 측정하여 비교하였다. chip표면실장으로 구현된 Diplexer는 GSM에서 최대 0.86 dB의 loss, DCS에서 최대 0.68 dB의 loss가 나타났다. 표면실장과 비교하였을 때 함몰공정의 Diplexer는 GSM 대역에서 약 5 dB의 추가 loss가 나타났으며 목표대역에서 0.6 GHz정도 내려갔다. 칩 전극과 기판의 도금 연결부위는 $260^{\circ}C$, 80분의 고온공정 및 $280^{\circ}C$, 10초의 솔더딥핑의 열충격 고온공정에서도 이상이 없었으며 특성의 변화도 거의 관찰되지 않았다.

• 한국포장학회지
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• 제6권1호
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• pp.37-40
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• 2000

This study was carried out to investigate dropping shock of household electric appliances during materials handling. Microwave oven($18{\ell}$), TV(16") and washing machine(6.2kg) were singled out as the study items. From the results of dropping test by KS A 1026(General Rules of Performance Testing for Packaged Freights), relative equations were gained as follow : y=0.0863x+10.032 for microwave oven, y=0.136x+7.85 for TV and y=0.214x+5.8 for washing machine (where y is G-factor and x is Dropping height). The maximum values of dropping shock during materials handling were measured to be $11{\sim}14G$ for microwave oven, $12{\sim}15G$ for TV and $10{\sim}12G$ for washing machine. The maximum shocks of microwave oven, TV and washing machine during materials handling were corresponding to dropping shocks of dropping height 45.98cm, 52.57cm and 28.97cm by KS A 1026.

• 한국포장학회지
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• 제8권1호
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• pp.32-42
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• 2002

This study were conducted to reveal the awareness and competitiveness of Korean packaging industry in information technology(IT) and e-commerce. For the survey, 114 sample companies were selected representing all packaging materials, equipment and systems, institutes, consulting and trading companies. The trained interviewers spoke to the respondents who were at the position of packaging research and development and were considered knowledgeable about the level of IT in the company. The collected data were analyze in three major categories: IT fundamentals, usages, and company policy. From the results, packaging suppliers were at the very low level of IT fundamentals and uses compared to those of packaging users. The gap between packaging suppliers and users that access the Internet was seriously wide, and this trend was generally due to different size of company. Packaging suppliers were still at the basic level of information-oriented working environment.

• 한국포장학회지
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• 제22권3호
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• pp.155-161
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• 2016

As one of traditional packaging materials, paper and paperboard are being more popular and beneficial thanks to their environmental sustainability and have been widely used in packaging applications, from light weight infusible tissue for tea/coffee bags to heavy duty boards for the distribution. Papermakers have to design the products having a desired customized function with their paper machine. Globally, the use of filler and pigment in papermaking is now a very common practice to meet the needs of customers. Many benefits can be achieved as a result of filler addition, which mainly includes cost and energy savings. The replacement of traditional mineral fillers and pigments with biodegradable and renewable carbohydrate polymers is a very interesting and promising research topic due to the concern of environmental impact. In this review paper, the use of traditional and novel carbohydrate fillers and pigments in cellulosic paper is highlighted. It is noteworthy that there are still some challenges and technical barriers associated with the use of these organic materials in point of structural stabilities and manufacturing costs, although most of them are available in market as the commercialized products. With the emerging nanotechnologies, it is believed that the use of carbohydrate-based filler and pigment for papermaking will increase and bring technical advantages to industry.

• 한국포장학회지
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• 제26권1호
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• pp.1-9
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• 2020

We evaluated the applicability of baking soda, charco'al, coffee, and green tea as a natural deodorant in Kimchi packaging. Moreover, to evaluate the potential usage of these deodorants in packaging materials and confirm their applicability in high-temperature melt-extrusion processing, the thermal stabilities of the deodorants were investigated, and heat-treated deodorants were evaluated in terms of the deodorizing function compared with non-treated deodorants. Aroma patterns were decreased after deodorizing treatment with all-natural deodorants. Dimethyl disulfide, methyl trisulfide, and diallyl disulfide, the most significant odorous Volatile organic compounds (VOCs) of Kimchi, decreased after treatment with the deodorants. In particular, baking soda and charcoal showed the highest efficiency in removing odorous compounds and VOCs from Kimchi, even after high-temperature processing. The acetic acid removal rates for both baking soda and charcoal were 99.9±0.0%. The heating process increases the deodorizing effects of baking soda. Sensory evaluation results showed that there is a significant increase (p < 0.05) in the overall preference for Kimchi samples packaged with charcoal and baking soda. This study provides useful information for the deodorization effects of natural deodorants for Kimchi smell and their applicability for packaging materials.

• 마이크로전자및패키징학회지
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• 제29권4호
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• pp.1-8
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• 2022

TSV 기술을 포함한 고밀도, 고집적 패키징 기술은 IoT, 6G/5G 통신, HPC (high-performance computing)등 여러 분야에서 중요한 기술로 여겨지고 있다. 2차원에서 고집적화를 달성하는 것은 물리적 한계에 도달하게 되었으며, 따라서 3D 패키징 기술을 위하여 다양한 연구들이 진행되고 있다. 본 고에서는 scallop의 형성 원인과 영향, 매끈한 측벽을 만들기 위한 scallop-free 에칭 기술, TSV 표면의 Cu bonding에 대해서 자세히 조사하였다. 이러한 기술들은 고품질 TSV 형성 및 3D 패키징 기술에 영향을 줄 것으로 예상한다.

• 한국포장학회지
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• 제30권1호
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• pp.43-51
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• 2024

The addition of oxygen scavengers to food products helps to reduce oxygen exposure, thereby mitigating deterioration, including changes in taste, odor, and color, as well as inhibiting microbial growth. Despite the advantages of the existing non-metallic oxygen removal materials in terms of safety for the human body and suitability for use in microwave ovens, their utilization has been limited due to their slow reaction initiation speed. Therefore, in the current study, sodium metabisulfite was impregnated into various porous media, including halloysite nanoclay, activated carbon, montmorillonite, and silica gel. The oxygen scavenger, produced by impregnating silica gel with sodium metabisulfite, demonstrated a 425% improvement in the initial oxygen removal rate compared to pure sodium metabisulfite. Additionally, sachets containing an oxygen-removing composition with an enhanced oxygen removal rate effectively decreased the oxygen concentration to less than 0.5% on the third day of storage in apple packaging, without elevating carbon dioxide levels. Moreover, it proved effective in preventing the browning of the apple surface. Therefore, the SM/SG oxygen-removal composition can be effectively applied to active food packaging by controlling the oxygen concentration within the packaging.