• Preventive Nutrition and Food Science
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• v.16 no.4
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• pp.364-369
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• 2011

Levels of carbon dioxide gas, a metabolite of microbial growth, have been reported to parallel the onset of microbial spoilage and may be used as a convenient index for a packaged food's shelf life. This study aimed to establish a kinetic model of $CO_2$ production from perishable food for the potential use for shelf life control in the food supply chain. Aerobic bacterial count and package $CO_2$ concentration were measured during the storage of seasoned pork meat at four temperatures (0, 5, 10 and $15^{\circ}C$), and their interrelationship was investigated to establish a mathematical model. The microbial growth at constant temperature was described by using model of Baranyi and Roberts. $CO_2$ production from the stored food could be explained by taking care of its yield and maintenance factors linked to the microbial growth. By establishing the temperature dependence of the microbial growth and $CO_2$ yield factor, $CO_2$ partial pressure or concentration in package headspace could be estimated to a limited extent, which is helpful for controlling the shelf life under constant and dynamic temperature conditions. Application and efficacy of the model needs to be improved with further refinement in the model.

• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.1049-1052
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• 1998

A new simplified circuit model for the switching noise analysis of the complicated multi-layer IC package is developed. The current flowing mechanism on the ground and power planes of the package is simplified by using the dependent current soures and partial plane circuit model. The methodology is very cost-efficient as well as accurate. It is demonstrated that the nosie based on the simplified circuit model has an excellent agreement with that of the complicated full circuit model. However, the simplified model takes only 5 minutes for the switching noise simulation, while the full circuit model takes more than 4 hours.

• Korean Management Science Review
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• v.25 no.1
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• pp.55-74
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• 2008

In recent warfare, the performance improvement of air weapon systems enables an aircraft to strike multiple targets on a single sortie. Further, aircrafts attacking targets may carry out an operation as a strike package that is composed of bombers, escort aircrafts, SEAD (Suppression of Enemy Air Defenses) aircrafts and etc. In this paper, we present an aircraft allocation model that allocates multiple targets to a single sortie in the form of a strike package. A mixed integer programming is developed and solved by using a commercially available software. The new model is better than existing ones because not only it allocates aircrafts to multiple targets but also it models the concept of the strike package. We perform a computational experiment to compare the result of the new model with that of existing ones, and perform sensitivity analysis by varying a couple of important parameters.

• Proceedings of the Korea Water Resources Association Conference
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• 2005.05b
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• pp.743-748
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• 2005

김남원 등(2004a, b)에 의해 개발된 SWAT-MODFLOW 모형은 SWAT 모형과 MODFLOW 모형의 Recharge Package와 River Package를 직렬로 연결한 모형이다. 그러나 MODFLOW 모형에는 지하수 흐름방정식의 해석에 관련된 Package를 제외하더라도 Well, Drain, Evapotranspiration 등의 Package가 더 있어 대수층으로부터의 우물의 함양과 배출, 배수관을 통한 지하수의 배출, 지하수의 증발산으로 인한 손실 등을 수행할 수 있다. MODFLOW 모형의 Well Package는 SWAT 모형에서 대수층의 물이동, Drain Package는 SWAT 모형의 토관배수, Evapotranspiration Package는 SWAT 모형의 얕은 대수층에서의 증발산과 밀접한 관계가 있다. 본 연구에서는 이들 세 개의 Package를 SWAT 모형과 완전 연동시킴으로써 사용자가 좀 더 다양한 조건에 대하여 SWAT-MODFLOW 결합모형을 적용할 수 있도록 기능을 향상시켰다.

• Journal of Sensor Science and Technology
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• v.22 no.1
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• pp.44-48
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• 2013

For a successful commercialization of microbolometer, it is required to develop a robust package including thermal stabilizing mechanism. In order to regulate the temperature within some operating range, thermoelectric cooler is generally used but it's not easy to model the whole package due to the coupled physics nature of thermoelectric cooler. In this paper, SPICE-compatible modeling methodology of a microbolometer package is presented, whose steady-state results matched well with FEM results at the maximum difference of 5.95%. Although the time constant difference was considerable as 15.7%, it can be offset by the quite short simulation time compared to FEM simulation. The developed model was also proven to be useful for designing the thermal stabilizer through parametric and transient analyses under the various working conditions.

• Journal of Applied Reliability
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• v.3 no.2
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• pp.103-116
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• 2003

We carry out reliability tests and investigate the failure mechanisms. of the wafer level vacuum packaged MEMS gyroscope sensor using an accelerated degradation test. The accelerated degradation test (ADT) is used to evaluate reliability (and/or life) of the MEMS vacuum package and to select the accelerated test conditions, which reduce the reliability testing time. Using the failure distribution model and stress-life model, we are able to estimate the average life time of the vacuum package, which is well agreed with the measured data. After improving several package reliability issues such as prevention of gas diffusion through package, we carry out another set of accelerated tests at the chosen acceleration level. The results show that reliability of the vacuum packaged gyroscope has been greatly improved and can survive without degradation of performance, which is the Q-factor in gyroscope sensor, during environmental stress reliability tests.

• Animal Systematics, Evolution and Diversity
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• v.30 no.1
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• pp.39-43
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• 2014

In this brief report, alternative time-varying diversification rate models were fitted onto the phylogeny of global amphibians by considering one-constant-rate (OCR), one-continuous-shift (OCS) and multiple-discrete- shifts (MDS) situations. The OCS diversification model was rejected by ${\gamma}$ statistic (${\gamma}=-5.556$, p<0.001), implying the existence of shifting diversification rates for global amphibian phylogeny. Through model selection, MDS diversification model outperformed OCS and OCR models using "laser" package under R environment. Moreover, MDS models, implemented using another R package "MEDUSA", indicated that there were sixteen shifts over the internal nodes for amphibian phylogeny. Conclusively, both OCS and MDS models are recommended to compare so as to better quantify rate-shifting trends of species diversification. MDS diversification models should be preferential for large phylogenies using "MEDUSA" package in which any arbitrary numbers of shifts are allowed to model.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.4 no.1
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• pp.23-32
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• 1997

The change in moisture content of moisture sensitive products in moisture-semipermeable packages was investigated for the purpose of predicting the shelf life of a product-package combination. A mathematical model, and a computer program based on the physiochemical properties of the product and the moisture permeability of the package was developed. The moisture content for products in moisture-semipermeable packages was determined under various environmental conditions and the results were compared with the predicted values by means of the simulation model. These experimental studies demonstrated that the prediction of the change in moisture content of packaged products over time by the simulation model is accurate, within a practical range of temperature and relative humidity values. The developed semi-empirical model is considered to have applications in industry, since it provides product shelf life information for a range of temperature and relative humidity conditions, with a limited number of experimentally obtained data points.

• Journal of the Korea Society of Computer and Information
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• v.13 no.7
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• pp.199-205
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• 2008

The centralized conference model has advantage of conference management and control. however it's scalability has been limited as performance degrades largely with increasing number of conference users. So new distributed conference models which improve scalability of centralized conference model have been suggested recently. In the distributed conference model. as conference users exceed a predefined maximum number, a new conference server is added to the conference dynamically. In this paper, We have proposed a new method which increases efficiency of conference event package processing that primary conference server should charge in the distributed conference environment. The primary conference server exchanges informations with each secondary conference servers and conference users by using conference event package. And from the conference information database it selects SIP(Session Initiation Protocol) UA(User Agent) which will share notification to the conference users, and transfers lists to each conference servers. The conference servers make the selected UAs share processing of conference event package, so loads of SIP signal processing decrease, and improve scalability of distributed conference model. The performance of our proposed model is evaluated by experiments.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.10
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• pp.183-190
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• 2003

Major device failures such as die cracking, interfacial delamination and warpage in flip chip packages are due to excessive heat and thermal gradients- There have been significant researches toward understanding the thermal performance of electronic packages, but the majority of these studies do not take into account the combined effects of thermo-mechanical interactions of the different package constituents. This paper investigates the thermo-mechanical performance of flip chip package constituents based on the finite element method with thermo-mechanically coupled elements. Delaminations with different lengths between the silicon die and underfill resin interfaces were introduced to simulate the defects induced during the assembly processes. The temperature gradient fields and the corresponding stress distributions were analyzed and the results were compared with isothermal case. Parametric studies have been conducted with varying thermal conductivities of the package components, substrate board configurations. Compared with the uniform temperature distribution model, the model considering the temperature gradients provided more accurate stress profiles in the solder interconnections and underfill fillet. The packages with prescribed delaminations resulted in significant changes in stress in the solder. From the parametric study, the coefficients of thermal expansion and the package configurations played significant roles in determining the stress level over the entire package, although they showed little influence on stresses profile within the individual components. These observations have been implemented to the multi-board layer chip scale packages (CSP), and its results are discussed.