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http://dx.doi.org/10.5369/JSST.2013.22.1.44

SPICE-Compatible Modeling of a Microbolometer Package Including Thermoelectric Cooler  

Han, Chang Suk (Department of Defense Science Technology, Hoseo Unversity)
Park, Seung Man (Department of Defense Science Technology, Hoseo Unversity)
Kim, Nam-Hwan (Agency for Defense Development)
Han, Seungoh (Department of Robotics Engineering, Hoseo Unversity)
Publication Information
Journal of Sensor Science and Technology / v.22, no.1, 2013 , pp. 44-48 More about this Journal
Abstract
For a successful commercialization of microbolometer, it is required to develop a robust package including thermal stabilizing mechanism. In order to regulate the temperature within some operating range, thermoelectric cooler is generally used but it's not easy to model the whole package due to the coupled physics nature of thermoelectric cooler. In this paper, SPICE-compatible modeling methodology of a microbolometer package is presented, whose steady-state results matched well with FEM results at the maximum difference of 5.95%. Although the time constant difference was considerable as 15.7%, it can be offset by the quite short simulation time compared to FEM simulation. The developed model was also proven to be useful for designing the thermal stabilizer through parametric and transient analyses under the various working conditions.
Keywords
Microbolometer; Thermoelectric cooler; MEMS; package; SPICE;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
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