센서학회지 (Journal of Sensor Science and Technology)

  • 제22권1호
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  • Pages.44-48
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  • 2013
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  • 1225-5475(pISSN)
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  • 2093-7563(eISSN)
한국센서학회 (The Korean Sensors Society)
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열전 냉각기를 포함하는 볼로미터 패키지의 SPICE 등가 모델링

SPICE-Compatible Modeling of a Microbolometer Package Including Thermoelectric Cooler

  • 한창석 (호서대학교 국방과학기술학과) ;
  • 박승만 (호서대학교 국방과학기술학과) ;
  • 김남환 (국방과학연구소) ;
  • 한승오 (호서대학교 로봇자동화공학)
  • 투고 : 2012.10.02
  • 심사 : 2012.12.09
  • 발행 : 2013.01.31
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초록

For a successful commercialization of microbolometer, it is required to develop a robust package including thermal stabilizing mechanism. In order to regulate the temperature within some operating range, thermoelectric cooler is generally used but it's not easy to model the whole package due to the coupled physics nature of thermoelectric cooler. In this paper, SPICE-compatible modeling methodology of a microbolometer package is presented, whose steady-state results matched well with FEM results at the maximum difference of 5.95%. Although the time constant difference was considerable as 15.7%, it can be offset by the quite short simulation time compared to FEM simulation. The developed model was also proven to be useful for designing the thermal stabilizer through parametric and transient analyses under the various working conditions.

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참고문헌

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피인용 문헌

  1. Circuit Modeling and Simulation for Thermoelectric Cooling System using Condensed Water vol.25, pp.2, 2015, https://doi.org/10.5391/JKIIS.2015.25.2.161