• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.4
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• pp.330-334
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• 2013

We developed a package of remote phosphor structure having blue LED chips and phosphors physically separated, and the characteristics were evaluated according to different classifications of phosphor coatings. Remote phosphor was produced by screen printing coating on glass substrate with phosphor content rated paste and heat treatment. After mounting Remote phosphor, which has been classified according to number of coatings, on top of blue LED chips, luminous flux, luminous efficacy, CCT and CRI were measured. The measurement results showed the most suitable characteristics of white LED package as a general light source when the content rate of phosphor in Remote phosphor was 80 wt.% with 3 layers of coatings and thickness over $12{\mu}m$.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.10 no.1
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• pp.37-43
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• 2012

Radioactive waste transport package was developed to transport eight drums of low and intermediate level waste(LILW) in accordance with the IAEA and domestic related regulations. The package is classified with industrial package IP-2. IP-2 package is required to undergo a free drop test and a stacking test. After free drop and stacking tests, it should prevent the loss or dispersal of radioactive contents, and loss of shielding integrity which would result in more than 20 % increase in the radiation level at any external surface of the package. The objective of this study is to establish the safety test method and procedure for stacking test and to prove the structural integrities of the IP-2 package. Stacking test and analysis were performed with a compressive load equal to five times the weight of the package for a period of 24 hours using a full scale model. Strains and displacements were measured at the corner fitting of the package during the stacking test. The measured strains and displacements were compared with the analysis results, and there were good agreements. It is very difficult to measure the deflection at the container base, so the maximum deflection of the container base was calculated by the analysis method. The maximum displacement at the corner fitting and deflection at the container base were less than their allowable values. Dimensions of the test model, thickness of shielding material and bolt torque were measured before and after the stacking test. Throughout the stacking test, it was found that there were no loss or dispersal of radioactive contents and no loss of shielding integrity. Thus, the package was shown to comply with the requirements to maintain structural integrity under the stacking condition.

• Design Convergence Study
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• v.16 no.4
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• pp.81-98
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• 2017

This study starts from the judgment that the evaluation about preserved flower package design has to be performed based on the product attribute. The principles and components of package design are reestablished from preceding researches, the product type model is suggested based on the product attribute. The 6 principles of package design are usability, esthetic element, attracting attention, creativity, identity and implication, and the 5 components of package design are form, material, color, graphics and branding factors. The product types are classified into 4 areas following the 2 axises. The 1 axis means the degree of perception risk on acquiring information and the other means the approaching type to expected effects about products. The characteristics of package design components are analyzed from the cases belonged at each area on the product type model. Based on the this model, the strategy of preserved flower package design is drawn. At last the package of 'Preserville' is analyzed, we find out the critical points and suggest the intention point in planning the preserved flower package.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.4
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• pp.111-116
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• 2018

This research examines the drop impact of an external cooling unit package of an air conditioner system. The packaging is composed of a shock-absorbing material, which protects the package contents by absorbing the impact energy and other parts for fixture. Accurate quantification of the impact acceleration experienced by the package contents is necessary to design an effective packaging with minimal volume and sufficient shock absorbing capacity. Explicit time integration was used for the drop impact analyses. A finite element model of the package was constructed, material testing and material model selection were carried out, and sensors for data acquisition were modeled to obtain accurate simulation results. The results were compared with real physical test data. Due to imprecise modeling of the damping, the acceleration and strain values predicted by the simulation were larger than those from physical test. However, the trend of the history data and the peak deceleration value in the direction of impact showed good agreements. Thus, the analysis model and scheme are suitable for the design of an air conditioner cooling unit package.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.31-39
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• 2014

For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization, lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement. The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLP technology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditional IC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yield of the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigated the characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finite element numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy mold compounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpage after EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate that the most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg (glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore, considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.29 no.1A
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• pp.107-112
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• 2004

We propose the optimum TO-can package design in SFF/SFP optical transceiver modules to improve 3dB-bandwidth. The frequency response of TO-38 package is measured and compared to simulation where the 3dB-bandwidth was 3.5GHz. For a higher operating bandwidth (>15GHz), the new optimized physical geometries of TO-can package such as bonding-wire, lead and material was suggested. The optimal result of simulation shows that TO-can package can be used at a higher bit rate optical module of 10Gbps.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.6
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• pp.951-960
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• 1997

Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the maximum energy release rate criterion. It could be shown that the crack propagation from the lower edge of the ie pad is easily occurred at the maximum temperature during the soldering process, where the pressure acting on the crack surface is assumed by the saturated vapor pressure at maximum temperature. The package crack formation depends on various parameters such as chip size, relative thickness, material properties, the moisture content and soldering temperature etc. The quantitative measure of the effects of the parameters could be easily obtained by using the taguchi's method which requires only a few kinds of combinations with such parameters. From the results, it could be obtained that the more significant parameters to effect the package reliability are the orders of Young's modulus, die pad size, down set, chip thickness and maximum soldering temperature.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.6
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• pp.709-716
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• 2004

In order to prevent the interface delamination of an plastic IC package in the infrared (IR) soldering process, we tried to reduce stress by parameterization, sensitivity analysis and unconstraint optimization. The design variables of dimensions and material properties are determined among all the possible variables from the parametric study. Their optimized values are determined by applying the unconstraint optimization to the parameterized IC package. The maximum von-Mises stress value decreases greatly by optimum design.

• Journal of Korea Multimedia Society
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• v.6 no.4
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• pp.668-675
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• 2003

Now a days many industries and bigger organisation (Indian Railways, Bharat Heavy Electricals Ltd.) are facing difficulties in implementing the new technology because of non-availability of fully trained staff. Also for the employed technical and other staff lot of resistance management has to face to get them trained for adoption of new technology. There are also very less organisations who can design effective training programmes and at the same time develop course material specially multimedia packages and computer base training (CBT) which can satisfy the need of different target groups of industries. Indian Railways was also facing similar situation while implementing the Air Brake System technology In Indian Railways. TTTI Bhopal took that challenge and designed, developed and trained Indian Railways trainer for implementation of the package on different target group. The present paper offers a case study on the same.

• Transactions on Electrical and Electronic Materials
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• v.5 no.4
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• pp.138-142
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• 2004

This paper presents the improved bum-in method for the reliability of SRAM in Multi Chip Package (MCP). Semiconductor reliability is commonly improved through the bum-in process. Reliability problem is more significant in MCP that includes over two chips in a package, because the failure of one chip (SRAM) has a large influence on the yield and quality of the other chips - Flash Memory, DRAM, etc. Therefore, the quality of SRAM must be guaranteed. To improve the quality of SRAM, we applied the improved wafer level bum-in process using multi cells selection method in addition to the previously used methods. That method is effective in detecting special failure. Finally, with the composition of some kind of methods, we could achieve the high quality of SRAM in Multi Chip Package.