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http://dx.doi.org/10.3795/KSME-A.2004.28.6.709

Application of Stress Optimization for Preventing the Delamination of the Plastic IC Package in Reflow Soldering Process  

Kim, Geun-Woo (연세대학교 기계공학부)
Lee, Kang-Yong (연세대학교 기계공학부)
Kim, Ok-Whan (천안공업대학 플랜트설계)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.28, no.6, 2004 , pp. 709-716 More about this Journal
Abstract
In order to prevent the interface delamination of an plastic IC package in the infrared (IR) soldering process, we tried to reduce stress by parameterization, sensitivity analysis and unconstraint optimization. The design variables of dimensions and material properties are determined among all the possible variables from the parametric study. Their optimized values are determined by applying the unconstraint optimization to the parameterized IC package. The maximum von-Mises stress value decreases greatly by optimum design.
Keywords
Plastic IC Package; Thermal Loading; DOE; Unconstraint Optimization;
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