• Journal of the Korean Society of Food Culture
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• v.25 no.2
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• pp.198-206
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• 2010

In recent years consumers have become used to products geared toward a more convenient lifestyle, thus, the demand for salted-cabbage, for use in preparing Kimchi is increasing. This study aims to investigate purchasing factors, the satisfaction and demands of salted-cabbage, and to ascertain a marketing strategy for expanding the use of salted cabbage in food-service departments of schools. Self-administered questionnaires were collected from 131 buying agents who manage food materials for schools, and statistical data analysis was completed using the SPSS V.14.0 program. 46.9% of the participating respondents were from elementary schools, 27.7% from middle schools, and 25.4% were from high schools.. Most of the subjects (67.9%) recognized the salted cabbage retailed for foodservice, but 62.3% of these had not purchased them, due to both their lack of trust in the sanitation and raw material handling of the food product, and the high price. Respondents considered different factors when deciding whether or not to purchase: the origin (local or imported) of the cabbage, hygiene, and taste, as well as characteristics such as the cabbage weight, package weight, and package materials. The score of post-behavior intentions as well as overall satisfaction was rather high. Also, they perceived the need of strategic promotion for enlarging the market portion of salted-cabbage. These results will done the guidelines for diversifying the salted-cabbage market and for creating an added value of agricultural products in rural areas.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.15 no.2
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• pp.49-54
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• 2009

The effects of filling temperatures of broth and degassing method on the residual oxygen content and gas composition in the pouch and physical strength of packaging material for Samgyetang depending on the contamination of broth on the sealing layer and sterilization process were investigated. The residual oxygen content in the broth and the oxygen proportion in the headspace of package were decreased with the increase of broth temperature at filling into the pouch from 50 to 100. When the products were packaged as air-contained (Air), manually squeezed the upper side of package out to minimize the headspace (Degas) and flushed with nitrogen gas ($N_2$-Flushing) while maintaining the broth temperatures of Samgyetang at 50 or 85. The residual oxygen content and oxygen proportion were increased in the order of $N_2$-Flushing

• Journal of Fashion Business
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• v.11 no.4
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• pp.42-51
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• 2007

The purpose of this study is to develop clothing design for mild dementia patients who display positive action in clothing for the improvement of the quality of life of the dementia patients following the symptoms of patients in accordance with the clinical classification to provide the functional assistance for ordinary living as well as emotional stability and aesthetic functions for the dementia elderly. The method of research is performed for theories through the advanced research and documentary data, and interpreted in functional and aesthetic level on the basis of the result of advance survey related to the characteristics of the mild dementia patients and clothing conduct of elderly with light dementia to select the material, color, decoration and functional design with four pairs for women and two pairs for men. Designs for the total of six have been actually produced by making the map, including the material swatch, color and others. The questionnaire as the measuring tool is used and the assessment category is made for the adaptability of design on each category. On the six clothes that are produced for the mild dementia patients, the statistics package SPSS Ver 12.0 is used for the data analysis on questions 8-10 for the frequency analysis. In overall, the leisure clothing for mild dementia patients developed from this research are generally satisfied, and overall type, material, color, detail and arrangement are generally evaluated highly, and have the assessment of normal or better in the color size and type.

• Korean Journal of Construction Engineering and Management
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• v.3 no.4 s.12
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• pp.114-122
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• 2002

Earned Value Management System(EVMS) is a management technique that is emerging as a valuable tool in the management of all projects, including and in particular construction projects. It is based on C/SCSC that has been released by the U.S. Department of Defense (DOD) in 1967. In a project that employs the earned value management concept, the project's measurable performance plans will be formed with the creation of CAPs. The formation of CAPs is a planning step necessary to form an earned value baseline. In this paper, a method is proposed to form CAPs using Material Requirement Planning(MRP) that is also known as a useful planning tool in the manufacturing industry. An application to a real project has been carried through workpackaging model.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.7 no.1
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• pp.9-16
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• 2009

Transport package for radioactive material should be structurally safe under puncture drop condition and its safety should be verified by test and numerical analysis. Most finite element analyses for puncture drop have been performed without modeling the impact limiter since failure is occurred in the materials of the impact limiter. This paper presents a new modeling methodology, where an element is eroded in case that the material's failure criteria are reached at the element's integration point, to investigate the effect of the impact limiter in the puncture process. The effectiveness of the proposed scheme is shown through the puncture drop analysis of hotcell transport cask, which is under design in KAERI. The results show that about 80 percent of the total impact energy is absorbed due to the deformation of impact limiter. Using the present method the puncture drop can be analyzed more accurately, but it would give conservative results compared to the actual test condition.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.10
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• pp.22-28
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• 1998

Signal transmission and crosstalk of coupled bondwires buried in plastic packages are analyzed using the Method of Moments and the Fourier Transform algorithm. It is also shown that the quasi-static crosstalk model of SPICE is inappropriate for designing the high-speed plastic packages. Plastic packaging material, increasing the self and mutual capacitances, is found to be helpful for the signal transmission integrity due to the dielectric compensation effect. However, it is also observed that the plastic material increases the crosstalk due to the radiation-enhanced mutual coupling effect. By investigating the geometrical and material dependence of the pulse transmission and crosstalk, it is found that the radiation-enhanced coupling effect is significant for most of typical bondwire geometries and plastic package materials. These calculation results can be effectively used for designing plastic packages of high-speed digital IC's and monolithic RFIC's.

• Proceedings of the Korean Institute Of Construction Engineering and Management
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• autumn
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• pp.410-415
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• 2001

Earned Value Management System(EVMS) has been considered as a useful tool of managing construction projects lately and its instruction into a private industry is now under consideration by the Korean government. It is on the basis of C/SCSC that had been released by the U.S. Department of Defense(DOD) since 1967. Its research has been in the active progress in order to utilize the earned value concept as a project management tool for construction project ordered by both government and private sector. Material Requirement Planning(MRP) is also known as a tool of planning and scheduling resources for assembly product as a part of inventory control models in the manufacturing industry. The purpose of this study is the effective employment of Earned Value Management to manage the construction projects by utilizing Material Requirement Planning(MRP), based on project management software and Workpackaging model.

• Korean Journal of Materials Research
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• v.9 no.11
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• pp.1095-1101
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• 1999

Electroless Ni plating is applied to form bumps and UBM layer for flip chip interconnection. Characteristics of electroless Ni are also investigated. Zincate pretreatment is analyzed and plated layer characteristics are investigated according to variables like temperature, pH and heat treatment. Based on these observations, characteristics dependence to each variables and optimum electroless Ni plating conditions for flip-chip interconnection are suggested. Electroless Ni has 10wt% P, $60\mu\Omega$-cm resistivity, 500HV hardness and amorphous structure. It changes crystallized structure and hardness increases after heat treatment After interconnection of electroless Ni bumps by ACF flip chip method, we show their advantages and possibility in microelectronic package applications.

• Korean Journal of Metals and Materials
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• v.50 no.10
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• pp.775-783
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• 2012

The effect of thermal annealing on the in-situ growth characteristics of intermetallics (IMCs) and the mechanical strength of Cu pillar/Sn-3.5Ag microbumps are systematically investigated. The $Cu_6Sn_5$ phase formed at the Cu/solder interface right after bonding and grew with increased annealing time, while the $Cu_3Sn$ phase formed at the $Cu/Cu_6Sn_5$ interface and grew with increased annealing time. IMC growth followed a linear relationship with the square root of the annealing time due to a diffusion-controlled mechanism. The shear strength measured by the die shear test monotonically increased with annealing time. It then changed the slope with further annealing, which correlated with the change in fracture modes from ductile to brittle at a critical transition time. This is ascribed not only to the increasing thickness of brittle IMCs but also to the decreasing thickness of the solder, as there exists a critical annealing time for a fracture mode transition in our thin solder-capped Cu pillar microbump structures.

• Korean Journal of Metals and Materials
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• v.47 no.1
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• pp.26-31
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• 2009

The effects of $Ar/O_2$ ion-beam pre-treatment conditions on the interfacial adhesion energy of sputterdeposited Cu thin film to FR-4 substrate were systematically investigated in order to understand the interfacial bonding mechanism for practical application to advanced chip-in-substrate package systems. Measured peel strength increases from $45.8{\pm}5.7g/mm$ to $61.3{\pm}2.4g/mm$ by $Ar/O_2$ ion-beam pre-treatment with anode voltage of 64 V. Interfacial bonding mechanism between sputter-deposited Cu film and FR-4 substrate seems to be dominated by chemical bonding effect rather than mechanical interlocking effect. It is found that chemical bonding intensity between carbon and oxygen at FR-4 surface increases due to $Ar/O_2$ ion-beam pretreatment, which seems to be related to the strong adhesion energy between sputter-deposited Cu film and FR-4 substrate.