• Culinary science and hospitality research
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• v.9 no.3
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• pp.182-196
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• 2003

This study is about color-image of chilled noodle packages. The improvement of living standard has lead the development of food industry, which has changed consumer's way of thinking toward food products and made clear the preference for food which was obscure before. In the past, the the right of choice for the products were not given to consumers in the market. But today, the market initiatives have been transferred to consumers. They are allowed to purchase their favorite products as the markets provide them with diversified products. Consequently, the importance of package design has increased. Color-image of chilled noodle packages stimulates consumers to purchase the products by offering necessary information which is very important as it is supposed to provide consumers with a good impression about the products.

• Proceedings of the IEEK Conference
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• 2002.06b
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• pp.73-76
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• 2002

In this paper we present an integrated Hail sensor It for fan motors, fabricated in industrial bipolar process. As a discrete Hall sensor and signal processing circuitry In the fan motor system were Integrated into single chip a temperature dependence of Hall sensitivity and Hall offset voltage can be compensated and cancelled by on-chip circuitry. We Propose a novel temperature compensation of Hall sensitivity with negative temperature coefficient (TC) using the differential amplifier gain with Positive TC. After a package of the chip was sealed using a plastic Package 20 Pins, the thermal and magnetic characteristics were investigated. The obtained experimental results are in agreement with analytical predictions and have more excellent performance than\ulcorner conventional the fan motor system using discrete Hall sensor.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.4
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• pp.1-14
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• 1995

A new stochastic Petri nets model, called Stochastic Petri Nets Reward Model(SPNRM) is used for modeling and evaluating the performance of telecommunication protocols. We have developed a SPNRM of the TDX-10 Internal protocol, which has a packet data exchange facility between DCEs, Especially a timer and retransmission handling model is presented for error control of the data transmission phase. The stochastic Petri nets package(SPNP), a software package for SPNRM used in this paper, has been used to generate numerical results by analytical-numerical method rather than simulation. From the steady state solution of the net, it is possible to calculate automatically the performance measure of the protocol medeled with both end-to-end and link-by-link method, which are the mean response times and the throughputs.

• Journal of Korean Institute of Industrial Engineers
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• v.3 no.1
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• pp.55-59
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• 1977

This paper develops a portfolio management game applicable to Korean Stock Market with an emphasis on teaching and training aid. It allows each participant to start out with a certain amount of money and pick his favorable stocks from a list of stocks chosen by instructor. Each participant must make a transaction at each time period and he gets a readout that states his individual performance, i.e., stock lists, cash on hand, net worth, transactions he has made and rank in accordance with his net worth. This game package consists of 10 subprograms and 7 files written with Fortran language for use on the Nova 840 computer and is divided into 3 main categories according to their functions, i.e., book-keeping function, data processing function and information searching function. This package may be used for training portfolio decison makings in the stock market and for comparing various investment methods through hypothetical investments.

• Proceedings of the KSME Conference
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• 2000.04a
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• pp.873-878
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• 2000

Semiconductor packaging technology is changed rapidly according to the trends of the micro miniaturization of multimedia and information equipment. For I/O limitation and fine pitch limitation, DIP and SOP/QFP are replaced by BGA/CSP. This is one of the surface mount technology(SMT). Solder ball is bumped n the die pad and connected onto mounting board. In ball bump formation, vacuum suction type ball alignment process is widely used, However this type has some problems such as ionization, static electricity and difficulty of fifo(first-input first-out) of solder balls. Seesaw type is reducing these problems and has a structural simplicity and economic efficiency. Ball cartridge velocity and ball aligned plate angle are Important variables to improve the ball alignment Process. In this paper, seesaw-type CSP solder ball loader is developed and the optimal velocity and plate angle are proposed.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.11
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• pp.161-167
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• 2001

In this study, the control of mounting system for MLGA package was developed using machine vision for the control of rotation position compensation and mounting position of X-Y table. Two types of materials, polymer and alumina, were used for the dielectric insulator of the MLGA. The illumination system and the algorithm of position compensation which is suitable for these materials was developed. We found that the mounting accuracy enough to the degree of${\pm}10{\mu}m$ when MLGA was mounted on the PCB.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.595-596
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• 2006

A novel Si via structure is suggested and fabricated for 3D MEMS package using the doped silicon as an interconnection material. Oxide isolations which define Si via are formed simultaneously when fabricating the MEMS structure by using DRIE and oxidation. Silicon Direct Bonding Multi-stacking process is used for stacked package, which consists of a substrate, MEMS structure layer and a cover layer. The bonded wafers are thinned by lapping and polishing. A via with the size of $20{\mu}m$ is fabricated and the electrical and mechanical characteristics of via are under testing.

• Korean Journal of Computational Design and Engineering
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• v.19 no.4
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• pp.402-409
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• 2014

Presented in this paper is a scheduling method for semiconductor backend process considering the backward pegging. It is known that the pegging for frontend is a process of labeling WIP lots for target order which is specified by due date, quantity, and product specifications including customer information. As a result, it gives the release plan to meet the out target considering current WIP. However, the semiconductor backend process includes the multichip package and test operation for the product bin portion. Therefore, backward pegging method for frontend can't give the release plan for backend process in semiconductor. In this paper, we suggest backward pegging method considering the characteristics of multichip package and test operation in backend process. And we describe the backward pegging problem using the examples.

• Journal of Information Technology Services
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• v.9 no.2
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• pp.107-127
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• 2010

Typical misconceptions on Enterprise Resource Planning (ERP) among practitioners and researchers are reviewed. Companies can make, buy, or rent ERP solutions, but typically, ERP is conceived as ready-made, off the shelf application software package. The benefits of ERP adoption are frequently generalized without proper clarification of the requisite conditions. The specific outcomes of ERP adoption are not adequately differentiated from those of general computerization. To avoid the side-effects caused by those misconceptions, we 1) clarify the concept of ERP and the methods of sourcing it, 2) specify the requisite conditions for the benefits from packaged ERP solutions, and 3) explain the generic characteristics of ERP, direct effects and resultant possible outcomes of the adoption of ERP.

• Journal of the Korean Society for Precision Engineering
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• v.9 no.4
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• pp.13-21
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• 1992

Standards concerning the determination of positioning accuracy and repeatability of numerically controlled(NC) machine tools have been published relentlessly over the last 20 years. Since the publication in 1988 of the International Standard 230-2 there has been a pronounced move, both at national and international standards level, to embrace further test procedures for a complete machine tool performance assessment. For example, measurements of angular (pitch, roll, and yaw) and straightness errors along linear axes are now commonplace and complement the existing positioning accuracy and repeatablity tests. More recently the subject of circularity evalutaion has also gained considerable interest. Here dynamic tests, using a kinematic ballbar or circular masterpiece, give an instant overview of the contouring ability of the machine in two axes at specific feedrates. This information is extremely important in optimising machining accuracy. This paper describes moves to complete the machine calibration package in national and international standardis- ation for the assessment of machine tool performance.