Korean Journal of Computational Design and Engineering (한국CDE학회논문집)

Society for Computational Design and Engineering (한국CDE학회)
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Semiconductor Backend Scheduling Using the Backward Pegging

Backward Pegging을 이용한 반도체 후공정 스케줄링

  • Received : 2014.05.13
  • Accepted : 2014.08.12
  • Published : 2014.12.01
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Abstract

Presented in this paper is a scheduling method for semiconductor backend process considering the backward pegging. It is known that the pegging for frontend is a process of labeling WIP lots for target order which is specified by due date, quantity, and product specifications including customer information. As a result, it gives the release plan to meet the out target considering current WIP. However, the semiconductor backend process includes the multichip package and test operation for the product bin portion. Therefore, backward pegging method for frontend can't give the release plan for backend process in semiconductor. In this paper, we suggest backward pegging method considering the characteristics of multichip package and test operation in backend process. And we describe the backward pegging problem using the examples.

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References

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