• Journal of the Korea Society of Computer and Information
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• v.22 no.2
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• pp.111-117
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• 2017

This study analyzes the relative importance of the introducing factors for the critical success factors in the implementation stage of the lifecycle of ERP system using Delphi technique and Analytic Hierarchy Process(AHP). In the 1st layer of the hierarchy, technical factor is evaluated as the most important factor among organizational, technical, and supplier factors. In the 2nd layer, choosing a proper ERP package is evaluated as the most important factor within 15 factors followed by process-oriented approach, technical suitability, minimized customization, integration and association of system with trading parter, association with legacy systems, and support and involvement of top management. As a result of this analysis enterprise should choose an ERP package that is suitable to its business environment, and make the best use of(take full advantage of) best practice that ERP package provides to optimize the existing business procedure or process(to approach the existing business procedure or process). This study also shows the range of customization of the features provided by the ERP package should be minimized.

• Journal of the Korea Society of Computer and Information
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• v.21 no.12
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• pp.165-171
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• 2016

This study analyzes the relative importance of the introducing factors for the critical success factors in the implementation stage of the lifecycle of ERP system using Delphi technique and Analytic Hierarchy Process(AHP). In the 1st layer of the hierarchy, technical factor is evaluated as the most important factor among organizational, technical, and supplier factors. In the 2nd layer, choosing a proper ERP package is evaluated as the most important factor within 15 factors followed by process-oriented approach, technical suitability, minimized customization, integration and association of system with trading parter, association with legacy systems, and support and involvement of top management. As a result of this analysis enterprise should choose an ERP package that is suitable to its business environment, and make the best use of(take full advantage of) best practice that ERP package provides to optimize the existing business procedure or process(to approach the existing business procedure or process). This study also shows the range of customization of the features provided by the ERP package should be minimized.

• Journal of the Korean Society of Food Culture
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• v.21 no.4
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• pp.414-419
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• 2006

The purpose of this study was to measure the factor influencing tourist preferences for leaf mustard iimchi. Among 250 questionnaires, 230 questionnaires were utilized for the analysis. Frequencies, conjoint model, max. utility model, BTL model, Logit model, K-means cluster analysis, and one-way ANOVA analysis were used for this study. The findings from this study were as follows. First, the Pearson's R and Kendall's tau statistics showed that the model fitted the data well. Second, it was found that total respondents and three clusters regarded taste and price as the very important factor. Third, it was found that the first cluster most preferred product with light red color, plain package, and mild taste sold at a cheap price in factory. The second cluster most preferred product with light red color, plain package, and moderately pungent taste sold at a expensive price in factory. The third cluster most preferred product with dark red color, shaped package, and highly pungent taste sold at a cheap price in factory. Fourth, it was found that the first cluster most preferred simulation product with light red color, shaped package, and mild taste sold at a cheap price in factory. The second cluster most preferred simulation product with light red color, shaped package, and moderately pungent taste sold at a cheap price in factory. The third clutter most preferred simulation product with dark red color, shaped package, and highly pungent taste sold at a cheap price in factory.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.1
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• pp.1-6
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• 2022

The mobile device industry demands much higher levels of integration and lower costs coupled with a growing awareness of the complete system's configuration. A subsystem module package is similar to a board-level circuit that integrates a system function in a package beyond a System-in-Package (SiP) design. It is an advanced IC packaging solution to enhance the PDN and achieve a smaller form factor. Unlike a system-level design with a decoupling capacitor, a subsystem module package system needs to redefine the role of the capacitor and its configuration for PDN performance. Specifically, the design of package's form factor should include careful consideration of optimal PDN performance and the number of components, which need to define the decoupling capacitor's value and the placement strategy for a low impedance profile with associated cost benefits. This paper will focus on both the static case that addresses the voltage (IR) drop and AC analysis in the frequency domain with three specific topics. First, it will highlight the role of simulation in the subsystem module design for the PDN. Second, it will compare the performance of double-sided component placement (DSCP) motherboards with the subsystem module package and then prove the advantage of the subsystem module package. Finally, it will introduce three-terminal decoupling capacitor (decap) configurations of capacitor size, count and value for the subsystem module package to determine the optimum performance and package density based on the cost-effective model.

• The Journal of the Korea Contents Association
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• v.20 no.4
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• pp.230-243
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• 2020

The purpose of this study is to identify the effect of package tour motivation(harmony, amusement, and convenience) on satisfaction through its attitude and perceived value(emotional value and functional value). This study was conducted an empirical analysis of 297 people aged 19 years or older who experienced package tours. The results of the study are as follows. Firstly, all of the sub-factor like tourism motivation -amusement, convenience- had a positive influence on the attitude. but the harmony which is one of the sub-factor of tourism motivation did not have any influence on the attitude. Secondly, harmony, a sub-factor of tourism motivation, did not positively affect the perceived value sub-factor of emotional value. Thirdly, the character of attitude had a positive effect on satisfaction. Finally, both emotional and functional value factors, a sub-factor of perceived value, were found to have a positive effect on satisfaction. Through these research results, the competitiveness of package tours should be secured and expanded to research on efficient marketing strategies so that package tours can be activated.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.27 no.3
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• pp.52-58
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• 2004

This study investigated the influence of package design of female cosmetics on the purchasing preferences of view The subjects of this study were the consumers of female cosmetics from their twenties to the forties, and were 195 consumers who dropped into beauty counters to buy their cosmetics. With this study, it can be said that package design Is an effective factor on purchasing of female cosmetics. In general, most consumers prefer to practical and useful package design. But the younger consumers tend to be more influenced by luxury and expensive package design than an elderly consumers on purchasing cosmetics. And it made a little difference in purchasing preferences by academic background.

• Journal of Korean Society of Rural Planning
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• v.20 no.4
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• pp.157-164
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• 2014

This study clarified the correlation between the satisfaction of farm experience village visitors and the package design of farm specialty products and identified the factors to consider when improving the package design. It was found that the satisfaction with package design when purchasing farm specialty products affected the satisfaction of farm experience village visitors. In case of farm experience village visitors, they were more satisfied with the purchase when they were satisfied with the package design of farm specialty products they purchased. The results of analysis of correlation between the satisfaction of farm experience village visitors and the improvement of package design of farm specialty products showed that the important factors of package design are easiness of transport handling, easiness of storage, and functionality of packaging materials.

• Proceedings of the KSME Conference
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• 2000.11a
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• pp.607-611
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• 2000

Acoustic modal property of the vehicle passenger compartment is a very important factor which dominates vehicle interior noise in the low frequency range. In most real cars, trunk noise often transfers into the passenger compartment since the two cavities are acoustically coupled. This study identifies the major coupling path by examining the variation of the coupled acoustic modal frequencies and modes. An 1/2 size acryl compartment model is designed and manufactured for the measurement and analysis of coupled acoustic modes. Experimental result shows that package tray contributes to the coupling much more than the back seat and hole size of the package tray is an important design factor to control low frequency acoustic modes in the coupled system.

• Transactions of the Korean Society of Automotive Engineers
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• v.16 no.3
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• pp.15-22
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• 2008

Applications of bonded dissimilar materials such as integrated circuit(IC) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in bonded joints of dissimilar materials. In order to investigate the IC package crack propagating from the edge of die pad and resin, the fracture parameters of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method(BEM). From these results, crack propagation direction and path by thermal stress in the IC package were numerically simulated with boundary element method.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.6
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• pp.94-102
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• 2007

Applications of bonded dissimilar materials such as large scale integration (LSI) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in LSI. In order to investigate stress singularities on the bonded interface edges and delamination of die pad and resin in the IC package. In this paper, stress singularity factors(${\Gamma}_i$) and stress intensity factors($K_i$) considering thermal stress in the IC package were analyzed by using the 2-dimensional elastic boundary element method(BEM).