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Prediction of Crack Propagation Path Using Boundary Element Method in IC Packages  

Chung, Nam-Yong (Department of Mechanical Engineering, Soongsil University)
Publication Information
Transactions of the Korean Society of Automotive Engineers / v.16, no.3, 2008 , pp. 15-22 More about this Journal
Abstract
Applications of bonded dissimilar materials such as integrated circuit(IC) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in bonded joints of dissimilar materials. In order to investigate the IC package crack propagating from the edge of die pad and resin, the fracture parameters of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method(BEM). From these results, crack propagation direction and path by thermal stress in the IC package were numerically simulated with boundary element method.
Keywords
Integrated circuit pakage; Boundary element method; Thermal stress analysis; Stress singularity factor; Stress intensity factor; Crack propagation direction; Crack propagation path;
Citations & Related Records
Times Cited By KSCI : 4  (Citation Analysis)
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