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M. Sato, R. Ruuki, S. Yoshoka and A. Inoue, "Analyses of Delamination Arrest Effect of Dimples on Interface in LSI Package," Transaction of JSME, Vol.60, No.577, pp.1985-1991, 1994
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K. Y. Lee, H. S. Moon, T. S. Lee and K. S. Kim, "Plastic IC Package Cracking Analysis due to Thermal Stress," Transaction of KSME, Vol.19, No.12, pp.3197-3204, 1995
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P. Alpen and K. C. Lee, "A Simple Model for the Mode I Popcorn Effect for IC Packages," Microelectronics Reliability, Vol.40, pp.1503-1508, 2000
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N. Y. Chung and C. H. Song, "Prediction of Propagation Path on Mixed Mode Crack Using Boundary Element Method," Spring Conference Proceedings, Vol.II, KSAE, pp.387-393, 1994
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S. S. Park, L. O. Pahn and Y. Y. Earmme, "A Fracture Mechanics Approach on Delamination and Package Crack in Electronic Packaging (2)," Transaction of KSME, Vol.18, No.8, pp.2158-2166, 1994
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Y. Ju, M. Saka and H. Abe, "Detection of Delamination in IC Packages Using the Phase of Microwaves," International Journal of NDT & E, Vol.34, pp.49-56, 2001
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N. Y. Chung and B. T. Oh, "Evaluation Method of Bonded Strength Considering Stress Singularity in Adhesively Bonded Joints," Transaction of KSME, Vol.20, No.7, pp.2087-2096, 1996
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N. Y. Chung, "Evaluation Method of Interface Strength in Bonded Dissimilar Materials of Al/Epoxy," Transaction of KSME, Vol.26, No.11, pp.2277-2286, 2002
과학기술학회마을
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F. Edogan and G. C. Sih, "On the Crack Extension in Plastic under Plane Loading and Transverse Shear," Transaction of ASME, Vol.85, No.D, pp.519-528, 1963
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Y. Ju, M. Saka and H. Abe, "Nondestructive Inspection of Delamination in IC Package by High-Frequency Microwaves," International Journal of NDT & E, Vol.34, pp.213-217, 2001
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H. Miura, A. Nishimura, S. Kawai and G. Murakami, "Effect of Package Structures on the Residual Stress of Silicon Chips Encapsulated in IC Plastic Packages," Transaction of JSME, Vol.56, No.522, pp.175-181, 1990
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K. Y. Lee and J. H. Yang, "Viscoelastic Cracking Analysis of Plastic IC Package with Polyimide Coating Layer," Transaction of KSME, Vol.22, No.10, pp.1930-1937, 1998
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N. Y. Chung and C. H. Song, "Effects of Interface Cracks Emanating from a Circular Hole on Stress Intensity Factors in Bonded Dissimilar Materials," Int. J. Automotive Technology, Vol.6, No.3, pp.293-303, 2005
과학기술학회마을
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H. Miura, A. Nishimura, S. Kawai and K. Nishi, "Residual Stress in Resin-Molded IC Chips," Transaction of JSME, Vol.55, No.516, pp. 1763-1770, 1998
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N. Y. Chung and C. H. Song, "Prediction of Propagation Path for the Interface Crack in Bonded Dissimilar Materials," Transaction of KSAE, Vol.4, No.3, pp.112-121, 1996
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N. Y. Chung and C. H. Park, "Analysis of Residual Stress Singularities on Interfaces of Friction Welded SUH35/SUH3," Transactions of KSAE, Vol.13, No.5, pp.104-111, 2005
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