• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.11a
• /
• pp.113-114
• /
• 2008

Conventional furnace annealing (CFA) for activating Mg-doped p-type GaN films had been performed in pure $N_2$ ambient. All sample activated the same gas ambient. The annealing process change temperature: the first process is performed at $550^{\circ}C$ for 10 min. but, the first process is the same bulk. From second to five process increase activation temperature to change $50^{\circ}C$ and annealing time keeping for 10 min. It is found that the samples characteristic measure hall measurement. Similar results were also evidenced by photoluminescence (PL) measurement.

• Proceedings of the Korean Ceranic Society Conference
• /
• 1986.12a
• /
• pp.287-304
• /
• 1986

High quality monocrystalline $\beta$-SiC thin films were grown via two-step process of conversion of the Si(100) surface by reaction with $C_2H_4$ and the subsequent chemical vapor deposition (CVD) at $1360^{\circ}C$ and 1 atm total pressure. Four dopants, B and Al and p-type, and N and P for n-type, were also incorporated into monocrystalline $\beta$-SiC thin films during the CVD growth process. IR and Raman spectroscopies were used to evaluate the quality of the undoped $\beta$-SiC thin films and to investigate the effects of dopants on the structure of the doped $\beta$-SiC thin films. The changes in the shape of IR and Raman spectra of the doped thin films due to dopants were observed. But the XTEM micrographs except for the B-doped and annealed films showed the same density and distribution of stacking faults and dislocations as was seen in the undoped samples, The IR and Raman spectra of the B-doped and annealed films showed the broad and weak bands and one extra peak at the 850 $cm^{-1}$ respectively. The SAD pattern and XTEM micrograph of the B-doped and annealed film provided the evidence for twinning.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2005.11a
• /
• pp.55-56
• /
• 2005

The properties of phosphorus doped ZnO thin films deposited on (001) sapphire substrates by pulsed laser deposition (PLD) were investigated depending on various deposition conditions. The phosphorus (P) doped ZnO target was composed of ZnO + x wt% Al (x=1, 3, 5). The structural, electrical and optical properties of the ZnO thin films were measured by X-ray diffraction (XRD), Hall measurements and photoluminescence (PL). As the deposition temperature optimized, the electrical properties of the phosphorus doped ZnO (ZnO:P) layer showed a electron concentration of $7.76\times10^{16}/cm^3$, a mobility of 10.225 $cm^2/Vs$, a resistivity of 7.932 $\Omega$cm. It was observed the electrical property of the film was changed by dopant activation effect as target variations and deposition conditions.

• Journal of Sensor Science and Technology
• /
• v.15 no.2
• /
• pp.84-89
• /
• 2006

Highly concentrated p-type ZnO thin films can be obtained by doping of N, P and As elements. In this study, undoped ZnO buffer layers were prepared on a (0001) sapphire substrate by a ultra high vaccum pulsed laser deposition(UHV-PLD) method. ZnO buffer layers were deposited with various deposition temperature($400{\sim}700^{\circ}C$) at 350 mtorr of oxygen working pressure. Arsenic doped(1 wt%) ZnO thin films were deposited on the ZnO buffer layers by UHV-PLD. Crystallinity of the samples were evaluated by X-ray diffractometer and scanning electron microscopy. Optical, electrical properties of the ZnO thin films were estimated by photoluminescence(PL) and Hall measurements. The optimal condition of the undoped ZnO buffer layer for the deposition of As-doped ZnO thin films was at $600^{\circ}C$ of deposition temperature.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1997.04a
• /
• pp.66-69
• /
• 1997

The p-GaN fins doped with the impurity of Zn were grown on n-GaN films to prevent the defects from the lattice mismatch with sapphire substrates by HVPE. For growth of the high quality n-GaN, the optimized conditions were at first deduced from the results of various HCI gas flow rates and growth temperatures. On the basis of these conditions, p-GaN films were grown and investigated of the characteristics. The FWHM of the double crystal rocking curve of n-GaN was decreased and the hexagonal phases on the surface of GaN films were tend to be vivid with the inoement of HCI gas flow rates. Finally the n-type GaN films with FWHM of 648arcsec were obtained at 10cc/min of HCI gas. As the GaN films were grown with the above conditions, Zn was introduced in the form of vapor as a dopant for p-GaN films. But when Zn vaporized at 77$0^{\circ}C$ was doped to the films, the crystallites of Zn were distributed uniformly on the surface of the GaN film due to the over-doped.

• Journal of Sensor Science and Technology
• /
• v.28 no.5
• /
• pp.271-276
• /
• 2019

Pure and 0.5, 1, 2, 5, and 10 at% of Mo-doped $Co_3O_4$ yolk-shell spheres were synthesized by ultrasonic spray pyrolysis of droplets containing Co nitrate, ammonium molybdate, and sucrose and their gas sensing characteristics to 5 ppm trimethylamine (TMA), ethanol, p-xylene, toluene, ammonia, carbon monoxide, and benzene were measured at $225-325^{\circ}C$. The sensor using pure $Co_3O_4$ yolk-shell spheres showed the highest response to p-xylene and very low response to TMA at $250^{\circ}C$, while the doping of Mo into $Co_3O_4$ tended to increase the overall responses of gas sensors. In particular, the sensor using 5 at% Mo-doped $Co_3O_4$ yolk-shell spheres exhibited the high response to TMA with low cross-responses to other interfering gases. The high response and selectivity of Mo-doped $Co_3O_4$ yolk-shell spheres to TMA are attributed to the electronic sensitization by higher valent Mo doping and acid-base interaction between TMA and Mo components.

• Journal of the Korean Magnetics Society
• /
• v.8 no.6
• /
• pp.346-349
• /
• 1998

In order to reduce to the defect density in poly-Si/SiO$_2$ thin films, where poly-Si is either undoped or doped by BF$_2$ implantation, the poly-Si/SiO$_2$ samples have been hydrogenated by rf plasmas of low temperature. Before hydrogenation, both $P_b$ centers and E centers were observed in the poly-Si(undoped)/SiO$_2$ and in the poly-Si(doped)/SiO$_2$. After 30 min hydrogenation, the $P_b$ center was reduced by 80 % doped sample and by 76 % in the undoped sample and the E center was not observed. After 90min hydrogenation, however, increases of the $P_b$ centers and regenerations of the E center were observed in the undoped sample as well as in the doped one. Compared with the undoped sample, the increase of $P_b$ center in the doped one was more dominant.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.15 no.6
• /
• pp.260-262
• /
• 2005

Thickness optimization of heavily doped p-type seeding layer was studied to improve performance of thin film silicon solar cell. We used liquid phase epitaxy (LPE) to grow active layer of $25{\mu}m$ thickness on $p^+$ seeding layer. The cells with $p^+$ seeding layer of $10{\mu}m\;to\;50{\mu}m$ thickness were fabricated. The highest efficiency of a cell is 12.95%, with $V_{oc}=633mV,\;J_{sc}=26.5mA/cm^2$, FF = 77.15%. The $p^+$ seeding layer of the cell is $20{\mu}m$ thick. As thicker seeding layer than $20{\mu}m$, the performance of the cell was degraded. The results demonstrate that the part of the recombination current is due to the heavily doped seeding layer. Thickness of heavily doped p-type seeding layer was optimized to $20{\mu}m$. The performance of solar cell is expected to improve with the incorporation of light trapping as texturing and AR coating.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.19 no.7
• /
• pp.611-617
• /
• 2006

We report the preparation of N doped, p-type ZnO films by post-annealing in $NH_3$ ambient. The properties were examined by XRD, Hall-effect measurement, PL, and SIMS. ZnO films showed better crystallinity and electron concentration of $10^{15}-10^{17}/cm^3$ with post-annealing in $NH_3$ ambient. These films were converted to p-type ZnO by activation thermal annealing process at $800^{\circ}C$ under $N_2$ ambient. The electrical properties of the p-type ZnO showed a hole concentration of $1.06\times10^{16}/cm^3$, a mobility of $15.8cm^2/V{\cdot}s$, and a resistivity of $40.18\Omega{\cdot}cm$. The N doped ZnO films showed a strong photoluminescence peak at 3.306 eV at 13 K, which is closely related to neutral acceptor bound excitons of the p-type ZnO:N. In the SIMS spectra, the incorporation of nitrogen was confirmed.

• Korean Journal of Materials Research
• /
• v.15 no.5
• /
• pp.313-317
• /
• 2005

The relation between bulk microdefect (BMD) and mechanical strength of $P/P^-$ epitaxial silicon wafers (Epitaxial wafer) as a function of nitrogen concentrations was studied. After 2 step anneal$(800^{\circ}C/4hrs+1000^{\circ}C/16hrs)$, BMD was not observed in nitrogen undoped epitaxial silicon wafer while BMD existed and increased up to $3.83\times10^5\;ea/cm^2$ by addition of $1.04\times10^{14}\;atoms/cm^3$ nitrogen doping. The slip occurred for nitrogen undoped and low level nitrogen doped epitaxial wafers. However, there was no slip occurrence above $7.37\times10^{13}\;atoms/cm^3$ nitrogen doped epitaxial wafer. Mechanical strength was improved from 40 to 57 MPa as nitrogen concentrations were increased. Therefore, the nitrogen doping in silicon wafer plays an important role to improve BMD density, slip occurrence and mechanical strength of the epitaxial silicon wafers.