• Proceedings of the KWS Conference
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• 2006.10a
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• pp.187-189
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• 2006

최근 유연솔더에서 무연솔더로 전환함에 따라서 PCB의 도금이 솔더접합부의 각도에 미치는 영향이 중요하게 되었다. 현재 PCB 도금은 Sn, Au, OSP 등으로 다양하게 진행되고 있다. 그러나 PCB 도금이 솔더접합부의 강도에 미치는 영향에 대한 연구는 아직 미비하다. 따라서 본 연구에서는 PCB 도금(Sn, Au, OSP)이 무연솔더(Sn-3.0Ag-0.5Cu) 접합부의 초기 전단강도에 미치는 영향과 열사이클시험 후 솔더접합부의 전단강도에 미치는 영향에 대해서 연구하였다.

• Proceedings of the Korea Information Processing Society Conference
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• 2011.04a
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• pp.1449-1452
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• 2011

본 논문에서는 디지털 콘텐츠의 저작권 보호를 위해 인터넷상의 웹하드나 P2P와 같은 폐쇄형 OSP(Online Service Provider)에서 불법으로 유통되고 있는 콘텐츠를 자동으로 검색하고 다운로드 하는 방법을 제안한다. OSP의 웹 페이지를 파싱(Parsing)하여 태그(Tag)와 유일한(Unique)한 속성 정보를 이용하여 필요로 하는 콘텐츠의 게시 정보를 얻거나 액션을 취해 웹 페이지를 제어한다. 또한, IE(Internet Explorer) 이벤트(Event) 함수에 포함되는 URL 정보를 이용하여 각 제어 단계의 성공 여부를 판단한다. 윈도우 기반 어플리케이션은 해당 윈도우의 컨트롤ID 및 기타 윈도우 속성 정보를 이용하여 제어한다.

• Korean Journal of Materials Research
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• v.12 no.9
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• pp.750-760
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• 2002

In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.222-222
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• 2007

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.15-19
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• 2015

We demonstrated an inspection system for detecting discoloration of PCB Cu ball pad with an OSP surface finish. Though the OSP surface finish has many advantages such as eco-friendly and low cost, however, it often shows a discoloration phenomenon due to a heating process. In this study, the discoloration was analyzed with device-independent CIELAB color space. First of all, the PCB samples were inspected with standard lamps and CCD camera. The measured data was processed with Labview program for detecting discoloration of Cu ball pad. From the original PCB sample image, the localized Cu ball pad image was selected to reduce the image size by the binarization and edge detection processes and it was also converted to device-independent CIELAB color space using $3{\times}3$ conversion matrix. Both acquisition time and false acceptance rate were significantly reduced with this proposed inspection system. In addition, $L^*$ and $b^*$ values of CIELAB color space were suitable for inspection of discoloration of Cu ball pad.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.45-50
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• 2017

We investigated effect of Zn content on shear strengh of Sn-0.7Cu-xZn and OSP surface finished solder joints. Five pastes of Sn-0.7Cu-xZn (x=0, 0.5, 1.0, 1.5, 2.0 wt.%) solders were fabricated by mixing of solder powder and flux using planatary mixer. $180{\mu}m$ diameter solder balls were formed on OSP surface finished Cu electrodes by screen print method, and the reflow process was performed. The shear strength was evaluated with two high shear speeds; 0.01 and 0.1 m/s. The thickness of the intermetallic compound(IMC) layer was decreased with increasing Zn content in Sn-0.7Cu-xZn solder. The highest shear strength was 3.47 N at the Zn content of 0.5 wt.%. As a whole, the shear strength at condition of 0.1 m/s was higher than that of 0.01 m/s because of impact stress. Fracture energies were calculated by F-x (Force-displacement) curve during high speed shear test and the tendency of fracture energy and that of shear strength were good agreement each other. Fracture took place within solder matrix at lower Zn content, and fracture occured near the interface of OSP surface finished Cu electrode and solder at higher Zn content.

• Korean Journal of Metals and Materials
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• v.47 no.4
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• pp.261-266
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• 2009

The mechanical and electrical properties of ball grid array (BGA) solder joints were measured, consisting of Sn-3.5Ag, with organic solderability preservative (OSP)-finished Cu pads and Electroless Nickel/Immersion Gold (ENIG) surface finishes. The mechanical properties were measured by die shear test. When ENIG PCB was upper joint and OSP PCB was lower joint, the highest shear force showed at the third reflow. When OSP PCB was upper joint and ENIG PCB was lower joint, the highest shear force showed at the forth reflow. For both joints, after the die shear results reached the highest shear force, shear force decreased as a function of increasing reflow number. Electrical property of the solder joint decreased with the function of increasing reflow number. The scanning electron microscope results show that the IMC thickness at the bonding interface gets thicker while the number of reflow increases.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.81-88
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• 2010

Thermal annealing and electromigration test were performed at $150^{\circ}C$ and $4{\times}10^3\;A/cm^2$ conditions in order to investigate the effect of PCB surface finishs on the growth kinetics of intermetallic compound (IMC) in Sn-3.0Ag-0.5Cu solder bump. The surface finishes of the electrodes of printed circuit board (PCB) were organic solderability preservation (OSP), immersion Sn, and electroless Ni/immersion gold (ENIG). During thermal annealing, the OSP and immersion Sn show similar IMC growth velocity, while ENIG surface finish had much slower IMC growth velocity. Applying electric current accelerated IMC growth velocity and showed polarity effect due to directional electron flow.

• Physical Therapy Rehabilitation Science
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• v.8 no.3
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• pp.162-169
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• 2019

Objective: The purpose of this study was to investigate the conditions for the application of various plank exercises to people who require trunk stabilization by comparing trunk muscle activity according to the degree of hip abduction in the plank exercise. Design: Cross-sectional study. Methods: Twenty healthy participants voluntarily participated in this study and the plank exercise was performed under 5 conditions (two-legged support plank [TSP] with hip abduction, TSP with hip abduction of 15 degrees, TSP with hip abduction of 30, one-legged support plank [OSP] with hip abduction of 15 degrees, OSP with hip abduction of 30 degrees). In order to measure the trunk muscle activity according to the 5 conditions, surface electromyography was used. The electrical activities of the rectus abdominis (RA), external oblique (EO), and internal oblique (IO) muscles were measured during the 5 plank exercises. Subjects practiced each of the 5 conditions three times in random order and the average values were obtained. Results: In the OSP condition with 15/30 degrees of hip abduction, activities of the RA, EO, and IO were significantly greater than during the TSP (p<0.05). In the OSP with 30 degrees of hip abduction condition, activities of the left EO, IO were significantly greater than other plank exercise conditions (p<0.05). Conclusions: The plank exercise with hip abduction of 30 degrees and the OSP exercise can be suggested as an effective method to enhance the activity of the trunk oblique muscles.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.95-103
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• 2021

Sn-58Bi-xRu composite solders were prepared by adding Ru nanoparticles to Sn-58Bi, a typical low-temperature solder, and the interfacial reaction and solder joint reliability were analyzed by reacting with Cu/OSP and ENIG surface treated PCB boards. The Cu₆Sn₅ IMC formed by the reaction with Cu/OSP had little change in thickness depending on the Ru content, and ductile fracture occurred inside the solder during the high-speed shear test without any significant change even after 100 hr aging. In reaction with ENIG, the Ni₃Sn₄ IMC thickness tended to decrease as the Ru content increased, and ENIG-specific brittle fracture was found in some specimens. Since Ru element is not found near the interface, it is judged not to be significantly involved in the interfacial reaction, and it is analyzed that it mainly exists together with the Bi phase.